Tung-Han Chuang

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Nano-twinned structure on metallic thin film surface and method for...
- Patent number 12,191,274
- Issue date Jan 7, 2025
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 12,148,725
- Issue date Nov 19, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 11,837,568
- Issue date Dec 5, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-based alloy wire and methods for manufaturing the same
- Patent number 9,997,488
- Issue date Jun 12, 2018
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stud bump structure and method for manufacturing the same
- Patent number 9,490,147
- Issue date Nov 8, 2016
- Wire Technology Co., Ltd.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stud bump and package structure thereof and method of manufacturing...
- Patent number 9,425,168
- Issue date Aug 23, 2016
- Wire Technology Co., Ltd.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Color tactile vision system
- Patent number 9,368,046
- Issue date Jun 14, 2016
- Macronix International Co., Ltd.
- Yi-Chou Chen
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Multi-layer thermoelectric module and method for fabricating the same
- Patent number 9,048,388
- Issue date Jun 2, 2015
- China Steel Corporation
- Jing-Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alloy wire and methods for manufacturing the same
- Patent number 8,940,403
- Issue date Jan 27, 2015
- Wire Technology Co., Ltd.
- Jun-Der Lee
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Dual-phase intermetallic interconnection structure and method of fa...
- Patent number 8,742,600
- Issue date Jun 3, 2014
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor removal process
- Patent number 8,288,280
- Issue date Oct 16, 2012
- Macronix International Co., Ltd.
- Yung-Tai Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus for making radially arranged aluminum foil-fi...
- Patent number 6,210,521
- Issue date Apr 3, 2001
- National Science Council
- Tung-Han Chuang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Process for manufacturing an electromagnetic interference shielding...
- Patent number 6,207,089
- Issue date Mar 27, 2001
- National Science Council
- Tung-Han Chuang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Process for manufacturing an electromagnetic interference shielding...
- Patent number 6,202,276
- Issue date Mar 20, 2001
- Tung-Han Chuang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Superplastic alloy-containing conductive plastic article for shield...
- Patent number 6,182,486
- Issue date Feb 6, 2001
- National Science Council
- Tung-Han Chuang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Process for making metallized plastic molding pellets for shielding...
- Patent number 5,531,851
- Issue date Jul 2, 1996
- Ching-Bin Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
MAGNETIC COMPONENT AND METHOD OF MANUFACTURING MAGNETIC COMPONENT
- Publication number 20240105379
- Publication date Mar 28, 2024
- CYNTEC CO., LTD.
- Min-Feng Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANO-TWINNED STRUCTURE ON METALLIC THIN FILM SURFACE AND METHOD FOR...
- Publication number 20230090030
- Publication date Mar 23, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC NANO-TWINNED THIN FILM STRUCTURE AND METHOD FOR FORMING TH...
- Publication number 20230057312
- Publication date Feb 23, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- B82 - NANO-TECHNOLOGY
Information Patent Application
BONDING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20230027664
- Publication date Jan 26, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING BONDING STRUCTURES
- Publication number 20220388092
- Publication date Dec 8, 2022
- National Taiwan University
- Tung-Han CHUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20220344298
- Publication date Oct 27, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING STRUCTURES AND METHOD FOR FORMING THE SAME
- Publication number 20220336407
- Publication date Oct 20, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUD BUMP AND PACKAGE STRUCTURE THEREOF AND METHOD OF MANUFACTURING...
- Publication number 20150194409
- Publication date Jul 9, 2015
- WIRE TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER THERMOELECTRIC MODULE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140305483
- Publication date Oct 16, 2014
- Jing-Yi HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-BASED ALLOY WIRE AND METHODS FOR MANUFATURING THE SAME
- Publication number 20140209215
- Publication date Jul 31, 2014
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING METHOD AND DIE BONDING STRUCTURE OF LIGHT EMITTING DIOD...
- Publication number 20140175495
- Publication date Jun 26, 2014
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUD BUMP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140124920
- Publication date May 8, 2014
- WIRE TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-PHASE INTERMETALLIC INTERCONNECTION STRUCTURE AND METHOD OF FA...
- Publication number 20140097534
- Publication date Apr 10, 2014
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE SOLDER
- Publication number 20130323530
- Publication date Dec 5, 2013
- National Yunlin University of Science and Technology
- Shih-Ying CHANG
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITE WIRE OF SILVER-GOLD-PALLADIUM ALLOY COATED WITH METAL TH...
- Publication number 20130233594
- Publication date Sep 12, 2013
- WIRE TECHNOLOGY CO., LTD.
- Jun-Der LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE WIRE OF SILVER-PALLADIUM ALLOY COATED WITH METALLIC THIN...
- Publication number 20130233593
- Publication date Sep 12, 2013
- WIRE TECHNOLOGY CO., LTD.
- Jun-Der LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY WIRE AND METHODS FOR MANUFACTURING THE SAME
- Publication number 20130171470
- Publication date Jul 4, 2013
- Jun-Der LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
SOLID-LIQUID INTERDIFFUSION BONDING STRUCTURE OF THERMOELECTRIC MOD...
- Publication number 20130152990
- Publication date Jun 20, 2013
- Hong-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUATERNARY GALLIUM TELLURIUM ANTIMONY (M-GaTeSb) BASED PHASE CHANGE...
- Publication number 20120181499
- Publication date Jul 19, 2012
- Macronix International Co., Ltd.
- Tung-Hua Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Color Tactile Vision System
- Publication number 20120016472
- Publication date Jan 19, 2012
- Macronix International Co., Ltd.
- Yi-Chou Chen
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
CONDUCTOR REMOVAL PROCESS
- Publication number 20090023289
- Publication date Jan 22, 2009
- Macronix International Co., Ltd.
- Yung-Tai Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sink and heat spreader bonding structure
- Publication number 20060021734
- Publication date Feb 2, 2006
- Shih-Ying Chang
- H01 - BASIC ELECTRIC ELEMENTS

Tung-Han Chuang

Person

Patents Grantslast 30 patents

Nano-twinned structure on metallic thin film surface and method for...

Bonding structures and methods for forming the same

Bonding structures and methods for forming the same

Copper-based alloy wire and methods for manufaturing the same

Stud bump structure and method for manufacturing the same

Stud bump and package structure thereof and method of manufacturing...

Color tactile vision system

Multi-layer thermoelectric module and method for fabricating the same

Alloy wire and methods for manufacturing the same

Dual-phase intermetallic interconnection structure and method of fa...

Conductor removal process

Process and apparatus for making radially arranged aluminum foil-fi...

Process for manufacturing an electromagnetic interference shielding...

Process for manufacturing an electromagnetic interference shielding...

Superplastic alloy-containing conductive plastic article for shield...

Process for making metallized plastic molding pellets for shielding...

Patents Applicationslast 30 patents

MAGNETIC COMPONENT AND METHOD OF MANUFACTURING MAGNETIC COMPONENT

NANO-TWINNED STRUCTURE ON METALLIC THIN FILM SURFACE AND METHOD FOR...

METALLIC NANO-TWINNED THIN FILM STRUCTURE AND METHOD FOR FORMING TH...

BONDING STRUCTURES AND METHODS FOR FORMING THE SAME

METHODS FOR FORMING BONDING STRUCTURES

BONDING STRUCTURES AND METHODS FOR FORMING THE SAME

DIE BONDING STRUCTURES AND METHOD FOR FORMING THE SAME

STUD BUMP AND PACKAGE STRUCTURE THEREOF AND METHOD OF MANUFACTURING...

MULTI-LAYER THERMOELECTRIC MODULE AND METHOD FOR FABRICATING THE SAME

COPPER-BASED ALLOY WIRE AND METHODS FOR MANUFATURING THE SAME

DIE BONDING METHOD AND DIE BONDING STRUCTURE OF LIGHT EMITTING DIOD...

STUD BUMP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

DUAL-PHASE INTERMETALLIC INTERCONNECTION STRUCTURE AND METHOD OF FA...

ACTIVE SOLDER

COMPOSITE WIRE OF SILVER-GOLD-PALLADIUM ALLOY COATED WITH METAL TH...

COMPOSITE WIRE OF SILVER-PALLADIUM ALLOY COATED WITH METALLIC THIN...

ALLOY WIRE AND METHODS FOR MANUFACTURING THE SAME

SOLID-LIQUID INTERDIFFUSION BONDING STRUCTURE OF THERMOELECTRIC MOD...

QUATERNARY GALLIUM TELLURIUM ANTIMONY (M-GaTeSb) BASED PHASE CHANGE...

Color Tactile Vision System

CONDUCTOR REMOVAL PROCESS

Heat sink and heat spreader bonding structure