TZU-JUI FANG

Person

HSINCHU, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Vibration feedback device and control method thereof
- Patent number 12,141,359
- Issue date Nov 12, 2024
- TOPRAY MEMS INC.
- Chin-Sung Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated fan-out package, package-on-package structure, and manuf...
- Patent number 11,075,132
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Linear resonant actuator, control system and brake control method
- Patent number 10,938,286
- Issue date Mar 2, 2021
- TOPRAY MEMS INC.
- Chin-Sung Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Control system and vibration control method for linear resonant act...
- Patent number 10,804,785
- Issue date Oct 13, 2020
- TOPRAY MEMS INC.
- Chin-Sung Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Fan-out package structure and method for forming the same
- Patent number 10,290,605
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device and method of manufacturing the same
- Patent number 10,290,590
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105077
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250038145
- Publication date Jan 30, 2025
- MEDIATEK INC.
- Tzu-Jui FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTUR...
- Publication number 20240387308
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL SYSTEM AND VIBRATION CONTROL METHOD FOR LINEAR RESONANT ACT...
- Publication number 20200059149
- Publication date Feb 20, 2020
- TOPRAY MEMS INC.
- Chin-Sung Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
DISPLAY APPARATUS AND DRIVING METHOD OF DISPLAY PANEL
- Publication number 20190180704
- Publication date Jun 13, 2019
- AU OPTRONICS CORPORATION
- Mei-Chun Cheng
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE, PACKAGE-ON-PACKAGE STRUCTURE, AND MANUF...
- Publication number 20190067144
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20190006314
- Publication date Jan 3, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LENS DRIVING APPARATUS AND ADJUSTMENT METHOD THEREOF
- Publication number 20180335598
- Publication date Nov 22, 2018
- TOPRAY MEMS INC.
- Tzu-Kuang Fang
- G02 - OPTICS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180151512
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- SHIN-PUU JENG
- H01 - BASIC ELECTRIC ELEMENTS

TZU-JUI FANG

Person

Patents Grantslast 30 patents

Vibration feedback device and control method thereof

Integrated fan-out package, package-on-package structure, and manuf...

Linear resonant actuator, control system and brake control method

Control system and vibration control method for linear resonant act...

Fan-out package structure and method for forming the same

Stacked semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE

MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTUR...

CONTROL SYSTEM AND VIBRATION CONTROL METHOD FOR LINEAR RESONANT ACT...

DISPLAY APPARATUS AND DRIVING METHOD OF DISPLAY PANEL

INTEGRATED FAN-OUT PACKAGE, PACKAGE-ON-PACKAGE STRUCTURE, AND MANUF...

FAN-OUT PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

LENS DRIVING APPARATUS AND ADJUSTMENT METHOD THEREOF

STACKED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME