Tzu-Wei Chiu

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Self-aligning backside contact process and devices thereof
- Patent number 12,142,647
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Han Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,051,732
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Hao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial structures exposed in airgaps for semiconductor devices
- Patent number 11,923,409
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packages and methods for forming the same
- Patent number 11,830,745
- Issue date Nov 28, 2023
- TAIWANN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method
- Patent number 11,715,681
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method
- Patent number 11,107,758
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packages and methods for forming the same
- Patent number 11,069,539
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for measuring a flowing property in a resin transfer molding...
- Patent number 10,946,597
- Issue date Mar 16, 2021
- CORETECH SYSTEM CO., LTD.
- Yuan Yao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
3D packages and methods for forming the same
- Patent number 10,665,474
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method
- Patent number 10,510,648
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packages and methods for forming the same
- Patent number 10,269,584
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method
- Patent number 10,163,770
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure for yield improvement
- Patent number 10,056,347
- Issue date Aug 21, 2018
- Taiwan Semiconductor Manufacturing Company
- Tzu-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out package structure and method
- Patent number 9,953,911
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer for packaged chip
- Patent number 9,570,366
- Issue date Feb 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure for yield improvement
- Patent number 9,553,053
- Issue date Jan 24, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress buffer structures in a mounting structure of a semiconductor...
- Patent number 9,337,118
- Issue date May 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packages and methods for forming the same
- Patent number 9,299,649
- Issue date Mar 29, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing stress buffer structures in a mounting str...
- Patent number 8,906,798
- Issue date Dec 9, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers for semiconductor devices and methods of manufacture th...
- Patent number 8,896,089
- Issue date Nov 25, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structure with polyimide layer adhesion
- Patent number 8,587,089
- Issue date Nov 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer for packaged chip
- Patent number 8,558,229
- Issue date Oct 15, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- G01 - MEASURING TESTING
Information Patent Grant
Stress buffer structures in a mounting structure of a semiconductor...
- Patent number 8,354,750
- Issue date Jan 15, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having pad structure with stress buffer layer
- Patent number 8,283,781
- Issue date Oct 9, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming pseudo buried layer for sub-micron bipolar or Bi...
- Patent number 5,856,003
- Issue date Jan 5, 1999
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yin Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELF-ALIGNING BACKSIDE CONTACT PROCESS AND DEVICES THEREOF
- Publication number 20240379772
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Han Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240363714
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Hao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL STRUCTURES EXPOSED IN AIRGAPS FOR SEMICONDUCTOR DEVICES
- Publication number 20240186373
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURES IN SEMICONDUCTOR DEVICES
- Publication number 20240079483
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Source and Drain Enginering Process for Multigate Devices
- Publication number 20230378304
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Fabricating Epitaxial Source/Drain Feature
- Publication number 20230134971
- Publication date May 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Han Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING BACKSIDE CONTACT PROCESS AND DEVICES THEREOF
- Publication number 20230065318
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Han Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES WITH IMPROVED OPERATIONAL CURRENT AND REDUCED LEAKAGE CURRENT
- Publication number 20230063612
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230052084
- Publication date Feb 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Hao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation Features For Semiconductor Devices And Methods Of Fabrica...
- Publication number 20230019386
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Hao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INNER SPACER FOR A MULTI-GATE DEVICE AND RELATED METHODS
- Publication number 20230017036
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Han FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230018480
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Hao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inner Spacer Features For Multi-Gate Transistors
- Publication number 20230018266
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Han FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spacer Features For Nanosheet-Based Devices
- Publication number 20220328648
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Hsieh Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Epitaxial Structures For Semiconductor Devices
- Publication number 20220320276
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Source and Drain Enginering Process for Multigate Devices
- Publication number 20220320307
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Structure and Method
- Publication number 20210391242
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packages and Methods for Forming the Same
- Publication number 20210313196
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packages and Methods for Forming the Same
- Publication number 20200266076
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MEASURING A FLOWING PROPERTY IN A RESIN TRANSFER MOLDING...
- Publication number 20200061941
- Publication date Feb 27, 2020
- CORETECH SYSTEM CO., LTD.
- Yuan YAO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Fan-Out Package Structure and Method
- Publication number 20200051900
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packages and Methods for Forming the Same
- Publication number 20190221445
- Publication date Jul 18, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Structure and Method
- Publication number 20190148277
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR MEASURING A FLOWING PROPERTY IN A RESIN TRANS...
- Publication number 20180319107
- Publication date Nov 8, 2018
- CORETECH SYSTEM CO., LTD.
- Yuan YAO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Fan-Out Package Structure and Method
- Publication number 20180190578
- Publication date Jul 5, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE AND METHOD
- Publication number 20180005930
- Publication date Jan 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Structure for Yield Improvement
- Publication number 20170133346
- Publication date May 11, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
3D Packages and Methods for Forming the Same
- Publication number 20160181124
- Publication date Jun 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS BUFFER STRUCTURES IN A MOUNTING STRUCTURE OF A SEMICONDUCTOR...
- Publication number 20150102487
- Publication date Apr 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packages and Methods for Forming the Same
- Publication number 20140225258
- Publication date Aug 14, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Tzu-Wei Chiu

Person

Patents Grantslast 30 patents

Self-aligning backside contact process and devices thereof

Semiconductor structure and method for forming the same

Epitaxial structures exposed in airgaps for semiconductor devices

3D packages and methods for forming the same

Fan-out package structure and method

Fan-out package structure and method

3D packages and methods for forming the same

Method for measuring a flowing property in a resin transfer molding...

3D packages and methods for forming the same

Fan-out package structure and method

3D packages and methods for forming the same

Fan-out package structure and method

Bump structure for yield improvement

Fan-out package structure and method

Passivation layer for packaged chip

Bump structure for yield improvement

Stress buffer structures in a mounting structure of a semiconductor...

3D packages and methods for forming the same

Methods of manufacturing stress buffer structures in a mounting str...

Interposers for semiconductor devices and methods of manufacture th...

Seal ring structure with polyimide layer adhesion

Passivation layer for packaged chip

Stress buffer structures in a mounting structure of a semiconductor...

Semiconductor device having pad structure with stress buffer layer

Method for forming pseudo buried layer for sub-micron bipolar or Bi...

Patents Applicationslast 30 patents

SELF-ALIGNING BACKSIDE CONTACT PROCESS AND DEVICES THEREOF

SEMICONDUCTOR STRUCTURE

EPITAXIAL STRUCTURES EXPOSED IN AIRGAPS FOR SEMICONDUCTOR DEVICES

ISOLATION STRUCTURES IN SEMICONDUCTOR DEVICES

Source and Drain Enginering Process for Multigate Devices

Method Of Fabricating Epitaxial Source/Drain Feature

SELF-ALIGNING BACKSIDE CONTACT PROCESS AND DEVICES THEREOF

DEVICES WITH IMPROVED OPERATIONAL CURRENT AND REDUCED LEAKAGE CURRENT

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

Isolation Features For Semiconductor Devices And Methods Of Fabrica...

INNER SPACER FOR A MULTI-GATE DEVICE AND RELATED METHODS

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

Inner Spacer Features For Multi-Gate Transistors

Spacer Features For Nanosheet-Based Devices

Epitaxial Structures For Semiconductor Devices

Source and Drain Enginering Process for Multigate Devices

Fan-Out Package Structure and Method

3D Packages and Methods for Forming the Same

3D Packages and Methods for Forming the Same

METHOD FOR MEASURING A FLOWING PROPERTY IN A RESIN TRANSFER MOLDING...

Fan-Out Package Structure and Method

3D Packages and Methods for Forming the Same

Fan-Out Package Structure and Method

SYSTEM AND METHOD FOR MEASURING A FLOWING PROPERTY IN A RESIN TRANS...

Fan-Out Package Structure and Method

FAN-OUT PACKAGE STRUCTURE AND METHOD

Bump Structure for Yield Improvement

3D Packages and Methods for Forming the Same

STRESS BUFFER STRUCTURES IN A MOUNTING STRUCTURE OF A SEMICONDUCTOR...

3D Packages and Methods for Forming the Same