Uppili Sridhar

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Controlling the morphology in metal loaded paste material
- Patent number 10,475,559
- Issue date Nov 12, 2019
- Maxim Integrated Products, Inc.
- Nazanin Davani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded stacked wafers and methods of electroplating bonded stacked...
- Patent number 9,331,048
- Issue date May 3, 2016
- Maxim Integrated Products, Inc.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of forming coaxial feedthroughs for 3D integrated circuits
- Patent number 9,184,113
- Issue date Nov 10, 2015
- Maxim Integrated Products, Inc.
- Uppili Sridhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High rate deposition method of magnetic nanocomposites
- Patent number 9,023,422
- Issue date May 5, 2015
- Maxim Integrated Products, Inc.
- Uppili Sridhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded stacked wafers and methods of electroplating bonded stacked...
- Patent number 8,970,043
- Issue date Mar 3, 2015
- Maxim Integrated Products, Inc.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optimal acoustic impedance materials for polished substrate coating...
- Patent number 8,952,768
- Issue date Feb 10, 2015
- TriQuint Semiconductor, Inc.
- Edward Martin Godshalk
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Methods of forming coaxial feedthroughs for 3D integrated circuits
- Patent number 8,940,631
- Issue date Jan 27, 2015
- Maxim Integrated Products, Inc.
- Uppili Sridhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip package with shielded structures
- Patent number 8,686,543
- Issue date Apr 1, 2014
- Maxim Integrated Products, Inc.
- Albert Bergemont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimal acoustic impedance materials for polished substrate coating...
- Patent number 8,512,800
- Issue date Aug 20, 2013
- TriQuint Semiconductor, Inc.
- Edward Martin Godshalk
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Bonded wafer package module
- Patent number 7,863,699
- Issue date Jan 4, 2011
- TriQuint Semiconductor, Inc.
- Hans Dropmann
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wafer level packaging process
- Patent number 7,393,758
- Issue date Jul 1, 2008
- Maxim Integrated Products, Inc.
- Uppili Sridhar
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
BONDED STACKED WAFERS AND METHODS OF ELECTROPLATING BONDED STACKED...
- Publication number 20150132891
- Publication date May 14, 2015
- Maxim Integrated Products, Inc.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC DEVICE UTILIZING NANOCOMPOSITE FILMS LAYERED WITH ADHESIVES
- Publication number 20140347157
- Publication date Nov 27, 2014
- Georgia Tech Research Corporation
- Markondeya Raj Pulugurtha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optimal Acoustic Impedance Materials for Polished Substrate Coating...
- Publication number 20130335169
- Publication date Dec 19, 2013
- TriQuint Semiconductor, Inc.
- Edward Martin Godshalk
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
3D CHIP PACKAGE WITH SHIELDED STRUCTURES
- Publication number 20130105950
- Publication date May 2, 2013
- MAXIM INTEGRATED PRODUCTS, INC.
- Albert Bergemont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STACKED WAFERS AND METHODS OF ELECTROPLATING BONDED STACKED...
- Publication number 20120193808
- Publication date Aug 2, 2012
- MAXIM INTEGRATED PRODUCTS, INC.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PREVENTING CONTACT STICTION IN MICRO RELAYS
- Publication number 20120194306
- Publication date Aug 2, 2012
- MAXIM INTEGRATED PRODUCTS, INC.
- Uppili Sridhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Wafer Package Module
- Publication number 20090289722
- Publication date Nov 26, 2009
- MAXIM INTEGRATED PRODUCTS, INC.
- Hans Dropmann
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Optimal Acoustic Impedance Materials for Polished Substrate Coating...
- Publication number 20090142480
- Publication date Jun 4, 2009
- MAXIM INTEGRATED PRODUCTS, INC.
- Edward Martin Godshalk
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Wafer level packaging process
- Publication number 20070099395
- Publication date May 3, 2007
- Uppili Sridhar
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Uppili Sridhar

Person

Patents Grantslast 30 patents

Controlling the morphology in metal loaded paste material

Bonded stacked wafers and methods of electroplating bonded stacked...

Methods of forming coaxial feedthroughs for 3D integrated circuits

High rate deposition method of magnetic nanocomposites

Bonded stacked wafers and methods of electroplating bonded stacked...

Optimal acoustic impedance materials for polished substrate coating...

Methods of forming coaxial feedthroughs for 3D integrated circuits

3D chip package with shielded structures

Optimal acoustic impedance materials for polished substrate coating...

Bonded wafer package module

Wafer level packaging process

Patents Applicationslast 30 patents

BONDED STACKED WAFERS AND METHODS OF ELECTROPLATING BONDED STACKED...

MAGNETIC DEVICE UTILIZING NANOCOMPOSITE FILMS LAYERED WITH ADHESIVES

Optimal Acoustic Impedance Materials for Polished Substrate Coating...

3D CHIP PACKAGE WITH SHIELDED STRUCTURES

BONDED STACKED WAFERS AND METHODS OF ELECTROPLATING BONDED STACKED...

PREVENTING CONTACT STICTION IN MICRO RELAYS

Bonded Wafer Package Module

Optimal Acoustic Impedance Materials for Polished Substrate Coating...

Wafer level packaging process