Tze Wing Poon

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices suitable for narrow pitch applications and me...
- Patent number 9,530,898
- Issue date Dec 27, 2016
- Applied Materials, Inc.
- Udayan Ganguly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices suitable for narrow pitch applications and me...
- Patent number 8,871,645
- Issue date Oct 28, 2014
- Applied Materials, Inc.
- Udayan Ganguly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced scavenging of residual fluorine radicals using silicon coa...
- Patent number 8,642,128
- Issue date Feb 4, 2014
- Applied Materials, Inc.
- Dongwon Choi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ion implanted substrate having capping layer and method
- Patent number 8,198,180
- Issue date Jun 12, 2012
- Applied Materials, Inc.
- Jose Ignacio Del Agua Borniquel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modification of charge trap silicon nitride with oxygen plasma
- Patent number 8,198,671
- Issue date Jun 12, 2012
- Applied Materials, Inc.
- Christopher Sean Olsen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ion implanted substrate having capping layer and method
- Patent number 7,858,503
- Issue date Dec 28, 2010
- Applied Materials, Inc.
- Jose Ignacio Del Agua Borniquel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 7,560,377
- Issue date Jul 14, 2009
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Biased H2 etch process in deposition-etch-deposition gap fill
- Patent number 7,163,896
- Issue date Jan 16, 2007
- Novellus Systems, Inc.
- Wenxian Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,930,061
- Issue date Aug 16, 2005
- Applied Materials Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,869,896
- Issue date Mar 22, 2005
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,734,115
- Issue date May 11, 2004
- Applied Materials Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,660,656
- Issue date Dec 9, 2003
- Applied Materials Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,596,655
- Issue date Jul 22, 2003
- Applied Materials Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,562,690
- Issue date May 13, 2003
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,541,282
- Issue date Apr 1, 2003
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,348,725
- Issue date Feb 19, 2002
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,303,523
- Issue date Oct 16, 2001
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device with a copper barrier layer and formation thereof
- Patent number 6,093,966
- Issue date Jul 25, 2000
- Motorola, Inc.
- Ramnath Venkatraman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES SUITABLE FOR NARROW PITCH APPLICATIONS AND ME...
- Publication number 20150102396
- Publication date Apr 16, 2015
- Applied Materials, Inc.
- UDAYAN GANGULY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION IMPLANTED SUBSTRATE HAVING CAPPING LAYER AND METHOD
- Publication number 20110092058
- Publication date Apr 21, 2011
- Applied Materials, Inc.
- JOSE IGNACIO DEL AGUA BORNIQUEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modification of charge trap silicon nitride with oxygen plasma
- Publication number 20100270609
- Publication date Oct 28, 2010
- Applied Materials, Inc.
- Christopher Sean Olsen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DECONTAMINATION OF MOCVD CHAMBER USING NH3 PURGE AFTER IN-SITU CLEA...
- Publication number 20100273291
- Publication date Oct 28, 2010
- Applied Materials, Inc.
- Olga Kryliouk
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ENHANCED SCAVENGING OF RESIDUAL FLUORINE RADICALS USING SILICON COA...
- Publication number 20100267224
- Publication date Oct 21, 2010
- Applied Materials, Inc.
- DONGWON CHOI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ION IMPLANTED SUBSTRATE HAVING CAPPING LAYER AND METHOD
- Publication number 20100200954
- Publication date Aug 12, 2010
- APPLIED MATERIALS, INC.
- JOSE IGNACIO DEL AGUA BORNIQUEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES SUITABLE FOR NARROW PITCH APPLICATIONS AND ME...
- Publication number 20100062603
- Publication date Mar 11, 2010
- Udayan Ganguly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma processes for depositing low dielectric constant films
- Publication number 20050191846
- Publication date Sep 1, 2005
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma processes for depositing low dielectric constant films
- Publication number 20040082199
- Publication date Apr 29, 2004
- APPLIED MATERIALS, INC.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma processes for depositing low dielectric constant films
- Publication number 20040038545
- Publication date Feb 26, 2004
- APPLIED MATERIALS, INC.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma processes for depositing low dielectric constant films
- Publication number 20030064610
- Publication date Apr 3, 2003
- APPLIED MATERIALS, INC.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma processes for depositing low dielectric constant films
- Publication number 20020045361
- Publication date Apr 18, 2002
- APPLIED MATERIALS, INC.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS
- Publication number 20010005546
- Publication date Jun 28, 2001
- APPLIED MATERIALS, INC.
- DAVID CHEUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS
- Publication number 20010004479
- Publication date Jun 21, 2001
- DAVID CHEUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Tze Wing Poon

Person

Patents Grantslast 30 patents

Semiconductor devices suitable for narrow pitch applications and me...

Semiconductor devices suitable for narrow pitch applications and me...

Enhanced scavenging of residual fluorine radicals using silicon coa...

Ion implanted substrate having capping layer and method

Modification of charge trap silicon nitride with oxygen plasma

Ion implanted substrate having capping layer and method

Plasma processes for depositing low dielectric constant films

Biased H2 etch process in deposition-etch-deposition gap fill

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Semiconductor device with a copper barrier layer and formation thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES SUITABLE FOR NARROW PITCH APPLICATIONS AND ME...

ION IMPLANTED SUBSTRATE HAVING CAPPING LAYER AND METHOD

Modification of charge trap silicon nitride with oxygen plasma

DECONTAMINATION OF MOCVD CHAMBER USING NH3 PURGE AFTER IN-SITU CLEA...

ENHANCED SCAVENGING OF RESIDUAL FLUORINE RADICALS USING SILICON COA...

ION IMPLANTED SUBSTRATE HAVING CAPPING LAYER AND METHOD

SEMICONDUCTOR DEVICES SUITABLE FOR NARROW PITCH APPLICATIONS AND ME...

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS

PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS