Number | Name | Date | Kind |
---|---|---|---|
5178739 | Barnes et al. | Jan 1993 | |
5431016 | Simpkin | Jul 1995 | |
5431799 | Mosely et al. | Jul 1995 | |
5449955 | Debiec et al. | Sep 1995 | |
5614437 | Choudhury | Mar 1997 |
Entry |
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"Metal Ion Deposition From Ionized Mangetron Sputtering Discharge," Rossnagel, et al.; J. Vac. Sci. Technol. B 12(1), Jan./Feb. 1994; pp. 449-453. |
"Filling Dual Damascene Interconnect Structures With AICu and Cu Using Ionized Magnetron Deposition," Rossnagel; J. Vac. Sci. Technol. B 13(1), Jan./Feb. 1995; pp. 125-129. |
"Simulations of Trench-Filling Profiles Under Ionized Magnetron Sputter Metal Deposition," Hamaguchi, et al., Mar. 20, 1998. |