Umang DESAI

Person

Portland, OR, US

People

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH FRONT-SIDE-GUIDED BACKSIDE SOURCE...
- Publication number 20250228008
- Publication date Jul 10, 2025
- Intel Corporation
- Leonard P. GULER
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH FRONT-SIDE-CUT BACKSIDE SOURCE OR...
- Publication number 20250221040
- Publication date Jul 3, 2025
- Intel Corporation
- Leonard P. GULER
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH FRONT-SIDE-GUIDED BACKSIDE SOURCE...
- Publication number 20250221041
- Publication date Jul 3, 2025
- Intel Corporation
- Leonard P. GULER
Information Patent Application
BACKSIDE EPITAXIAL GROWTH FOR IMPROVED CONTACT AREA
- Publication number 20250220994
- Publication date Jul 3, 2025
- Intel Corporation
- Mauro J. Kobrinsky
Information Patent Application
FRONT SIDE AND BACKSIDE SOURCE OR DRAIN CONTACTS
- Publication number 20250220959
- Publication date Jul 3, 2025
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTED SELF ASSEMBLY-ENABLED BACK-SIDE CONTACT ARRAYS ALIGNED TO...
- Publication number 20250218937
- Publication date Jul 3, 2025
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH DIRECT BACKSIDE SOURCE OR DRAIN C...
- Publication number 20250220991
- Publication date Jul 3, 2025
- Intel Corporation
- Shao Ming KOH
Information Patent Application
RECESSED OXIDE AND SEAM-FIRST ETCH FOR AIR-GAPPED ISOLATION WALLS
- Publication number 20250210412
- Publication date Jun 26, 2025
- Intel Corporation
- Umang Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-GAPPED ISOLATION WALLS
- Publication number 20250210522
- Publication date Jun 26, 2025
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONDUCTIVE STRUCTURES EXTENDING THROUGH INTEGRATED CIRCUIT...
- Publication number 20240355915
- Publication date Oct 24, 2024
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LINE AND VIA BARRIER LAYERS, AND VIA PROFILES, FOR ADVANCED I...
- Publication number 20220068802
- Publication date Mar 3, 2022
- Intel Corporation
- Atul MADHAVAN
- H01 - BASIC ELECTRIC ELEMENTS

Umang DESAI

Person

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT STRUCTURE WITH FRONT-SIDE-GUIDED BACKSIDE SOURCE...

INTEGRATED CIRCUIT STRUCTURE WITH FRONT-SIDE-CUT BACKSIDE SOURCE OR...

INTEGRATED CIRCUIT STRUCTURE WITH FRONT-SIDE-GUIDED BACKSIDE SOURCE...

BACKSIDE EPITAXIAL GROWTH FOR IMPROVED CONTACT AREA

FRONT SIDE AND BACKSIDE SOURCE OR DRAIN CONTACTS

DIRECTED SELF ASSEMBLY-ENABLED BACK-SIDE CONTACT ARRAYS ALIGNED TO...

INTEGRATED CIRCUIT STRUCTURE WITH DIRECT BACKSIDE SOURCE OR DRAIN C...

RECESSED OXIDE AND SEAM-FIRST ETCH FOR AIR-GAPPED ISOLATION WALLS

AIR-GAPPED ISOLATION WALLS

BACKSIDE CONDUCTIVE STRUCTURES EXTENDING THROUGH INTEGRATED CIRCUIT...

METAL LINE AND VIA BARRIER LAYERS, AND VIA PROFILES, FOR ADVANCED I...