TSUNG JEN LIAO

Person

HSINCHU, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Illumination system, projection device, and projection control method
- Patent number 11,991,482
- Issue date May 21, 2024
- Coretronic Corporation
- Chi-Fu Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Illumination system and projection apparatus
- Patent number 11,947,251
- Issue date Apr 2, 2024
- Coretronic Corporation
- Chi-Fu Liu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Projection device and brightness control method thereof
- Patent number 11,917,340
- Issue date Feb 27, 2024
- Coretronic Corporation
- Chi-Fu Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Projection lens module and projector
- Patent number 11,340,517
- Issue date May 24, 2022
- Coretronic Corporation
- Kuang-Hsiang Chang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Carrier tape system and methods of using carrier tape system
- Patent number 11,164,763
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tape system and methods of using carrier tape system
- Patent number 11,164,764
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip holder
- Patent number 10,879,098
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Projector, optical engine, and pixel offset device
- Patent number 10,739,667
- Issue date Aug 11, 2020
- Coretronic Corporation
- Wei-Hao Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Carrier tape system and methods of using carrier tape system
- Patent number 10,679,877
- Issue date Jun 9, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Projection apparatus
- Patent number 10,216,073
- Issue date Feb 26, 2019
- Coretronic Corporation
- Tsung-Hsin Liao
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor structure and method of manufacturing the same
- Patent number 9,576,820
- Issue date Feb 21, 2017
- ChipMOS Technologies Inc.
- Tsung Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 9,437,542
- Issue date Sep 6, 2016
- ChipMOS Technologies Inc.
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 9,269,643
- Issue date Feb 23, 2016
- ChipMOS Technologies Inc.
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 9,196,553
- Issue date Nov 24, 2015
- ChipMOS Technologies Inc.
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for micro bump structure
- Patent number 9,190,324
- Issue date Nov 17, 2015
- ChipMOS Technologies Inc.
- Tsung Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 9,123,684
- Issue date Sep 1, 2015
- ChipMOS Technologies Inc.
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wafer level packaging and a package structure thereof
- Patent number 9,087,912
- Issue date Jul 21, 2015
- ChipMOS Technologies Inc.
- Tsung Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and multi-chip stack package
- Patent number 9,018,772
- Issue date Apr 28, 2015
- ChipMOS Technologies Inc.
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of wafer level package
- Patent number 8,980,695
- Issue date Mar 17, 2015
- ChipMOS Technologies Inc.
- Tsung Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package structure
- Patent number 8,836,144
- Issue date Sep 16, 2014
- ChipMOS Technologies Inc.
- Tsung Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FILTER ELEMENT AND PROJECTION DEVICE
- Publication number 20230276031
- Publication date Aug 31, 2023
- CORETRONIC CORPORATION
- Chi-Fu Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ILLUMINATION SYSTEM, PROJECTION DEVICE, AND PROJECTION CONTROL METHOD
- Publication number 20230134505
- Publication date May 4, 2023
- CORETRONIC CORPORATION
- Chi-Fu Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PROJECTION DEVICE AND BRIGHTNESS CONTROL METHOD THEREOF
- Publication number 20220337793
- Publication date Oct 20, 2022
- CORETRONIC CORPORATION
- Chi-Fu Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ILLUMINATION SYSTEM AND PROJECTION APPARATUS
- Publication number 20220308436
- Publication date Sep 29, 2022
- CORETRONIC CORPORATION
- Chi-Fu Liu
- G02 - OPTICS
Information Patent Application
PROJECTION DEVICE
- Publication number 20210208493
- Publication date Jul 8, 2021
- CORETRONIC CORPORATION
- Wen-Chieh Chung
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PROJECTION LENS MODULE AND PROJECTOR
- Publication number 20210199932
- Publication date Jul 1, 2021
- CORETRONIC CORPORATION
- Kuang-Hsiang Chang
- G02 - OPTICS
Information Patent Application
CARRIER TAPE SYSTEM AND METHODS OF USING CARRIER TAPE SYSTEM
- Publication number 20200266083
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Jen LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER TAPE SYSTEM AND METHODS OF USING CARRIER TAPE SYSTEM
- Publication number 20200266082
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Jen LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HOLDER
- Publication number 20200090970
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER TAPE SYSTEM AND METHODS OF USING CARRIER TAPE SYSTEM
- Publication number 20200006098
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Jen LIAO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PROJECTOR, OPTICAL ENGINE, AND PIXEL OFFSET DEVICE
- Publication number 20190235364
- Publication date Aug 1, 2019
- CORETRONIC CORPORATION
- Wei-Hao Chen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PROJECTION APPARATUS
- Publication number 20180292737
- Publication date Oct 11, 2018
- CORETRONIC CORPORATION
- Tsung-Hsin Liao
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20160111364
- Publication date Apr 21, 2016
- CHIPMOS TECHNOLOGIES INC.
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20150171013
- Publication date Jun 18, 2015
- CHIPMOS TECHNOLOGIES INC.
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150162260
- Publication date Jun 11, 2015
- CHIPMOS TECHNOLOGIES INC.
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150130084
- Publication date May 14, 2015
- CHIPMOS TECHNOLOGIES INC.
- TSUNG JEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20150123252
- Publication date May 7, 2015
- CHIPMOS TECHNOLOGIES INC.
- TSUNG JEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR WAFER LEVEL PACKAGING AND A PACKAGE STRUCTURE THEREOF
- Publication number 20150061121
- Publication date Mar 5, 2015
- CHIPMOS TECHNOLOGIES INC.
- TSUNG JEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL PLANTING DEVICE AND BALL PLANTING METHOD THEREOF
- Publication number 20150053752
- Publication date Feb 26, 2015
- CHIPMOS TECHNOLOGIES INC.
- TSUNG JEN LIAO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF WAFER LEVEL PACKAGE
- Publication number 20140315355
- Publication date Oct 23, 2014
- TSUNG JEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND MULTI-CHIP STACK PACKAGE
- Publication number 20140159253
- Publication date Jun 12, 2014
- CHIPMOS TECHNOLOGIES INC.
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE
- Publication number 20140061880
- Publication date Mar 6, 2014
- TSUNG JEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140061899
- Publication date Mar 6, 2014
- CHIPMOS TECHNOLOGIES INC.
- TSUNG JEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20140061906
- Publication date Mar 6, 2014
- CHIPMOS TECHNOLOGIES INC.
- TSUNG JEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140061904
- Publication date Mar 6, 2014
- CHIPMOS TECHNOLOGIES INC.
- TSUNG JEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR MICRO BUMP STRUCTURE
- Publication number 20140065814
- Publication date Mar 6, 2014
- CHIPMOS TECHNOLOGIES INC.
- TSUNG JEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20130049197
- Publication date Feb 28, 2013
- CHIPMOS TECHNOLOGIES INC.
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20130049198
- Publication date Feb 28, 2013
- CHIPMOS TECHNOLOGIES INC.
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS

TSUNG JEN LIAO

Person

Patents Grantslast 30 patents

Illumination system, projection device, and projection control method

Illumination system and projection apparatus

Projection device and brightness control method thereof

Projection lens module and projector

Carrier tape system and methods of using carrier tape system

Carrier tape system and methods of using carrier tape system

Semiconductor chip holder

Projector, optical engine, and pixel offset device

Carrier tape system and methods of using carrier tape system

Projection apparatus

Semiconductor structure and method of manufacturing the same

Chip package structure

Chip package structure

Semiconductor package structure and manufacturing method thereof

Manufacturing method for micro bump structure

Chip package structure and manufacturing method thereof

Method for wafer level packaging and a package structure thereof

Chip structure and multi-chip stack package

Manufacturing method of wafer level package

Wafer level package structure

Patents Applicationslast 30 patents

FILTER ELEMENT AND PROJECTION DEVICE

ILLUMINATION SYSTEM, PROJECTION DEVICE, AND PROJECTION CONTROL METHOD

PROJECTION DEVICE AND BRIGHTNESS CONTROL METHOD THEREOF

ILLUMINATION SYSTEM AND PROJECTION APPARATUS

PROJECTION DEVICE

PROJECTION LENS MODULE AND PROJECTOR

CARRIER TAPE SYSTEM AND METHODS OF USING CARRIER TAPE SYSTEM

CARRIER TAPE SYSTEM AND METHODS OF USING CARRIER TAPE SYSTEM

SEMICONDUCTOR CHIP HOLDER

CARRIER TAPE SYSTEM AND METHODS OF USING CARRIER TAPE SYSTEM

PROJECTOR, OPTICAL ENGINE, AND PIXEL OFFSET DEVICE

PROJECTION APPARATUS

CHIP PACKAGE STRUCTURE

CHIP PACKAGE STRUCTURE

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

LEAD FRAME PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR WAFER LEVEL PACKAGING AND A PACKAGE STRUCTURE THEREOF

BALL PLANTING DEVICE AND BALL PLANTING METHOD THEREOF

MANUFACTURING METHOD OF WAFER LEVEL PACKAGE

CHIP STRUCTURE AND MULTI-CHIP STACK PACKAGE

WAFER LEVEL CHIP SCALE PACKAGE

WAFER LEVEL PACKAGE STRUCTURE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD FOR MICRO BUMP STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF