Tzong-Dar Her

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Super low profile package with stacked dies
- Patent number 6,731,015
- Issue date May 4, 2004
- Siliconware Precision Industries Co., Ltd.
- Chi-Chuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super low profile package with high efficiency of heat dissipation
- Patent number 6,713,321
- Issue date Mar 30, 2004
- Siliconware Precision Industries Co. Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of a multi chip module having stacked chips
- Patent number 6,650,009
- Issue date Nov 18, 2003
- Siliconware Precision Industries Co., Ltd.
- Tzong-Dar Her
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-die package structure
- Patent number 6,593,662
- Issue date Jul 15, 2003
- Siliconware Precision Industries Co., Ltd.
- Han-Ping Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat non-leaded package and leadframe for use in a quad flat n...
- Patent number 6,583,499
- Issue date Jun 24, 2003
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Super low profile package with high efficiency of heat dissipation
- Patent number 6,541,854
- Issue date Apr 1, 2003
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation ball grid array package
- Patent number 6,525,942
- Issue date Feb 25, 2003
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for identifying defective elements in array molding of semic...
- Patent number 6,391,666
- Issue date May 21, 2002
- Siliconware Precision Industries Co., Ltd.
- Ya-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging having non-sticking test structure
- Patent number 6,392,425
- Issue date May 21, 2002
- Siliconware Precision Industries Co., Ltd.
- April Chen
- G01 - MEASURING TESTING
Information Patent Grant
Crack-preventive substrate and process for fabricating solder mask
- Patent number 6,291,260
- Issue date Sep 18, 2001
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiny ball grid array package
- Patent number 6,218,731
- Issue date Apr 17, 2001
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Super low profile package with high efficiency of heat dissipation
- Publication number 20030092221
- Publication date May 15, 2003
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super low profile package with stacked dies
- Publication number 20030025199
- Publication date Feb 6, 2003
- Chi-Chuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of a multi chip module having stacked chips
- Publication number 20020180023
- Publication date Dec 5, 2002
- Tzong-Dar Her
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DCA memory module and a fabrication method thereof
- Publication number 20020094602
- Publication date Jul 18, 2002
- Tzong-Dar Her
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super low profile package with high efficiency of heat dissipation
- Publication number 20020066954
- Publication date Jun 6, 2002
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quad flat non-leaded package and leadframe for the same
- Publication number 20020063315
- Publication date May 30, 2002
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat dissipation ball grid array package
- Publication number 20020034066
- Publication date Mar 21, 2002
- CHIEN-PING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY PACKAGE AND A PACKAGING PROCESS FOR SAME
- Publication number 20020000656
- Publication date Jan 3, 2002
- CHIEN-PING HUANG
- H01 - BASIC ELECTRIC ELEMENTS

Tzong-Dar Her

Person

Patents Grantslast 30 patents

Super low profile package with stacked dies

Super low profile package with high efficiency of heat dissipation

Structure of a multi chip module having stacked chips

Stacked-die package structure

Quad flat non-leaded package and leadframe for use in a quad flat n...

Super low profile package with high efficiency of heat dissipation

Heat dissipation ball grid array package

Method for identifying defective elements in array molding of semic...

Multi-chip packaging having non-sticking test structure

Crack-preventive substrate and process for fabricating solder mask

Tiny ball grid array package

Patents Applicationslast 30 patents

Super low profile package with high efficiency of heat dissipation

Super low profile package with stacked dies

Structure of a multi chip module having stacked chips

DCA memory module and a fabrication method thereof

Super low profile package with high efficiency of heat dissipation

Quad flat non-leaded package and leadframe for the same

Heat dissipation ball grid array package

BALL GRID ARRAY PACKAGE AND A PACKAGING PROCESS FOR SAME