Tsung Lung YANG

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Reducing line bending during metal fill process
- Patent number 12,173,399
- Issue date Dec 24, 2024
- Lam Research Corporation
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High step coverage tungsten deposition
- Patent number 12,002,679
- Issue date Jun 4, 2024
- Lam Research Corporation
- Michael Bowes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void free low stress fill
- Patent number 11,978,666
- Issue date May 7, 2024
- Lam Research Corporation
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for processing a substrate by oscillating a boundary layer o...
- Patent number 11,761,080
- Issue date Sep 19, 2023
- Applied Materials, Inc.
- Tsung-Han Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten feature fill with nucleation inhibition
- Patent number 11,437,269
- Issue date Sep 6, 2022
- Novellus Systems, Inc.
- Tsung-Han Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten feature fill with nucleation inhibition
- Patent number 10,381,266
- Issue date Aug 13, 2019
- Novellus Systems, Inc.
- Tsung-Han Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chamber conditioning for remote plasma process
- Patent number 10,211,099
- Issue date Feb 19, 2019
- Lam Research Corporation
- Deqi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Microphone device
- Patent number 9,967,662
- Issue date May 8, 2018
- Fortemedia, Inc.
- Tsung Lung Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Methods of forming tensile tungsten films and compressive tungsten...
- Patent number 9,034,760
- Issue date May 19, 2015
- Novellus Systems, Inc.
- Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of improving tungsten contact resistance in small critical...
- Patent number 8,975,184
- Issue date Mar 10, 2015
- Novellus Systems, Inc.
- Feng Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
REDUCING LINE BENDING DURING METAL FILL PROCESS
- Publication number 20250066907
- Publication date Feb 27, 2025
- LAM RESEARCH CORPORATION
- Anand CHANDRASHEKAR
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HYDROGEN PLASMA TREATMENT FOR FORMING LOGIC DEVICES
- Publication number 20240304495
- Publication date Sep 12, 2024
- Applied Materials, Inc.
- Tsung-Han Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW RESISTIVITY GAPFILL FOR LOGIC DEVICES
- Publication number 20240240314
- Publication date Jul 18, 2024
- Applied Materials, Inc.
- Zhen Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VOID FREE LOW STRESS FILL
- Publication number 20240234208
- Publication date Jul 11, 2024
- LAM RESEARCH CORPORATION
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW RESISTIVITY GAPFILL
- Publication number 20240175120
- Publication date May 30, 2024
- Applied Materials, Inc.
- Tsung-Han Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF REMOVING METAL OXIDE USING CLEANING PLASMA
- Publication number 20240167148
- Publication date May 23, 2024
- Applied Materials, Inc.
- Tsung-Han Yang
- B08 - CLEANING
Information Patent Application
INTEGRATED PVD TUNGSTEN LINER AND SEAMLESS CVD TUNGSTEN FILL
- Publication number 20240087955
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Yi XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN GAP FILL WITH HYDROGEN PLASMA TREATMENT
- Publication number 20240047267
- Publication date Feb 8, 2024
- Tsung-Han YANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
NITROGEN PLASMA TREATMENT FOR BOTTOM-UP GROWTH
- Publication number 20240014072
- Publication date Jan 11, 2024
- Applied Materials, Inc.
- Tsung-Han YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ENHANCED TUNGSTEN NUCLEATION FOR LOW RESISTIVITY
- Publication number 20240006236
- Publication date Jan 4, 2024
- Applied Materials, Inc.
- Tsung-Han YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENT OF TUNGSTEN SURFACE FOR TUNGSTEN GAP-FILL
- Publication number 20230420295
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Tsung-Han YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADIENT OXIDATION AND ETCH FOR PVD METAL AS BOTTOM LINER IN BOTTOM...
- Publication number 20230343643
- Publication date Oct 26, 2023
- Applied Materials, Inc.
- Chih-Hsun HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL PRESSURE OXIDATION METHOD FOR FORMING AN OXIDE LAYER IN A FEATURE
- Publication number 20230207291
- Publication date Jun 29, 2023
- Applied Materials, Inc.
- Christopher S. OLSEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE OXIDATION ON RAPID THERMAL PROCESSING (RTP) CHAMBER WITH...
- Publication number 20220415676
- Publication date Dec 29, 2022
- Chaitanya Anjaneyalu PRASAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE REACTIVE INHIBITION GAS
- Publication number 20220415711
- Publication date Dec 29, 2022
- LAM RESEARCH CORPORATION
- Gang LIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION
- Publication number 20220359280
- Publication date Nov 10, 2022
- Novellus Systems, Inc.
- Tsung-Han YANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REDUCING LINE BENDING DURING METAL FILL PROCESS
- Publication number 20220349048
- Publication date Nov 3, 2022
- LAM RESEARCH CORPORATION
- Anand CHANDRASHEKAR
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
OSCILLATING FLOW BOUNDARY LAYERS IN APPARATUS, METHODS, AND SYSTEMS...
- Publication number 20220213595
- Publication date Jul 7, 2022
- Applied Materials, Inc.
- Tsung-Han YANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH STEP COVERAGE TUNGSTEN DEPOSITION
- Publication number 20220181158
- Publication date Jun 9, 2022
- LAM RESEARCH CORPORATION
- Michael Bowes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN FEATURE FILL WITH INHIBITION CONTROL
- Publication number 20220172987
- Publication date Jun 2, 2022
- LAM RESEARCH CORPORATION
- Tsung-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOID FREE LOW STRESS FILL
- Publication number 20220020641
- Publication date Jan 20, 2022
- LAM RESEARCH CORPORATION
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION
- Publication number 20190326168
- Publication date Oct 24, 2019
- Novellus Systems, Inc.
- Tsung-Han Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHAMBER CONDITIONING FOR REMOTE PLASMA PROCESS
- Publication number 20180174901
- Publication date Jun 21, 2018
- LAM RESEARCH CORPORATION
- Deqi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICROPHONE DEVICE
- Publication number 20180077489
- Publication date Mar 15, 2018
- Fortemedia, Inc.
- Tsung Lung YANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION
- Publication number 20170365513
- Publication date Dec 21, 2017
- LAM RESEARCH CORPORATION
- Tsung-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF IMPROVING TUNGSTEN CONTACT RESISTANCE IN SMALL CRITICAL...
- Publication number 20140030889
- Publication date Jan 30, 2014
- Feng Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING TENSILE TUNGSTEN FILMS AND COMPRESSIVE TUNGSTEN...
- Publication number 20140011358
- Publication date Jan 9, 2014
- Feng Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Tsung Lung YANG

Person

Patents Grantslast 30 patents

Reducing line bending during metal fill process

High step coverage tungsten deposition

Void free low stress fill

Method for processing a substrate by oscillating a boundary layer o...

Tungsten feature fill with nucleation inhibition

Tungsten feature fill with nucleation inhibition

Chamber conditioning for remote plasma process

Microphone device

Methods of forming tensile tungsten films and compressive tungsten...

Methods of improving tungsten contact resistance in small critical...

Patents Applicationslast 30 patents

REDUCING LINE BENDING DURING METAL FILL PROCESS

HYDROGEN PLASMA TREATMENT FOR FORMING LOGIC DEVICES

LOW RESISTIVITY GAPFILL FOR LOGIC DEVICES

VOID FREE LOW STRESS FILL

LOW RESISTIVITY GAPFILL

METHODS OF REMOVING METAL OXIDE USING CLEANING PLASMA

INTEGRATED PVD TUNGSTEN LINER AND SEAMLESS CVD TUNGSTEN FILL

TUNGSTEN GAP FILL WITH HYDROGEN PLASMA TREATMENT

NITROGEN PLASMA TREATMENT FOR BOTTOM-UP GROWTH

PLASMA ENHANCED TUNGSTEN NUCLEATION FOR LOW RESISTIVITY

TREATMENT OF TUNGSTEN SURFACE FOR TUNGSTEN GAP-FILL

GRADIENT OXIDATION AND ETCH FOR PVD METAL AS BOTTOM LINER IN BOTTOM...

DUAL PRESSURE OXIDATION METHOD FOR FORMING AN OXIDE LAYER IN A FEATURE

SELECTIVE OXIDATION ON RAPID THERMAL PROCESSING (RTP) CHAMBER WITH...

BACKSIDE REACTIVE INHIBITION GAS

TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION

REDUCING LINE BENDING DURING METAL FILL PROCESS

OSCILLATING FLOW BOUNDARY LAYERS IN APPARATUS, METHODS, AND SYSTEMS...

HIGH STEP COVERAGE TUNGSTEN DEPOSITION

TUNGSTEN FEATURE FILL WITH INHIBITION CONTROL

VOID FREE LOW STRESS FILL

TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION

CHAMBER CONDITIONING FOR REMOTE PLASMA PROCESS

MICROPHONE DEVICE

TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION

METHODS OF IMPROVING TUNGSTEN CONTACT RESISTANCE IN SMALL CRITICAL...

METHODS OF FORMING TENSILE TUNGSTEN FILMS AND COMPRESSIVE TUNGSTEN...