Ulf Erlesand

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Osterskar, SE

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Patents Grantslast 30 patents

Information Patent Grant
Through substrate vias and device
- Patent number 9,607,915
- Issue date Mar 28, 2017
- Silex Microsystems AB
- Ulf Erlesand
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Starting substrate for semiconductor engineering having substrate-t...
- Patent number 9,249,009
- Issue date Feb 2, 2016
- Silex Microsystems AB
- Ulf Erlesand
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
THROUGH SUBSTRATE VIAS AND DEVICE
- Publication number 20150279756
- Publication date Oct 1, 2015
- Silex Microsystems AB
- Ulf Erlesand
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STARTING SUBSTRATE FOR SEMICONDUCTOR ENGINEERING HAVING SUBSTRATE-T...
- Publication number 20140042498
- Publication date Feb 13, 2014
- Silex Microsystems AB
- Ulf Erlesand
- B81 - MICRO-STRUCTURAL TECHNOLOGY