TUNG-LIANG SHAO

Person

HSINCHU, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 12,125,794
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor component with a cooling structure
- Patent number 12,027,446
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, stacked semiconductor device and manufacturin...
- Patent number 12,002,761
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device including liquid-cooled lid and metho...
- Patent number 11,996,351
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Tsung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices and methods of forming the same
- Patent number 11,996,383
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including thermal interface structures and me...
- Patent number 11,955,405
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method of package components and bonding apparatus
- Patent number 11,955,378
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,901,263
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 11,837,562
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,631,629
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor package with composite thermal inte...
- Patent number 11,569,147
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with cooling structure
- Patent number 11,515,233
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,469,200
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, stacked semiconductor device and manufacturin...
- Patent number 11,456,256
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method of package components and bonding apparatus
- Patent number 11,443,981
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device including liquid-cooled lid and metho...
- Patent number 11,410,910
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Tsung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,387,164
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,342,242
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding with pre-deoxide process and apparatus for performing the same
- Patent number 11,342,302
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices and methods of forming the same
- Patent number 11,315,900
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with composite thermal interface material str...
- Patent number 11,107,747
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 11,101,195
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 11,056,459
- Issue date Jul 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hang Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and fabricating method thereof
- Patent number 10,985,121
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with solder regions aligned to recesses
- Patent number 10,879,198
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure along with multiple chips bonded through mi...
- Patent number 10,854,580
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Heng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,854,564
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow metal pillar packaging scheme
- Patent number 10,825,804
- Issue date Nov 3, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices and methods of forming the same
- Patent number 10,734,348
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including plurality of chips along with air...
- Patent number 10,468,385
- Issue date Nov 5, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Heng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PHOTONIC DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240329336
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- G02 - OPTICS
Information Patent Application
APPARATUS INCLUDING COOLING STRUCTURE
- Publication number 20240312872
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Coupling Adapter for Fiber-To-Chip Integration
- Publication number 20240272389
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- G02 - OPTICS
Information Patent Application
Packaged Semiconductor Device Including Liquid-Cooled Lid and Metho...
- Publication number 20240249999
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Tsung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Heat Dissipation Structure and Method for Forming the...
- Publication number 20240145342
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240136251
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Water Cooling System for Semiconductor Package
- Publication number 20240105550
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adaptive Interconnect Structure for Semiconductor Package
- Publication number 20240071965
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Improved Heat Dissipation Efficiency and Method for Fo...
- Publication number 20240063079
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BUMP OF A SEMICONDUCTOR DEVICE AND FABRICATING METHOD TH...
- Publication number 20240055377
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHANG-PIN HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling Cover and Packaged Semiconductor Device Including the Same
- Publication number 20230420337
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20230314702
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230223318
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230207473
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat-Dissipating Structures for Semiconductor Devices and Methods o...
- Publication number 20230187307
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR COMPONENT WITH A COOLING STRUCTURE
- Publication number 20230076466
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING THERMAL INTERFACE STRUCTURES AND ME...
- Publication number 20230007912
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen Yu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, STACKED SEMICONDUCTOR DEVICE AND MANUFACTURIN...
- Publication number 20220384352
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD OF PACKAGE COMPONENTS AND BONDING APPARATUS
- Publication number 20220367255
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Device Including Liquid-Cooled Lid and Metho...
- Publication number 20220310482
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Tsung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding with Pre-Deoxide Process and Apparatus for Performing the Same
- Publication number 20220285310
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220262705
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Semiconductor Devices and Methods of Forming The Same
- Publication number 20220246574
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Device Including Liquid-Cooled Lid and Metho...
- Publication number 20220037231
- Publication date Feb 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Tsung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR PACKAGE WITH COMPOSITE THERMAL INTE...
- Publication number 20210384103
- Publication date Dec 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTR DEVICE, STACKED SEMICONDUCTOR DEVICE AND MANUFACTURING...
- Publication number 20210375766
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hang TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20210375724
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH REDISTRIBUTION LAYER HAVING BONDING POR...
- Publication number 20210335750
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
- Publication number 20210225788
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHANG-PIN HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT WITH COOLING STRUCTURE
- Publication number 20210098336
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS

TUNG-LIANG SHAO

Person

Patents Grantslast 30 patents

Semiconductor device and manufacturing method of semiconductor device

Method for forming a semiconductor component with a cooling structure

Semiconductor device, stacked semiconductor device and manufacturin...

Packaged semiconductor device including liquid-cooled lid and metho...

Bonded semiconductor devices and methods of forming the same

Semiconductor package including thermal interface structures and me...

Bonding method of package components and bonding apparatus

Semiconductor device and manufacturing method thereof

Conductive bump of a semiconductor device and fabricating method th...

Semiconductor device and manufacturing method thereof

Method of forming semiconductor package with composite thermal inte...

Semiconductor component with cooling structure

Semiconductor device and manufacturing method thereof

Semiconductor device, stacked semiconductor device and manufacturin...

Bonding method of package components and bonding apparatus

Packaged semiconductor device including liquid-cooled lid and metho...

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Bonding with pre-deoxide process and apparatus for performing the same

Bonded semiconductor devices and methods of forming the same

Semiconductor package with composite thermal interface material str...

Package structure and method for forming the same

Chip package structure and method for forming the same

Bump structure and fabricating method thereof

Package with solder regions aligned to recesses

Semiconductor structure along with multiple chips bonded through mi...

Semiconductor device and manufacturing method thereof

Hollow metal pillar packaging scheme

Bonded semiconductor devices and methods of forming the same

Semiconductor structure including plurality of chips along with air...

Patents Applicationslast 30 patents

PHOTONIC DEVICE AND METHOD OF MANUFACTURE

APPARATUS INCLUDING COOLING STRUCTURE

Optical Coupling Adapter for Fiber-To-Chip Integration

Packaged Semiconductor Device Including Liquid-Cooled Lid and Metho...

Package with Heat Dissipation Structure and Method for Forming the...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Water Cooling System for Semiconductor Package

Adaptive Interconnect Structure for Semiconductor Package

Package with Improved Heat Dissipation Efficiency and Method for Fo...

CONDUCTIVE BUMP OF A SEMICONDUCTOR DEVICE AND FABRICATING METHOD TH...

Cooling Cover and Packaged Semiconductor Device Including the Same

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Heat-Dissipating Structures for Semiconductor Devices and Methods o...

METHOD FOR FORMING A SEMICONDUCTOR COMPONENT WITH A COOLING STRUCTURE

SEMICONDUCTOR PACKAGE INCLUDING THERMAL INTERFACE STRUCTURES AND ME...

SEMICONDUCTOR DEVICE, STACKED SEMICONDUCTOR DEVICE AND MANUFACTURIN...

BONDING METHOD OF PACKAGE COMPONENTS AND BONDING APPARATUS

Packaged Semiconductor Device Including Liquid-Cooled Lid and Metho...

Bonding with Pre-Deoxide Process and Apparatus for Performing the Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Bonded Semiconductor Devices and Methods of Forming The Same

Packaged Semiconductor Device Including Liquid-Cooled Lid and Metho...

METHOD OF FORMING SEMICONDUCTOR PACKAGE WITH COMPOSITE THERMAL INTE...

SEMICONDUCTR DEVICE, STACKED SEMICONDUCTOR DEVICE AND MANUFACTURING...

PACKAGE STRUCTURE

CHIP PACKAGE STRUCTURE WITH REDISTRIBUTION LAYER HAVING BONDING POR...

SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR COMPONENT WITH COOLING STRUCTURE