Tzu-Ting HUANG

Person

Taoyuan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Box for transporting boards
- Patent number D1068701
- Issue date Apr 1, 2025
- Gudeng Precision Industrial Co., Ltd.
- Ming-Chien Chiu
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 12,266,639
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Box for transporting boards
- Patent number D1068700
- Issue date Apr 1, 2025
- Gudeng Precision Industrial Co., Ltd.
- Ming-Chien Chiu
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,261,092
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,255,184
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Door locking mechanism and semiconductor container using the same
- Patent number 12,243,762
- Issue date Mar 4, 2025
- Gudeng Precision Industrial Co., Ltd.
- Ming-Chien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting shelf module and wafer container using same
- Patent number 12,237,190
- Issue date Feb 25, 2025
- Gudeng Precision Industrial Co., Ltd.
- Ming-Chien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portable electronic device
- Patent number D1063927
- Issue date Feb 25, 2025
- Compal Electronics, Inc.
- Wei-Ning Chai
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Electronic device
- Patent number D1063926
- Issue date Feb 25, 2025
- Compal Electronics, Inc.
- Wei-Ning Chai
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Image sensors chip with depth information
- Patent number 12,192,661
- Issue date Jan 7, 2025
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Chen-Yi Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor packages
- Patent number 12,159,839
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder-free connector
- Patent number 12,155,150
- Issue date Nov 26, 2024
- Sound Plug Electronic Co., Ltd.
- Tzu-Che Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Calibration pod for robotic wafer carrier handling and calibration...
- Patent number 12,068,184
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company., Ltd.
- Tzu-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for generating images with high dynamic range during multipl...
- Patent number 12,051,180
- Issue date Jul 30, 2024
- Chiun Mai Communication Systems, Inc.
- Sheng-Yeh Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Polymer film and uses of the same
- Patent number 12,036,770
- Issue date Jul 16, 2024
- Chang Chun Petrochemical Co., Ltd.
- Yen-Chen Huang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of fabricating semiconductor structure
- Patent number 12,040,283
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hexagonal semiconductor package structure
- Patent number 11,996,227
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top-opening substrate carrier
- Patent number 11,987,431
- Issue date May 21, 2024
- Gudeng Precision Industrial Co., Ltd.
- Ming-Chien Chiu
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Integrated circuit package and method
- Patent number 11,942,433
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,935,871
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,935,804
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric half-bridge converter
- Patent number 11,916,487
- Issue date Feb 27, 2024
- Power Forest Technology Corporation
- Chao-Chang Chiu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Portable electronic device
- Patent number 11,907,028
- Issue date Feb 20, 2024
- Compal Electronics, Inc.
- Yu-Wen Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Support for upper cover of reticle box
- Patent number D1013822
- Issue date Feb 6, 2024
- Gudeng Precision Industrial Co., Ltd.
- Ming-Chien Chiu
- D22 - Arms, pyrotechnics, hunting and fishing equipment
Information Patent Grant
Device and method for acquiring shadow-free images of documents for...
- Patent number 11,876,945
- Issue date Jan 16, 2024
- Mobile Drive Netherlands B.V.
- Yun-Hsuan Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method
- Patent number 11,848,288
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, external module thereof, manufacturing method of...
- Patent number 11,841,742
- Issue date Dec 12, 2023
- GETAC TECHNOLOGY CORPORATION
- Tzu-Chiu Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaged semiconductor devices with wireless charging means
- Patent number 11,837,517
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for supporting class-based scheduling in a...
- Patent number 11,824,788
- Issue date Nov 21, 2023
- MOXA Inc.
- Yueh-Ming Ko
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for preventing or treating metabolic disorder
- Patent number 11,813,317
- Issue date Nov 14, 2023
- Academia Sinica
- Ruey-Hwa Chen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
POLYMER FILM AND USES OF THE SAME
- Publication number 20250091328
- Publication date Mar 20, 2025
- CHANG CHUN PETROCHEMICAL CO., LTD.
- Tzu-Jung Huang
- B32 - LAYERED PRODUCTS
Information Patent Application
POLYMER FILM AND USES OF THE SAME
- Publication number 20250091331
- Publication date Mar 20, 2025
- CHANG CHUN PETROCHEMICAL CO., LTD.
- Tzu-Jung Huang
- B32 - LAYERED PRODUCTS
Information Patent Application
INSPECTION SYSTEM AND METHOD FOR SUPPORTING BEAM OF SUBSTRATE CARRIER
- Publication number 20250079208
- Publication date Mar 6, 2025
- GUDENG PRECISION INDUSTRIAL CO., LTD.
- MING-CHIEN CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLDING DEVICE FOR TOP-OPENING SUBSTRATE CONTAINER
- Publication number 20250019144
- Publication date Jan 16, 2025
- GUDENG PRECISION INDUSTRIAL CO., LTD.
- MING-CHIEN CHIU
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
DUAL-POLARIZATION CAVITY-BACKED ANTENNA, PACKAGE MODULE, AND ARRAY...
- Publication number 20250007179
- Publication date Jan 2, 2025
- National Taiwan University
- Yi-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240429142
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTING STRUCTURE AND INSPECTION EQUIPMENT THEREFOF AND CALIBRAT...
- Publication number 20240412996
- Publication date Dec 12, 2024
- GUDENG PRECISION INDUSTRIAL CO., LTD.
- MING-CHIEN CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240395721
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CALIBRATION POD FOR ROBOTIC WAFER CARRIER HANDLING AND CALIBRATION...
- Publication number 20240363379
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
- Publication number 20240321765
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20240312692
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRACKER AND TRACKING METHOD THEREOF AND CLUSTERED TRACKING SYSTEM A...
- Publication number 20240284145
- Publication date Aug 22, 2024
- WISTRON NEWEB CORPORATION
- Ying-Hung LO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE SENSORS CHIP WITH DEPTH INFORMATOIN
- Publication number 20240236527
- Publication date Jul 11, 2024
- National Yang Ming Chiao Tung University
- Chen-Yi LEE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20240234375
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240178091
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Network Device, Time-Sensitive Network System and Auto-configuratio...
- Publication number 20240179065
- Publication date May 30, 2024
- MOXA INC.
- Yueh-Ming Ko
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240178090
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING BACKSIDE CONNECTOR AND METHODS OF FORMING THE SAME
- Publication number 20240178102
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Ti LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240178120
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOCKING STATION
- Publication number 20240152182
- Publication date May 9, 2024
- Getac Technology Corporation
- Tzu-Chiu HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGE SENSORS CHIP WITH DEPTH INFORMATOIN
- Publication number 20240137671
- Publication date Apr 25, 2024
- National Yang Ming Chiao Tung University
- Chen-Yi LEE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MOTHERBOARD AND CONNECTOR
- Publication number 20240128666
- Publication date Apr 18, 2024
- GIGA-BYTE TECHNOLOGY CO., LTD.
- CHIH-MING LAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CARRIER BOARD CONVEYING BOX WITH REINFORCED STRUCTURE
- Publication number 20240055288
- Publication date Feb 15, 2024
- GUDENG PRECISION INDUSTRIAL CO., LTD.
- MING-CHIEN CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP-OPENING SUBSTRATE CARRIER
- Publication number 20240034525
- Publication date Feb 1, 2024
- GUDENG PRECISION INDUSTRIAL CO., LTD.
- MING-CHIEN CHIU
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20230420331
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ban-Li Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOOR LOCKING MECHANISM AND SEMICONDUCTOR CONTAINER USING THE SAME
- Publication number 20230386876
- Publication date Nov 30, 2023
- GUDENG PRECISION INDUSTRIAL CO., LTD.
- MING-CHIEN CHIU
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20230378140
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-PROPELLED CLEANING MACHINE
- Publication number 20230363611
- Publication date Nov 16, 2023
- Hobot Technology Inc.
- CHI-MOU CHAO
- G05 - CONTROLLING REGULATING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230369263
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kris Lipu Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20230343764
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Tzu-Ting HUANG

Person

Patents Grantslast 30 patents

Box for transporting boards

Method of fabricating semiconductor package

Box for transporting boards

Semiconductor package and manufacturing method thereof

Semiconductor packages and methods of forming the same

Door locking mechanism and semiconductor container using the same

Supporting shelf module and wafer container using same

Portable electronic device

Electronic device

Image sensors chip with depth information

Semiconductor packages

Solder-free connector

Calibration pod for robotic wafer carrier handling and calibration...

Method for generating images with high dynamic range during multipl...

Polymer film and uses of the same

Method of fabricating semiconductor structure

Hexagonal semiconductor package structure

Top-opening substrate carrier

Integrated circuit package and method

Semiconductor package and method of fabricating the same

Integrated circuit package and method

Asymmetric half-bridge converter

Portable electronic device

Support for upper cover of reticle box

Device and method for acquiring shadow-free images of documents for...

Semiconductor device and method

Electronic device, external module thereof, manufacturing method of...

Packaged semiconductor devices with wireless charging means

Apparatuses and methods for supporting class-based scheduling in a...

Method for preventing or treating metabolic disorder

Patents Applicationslast 30 patents

POLYMER FILM AND USES OF THE SAME

POLYMER FILM AND USES OF THE SAME

INSPECTION SYSTEM AND METHOD FOR SUPPORTING BEAM OF SUBSTRATE CARRIER

HOLDING DEVICE FOR TOP-OPENING SUBSTRATE CONTAINER

DUAL-POLARIZATION CAVITY-BACKED ANTENNA, PACKAGE MODULE, AND ARRAY...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SUPPORTING STRUCTURE AND INSPECTION EQUIPMENT THEREFOF AND CALIBRAT...

SEMICONDUCTOR PACKAGES

CALIBRATION POD FOR ROBOTIC WAFER CARRIER HANDLING AND CALIBRATION...

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE

COIL STRUCTURE AND METHOD OF MAKING SAME

TRACKER AND TRACKING METHOD THEREOF AND CLUSTERED TRACKING SYSTEM A...

IMAGE SENSORS CHIP WITH DEPTH INFORMATOIN

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

Integrated Circuit Package and Method

Network Device, Time-Sensitive Network System and Auto-configuratio...

PACKAGE STRUCTURE

PACKAGE INCLUDING BACKSIDE CONNECTOR AND METHODS OF FORMING THE SAME

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

DOCKING STATION

IMAGE SENSORS CHIP WITH DEPTH INFORMATOIN

MOTHERBOARD AND CONNECTOR

CARRIER BOARD CONVEYING BOX WITH REINFORCED STRUCTURE

TOP-OPENING SUBSTRATE CARRIER

SEMICONDUCTOR PACKAGE AND METHOD

DOOR LOCKING MECHANISM AND SEMICONDUCTOR CONTAINER USING THE SAME

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

SELF-PROPELLED CLEANING MACHINE

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE