Tze-man Ko

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Doping of copper wiring structures in back end of line processing
- Patent number 9,059,177
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Thomas W. Dyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device processing with reduced wiring puddle formation
- Patent number 9,018,097
- Issue date Apr 28, 2015
- International Business Machines Corporation
- Thomas W. Dyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doping of copper wiring structures in back end of line processing
- Patent number 8,765,602
- Issue date Jul 1, 2014
- International Business Machines Corporation
- Thomas W. Dyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for detecting defects in BEOL processing
- Patent number 8,623,673
- Issue date Jan 7, 2014
- International Business Machines Corporation
- Thomas W. Dyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and process of making the same
- Patent number 7,488,679
- Issue date Feb 10, 2009
- International Business Machines Corporation
- Theodorus Eduardus Standaert
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DOPING OF COPPER WIRING STRUCTURES IN BACK END OF LINE PROCESSING
- Publication number 20150255397
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Thomas W. Dyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA STRUCTURE AND METHOD FOR IMPROVING BEOL DIELECT...
- Publication number 20150097274
- Publication date Apr 9, 2015
- International Business Machines Corporation
- Christopher Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA STRUCTURE AND METHOD FOR IMPROVING BEOL DIELECT...
- Publication number 20150069608
- Publication date Mar 12, 2015
- International Business Machines Corporation
- Christopher Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPING OF COPPER WIRING STRUCTURES IN BACK END OF LINE PROCESSING
- Publication number 20140246776
- Publication date Sep 4, 2014
- International Business Machines Corporation
- Thomas W. Dyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PROCESSING WITH REDUCED WIRING PUDDLE FORMATION
- Publication number 20140099787
- Publication date Apr 10, 2014
- International Business Machines Corporation
- Thomas W. Dyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPING OF COPPER WIRING STRUCTURES IN BACK END OF LINE PROCESSING
- Publication number 20140061914
- Publication date Mar 6, 2014
- International Business Machines Corporation
- Thomas W. Dyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND PROCESS OF MAKING THE SAME
- Publication number 20080026568
- Publication date Jan 31, 2008
- International Business Machines Corporation
- Theodorus Eduardus Standaert
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Doping of copper wiring structures in back end of line processing

Semiconductor device processing with reduced wiring puddle formation

Doping of copper wiring structures in back end of line processing

Structure and method for detecting defects in BEOL processing

Interconnect structure and process of making the same

Patents Applicationslast 30 patents

DOPING OF COPPER WIRING STRUCTURES IN BACK END OF LINE PROCESSING

THROUGH-SILICON VIA STRUCTURE AND METHOD FOR IMPROVING BEOL DIELECT...

THROUGH-SILICON VIA STRUCTURE AND METHOD FOR IMPROVING BEOL DIELECT...

DOPING OF COPPER WIRING STRUCTURES IN BACK END OF LINE PROCESSING

SEMICONDUCTOR DEVICE PROCESSING WITH REDUCED WIRING PUDDLE FORMATION

DOPING OF COPPER WIRING STRUCTURES IN BACK END OF LINE PROCESSING

INTERCONNECT STRUCTURE AND PROCESS OF MAKING THE SAME