Uri Cohen

Person

Palo Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Metallic interconnects products
- Patent number 10,096,547
- Issue date Oct 9, 2018
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for activating openings for jets electroplating
- Patent number 9,911,614
- Issue date Mar 6, 2018
- Uri Cohen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Seed layers for metallic interconnects
- Patent number 9,673,090
- Issue date Jun 6, 2017
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed electroplating metallic conductors
- Patent number 9,530,653
- Issue date Dec 27, 2016
- Uri Cohen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplated metallic conductors
- Patent number 9,273,409
- Issue date Mar 1, 2016
- Uri Cohen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Enhanced electrochemical deposition filling
- Patent number 8,685,221
- Issue date Apr 1, 2014
- Uri Cohen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Floating semiconductor foils
- Patent number 8,603,242
- Issue date Dec 10, 2013
- Uri Cohen
- C30 - CRYSTAL GROWTH
Information Patent Grant
Seed layers for metallic interconnects and products
- Patent number 8,586,471
- Issue date Nov 19, 2013
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating Si and/or Ge foils
- Patent number 8,501,139
- Issue date Aug 6, 2013
- Uri Cohen
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Apparatus for enhanced electrochemical deposition
- Patent number 8,349,149
- Issue date Jan 8, 2013
- Uri Cohen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for making interconnect seed layers and products
- Patent number 8,123,861
- Issue date Feb 28, 2012
- Seed Layers Technology, LLC
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for interconnect passivation
- Patent number 7,709,958
- Issue date May 4, 2010
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for depositing seed layers
- Patent number 7,682,496
- Issue date Mar 23, 2010
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods for their fabrication
- Patent number 7,573,133
- Issue date Aug 11, 2009
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced seed layers for interconnects
- Patent number 7,550,386
- Issue date Jun 23, 2009
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple seed layers for interconnects
- Patent number 7,282,445
- Issue date Oct 16, 2007
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filling high aspect ratio openings by enhanced electrochemical depo...
- Patent number 7,247,563
- Issue date Jul 24, 2007
- Uri Cohen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Seed layers for metallic interconnects
- Patent number 7,199,052
- Issue date Apr 3, 2007
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced seed layery for metallic interconnects
- Patent number 7,105,434
- Issue date Sep 12, 2006
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making multiple seed layers for metallic interconnects
- Patent number 6,924,226
- Issue date Aug 2, 2005
- Uri Cohen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Combined conformal/non-conformal seed layers for metallic interconn...
- Patent number 6,903,016
- Issue date Jun 7, 2005
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced electrochemical deposition (ECD) filling of high aspect ra...
- Patent number 6,869,515
- Issue date Mar 22, 2005
- Uri Cohen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for pattern-etching alumina layers and products
- Patent number 6,635,184
- Issue date Oct 21, 2003
- Uri Cohen
- G11 - INFORMATION STORAGE
Information Patent Grant
Seed layers for interconnects and methods and apparatus for their f...
- Patent number 6,610,151
- Issue date Aug 26, 2003
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple seed layers for metallic interconnects
- Patent number 6,518,668
- Issue date Feb 11, 2003
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching gap-vias in a magnetic thin film head and product
- Patent number 6,391,212
- Issue date May 21, 2002
- Uri Cohen
- G11 - INFORMATION STORAGE
Information Patent Grant
Low-noise toroidal thin film head with solenoidal coil
- Patent number 6,195,232
- Issue date Feb 27, 2001
- Torohead, Inc.
- Uri Cohen
- G11 - INFORMATION STORAGE
Information Patent Grant
Seed layers for interconnects and methods for fabricating such seed...
- Patent number 6,136,707
- Issue date Oct 24, 2000
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating thin film magnetic head including crater fo...
- Patent number 6,059,984
- Issue date May 9, 2000
- Seagate Technology, Inc.
- Uri Cohen
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Thin film heads having solenoid coils
- Patent number 5,995,342
- Issue date Nov 30, 1999
- Torohead, Inc.
- Uri Cohen
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
High Speed Electroplating Metallic Conductors
- Publication number 20160141178
- Publication date May 19, 2016
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroplated Metallic Conductors
- Publication number 20150233005
- Publication date Aug 20, 2015
- Uri Cohen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Metallic Interconnects Products
- Publication number 20150155239
- Publication date Jun 4, 2015
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Void-Free Metallic Filled High Aspect Ratio Openings
- Publication number 20140197537
- Publication date Jul 17, 2014
- Uri Cohen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ENHANCED ELECTROCHEMICAL DEPOSITION FILLING
- Publication number 20140103538
- Publication date Apr 17, 2014
- Uri Cohen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplated Metallic Interconnects And Products
- Publication number 20140061919
- Publication date Mar 6, 2014
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEED LAYERS FOR METALLIC INTERCONNECTS AND PRODUCTS
- Publication number 20120126409
- Publication date May 24, 2012
- SEED LAYERS TECHNOLOGY, LLC
- URI COHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus For Making Interconnect Seed Layers And Products
- Publication number 20110068470
- Publication date Mar 24, 2011
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Floating Semiconductor Foils
- Publication number 20100288189
- Publication date Nov 18, 2010
- Uri Cohen
- C30 - CRYSTAL GROWTH
Information Patent Application
Methods for Activating Openings for Jets Electroplating
- Publication number 20100243462
- Publication date Sep 30, 2010
- Uri Cohen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Methods for Passivating Metallic Interconnects
- Publication number 20100213614
- Publication date Aug 26, 2010
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Floating Si and/or Ge Foils
- Publication number 20100215560
- Publication date Aug 26, 2010
- Uri Cohen
- C30 - CRYSTAL GROWTH
Information Patent Application
Seed Layers for Electroplated Interconnects
- Publication number 20090239372
- Publication date Sep 24, 2009
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seed Layers for Metallic Interconnects
- Publication number 20090233440
- Publication date Sep 17, 2009
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Seed Layers for Interconnects
- Publication number 20080026569
- Publication date Jan 31, 2008
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for enhanced electrochemical deposition
- Publication number 20070289867
- Publication date Dec 20, 2007
- Uri Cohen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Multiple seed layers for interconnects
- Publication number 20070117379
- Publication date May 24, 2007
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and structures for interconnect passivation
- Publication number 20060249849
- Publication date Nov 9, 2006
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for depositing seed layers
- Publication number 20060166448
- Publication date Jul 27, 2006
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Filling high aspect ratio openings by enhanced electrochemical depo...
- Publication number 20050245084
- Publication date Nov 3, 2005
- Uri Cohen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Seed layers for metallic interconnects
- Publication number 20050148172
- Publication date Jul 7, 2005
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect structures and methods for their fabrication
- Publication number 20050127479
- Publication date Jun 16, 2005
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced seed layery for metallic interconnects
- Publication number 20050124153
- Publication date Jun 9, 2005
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for activating openings and for jets plating
- Publication number 20040084318
- Publication date May 6, 2004
- Uri Cohen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Combined conformal/non-conformal seed layers for metallic interconn...
- Publication number 20040087171
- Publication date May 6, 2004
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for making multiple seed layers for metallic interconnects
- Publication number 20030129828
- Publication date Jul 10, 2003
- Uri Cohen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Enhanced electrochemical deposition (ECD) filling of high aspect ra...
- Publication number 20020166773
- Publication date Nov 14, 2002
- Uri Cohen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Multiple seed layers for metallic interconnects
- Publication number 20010005056
- Publication date Jun 28, 2001
- Uri Cohen
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Metallic interconnects products

Methods for activating openings for jets electroplating

Seed layers for metallic interconnects

High speed electroplating metallic conductors

Electroplated metallic conductors

Enhanced electrochemical deposition filling

Floating semiconductor foils

Seed layers for metallic interconnects and products

Floating Si and/or Ge foils

Apparatus for enhanced electrochemical deposition

Apparatus for making interconnect seed layers and products

Methods and structures for interconnect passivation

Apparatus for depositing seed layers

Interconnect structures and methods for their fabrication

Advanced seed layers for interconnects

Multiple seed layers for interconnects

Filling high aspect ratio openings by enhanced electrochemical depo...

Seed layers for metallic interconnects

Advanced seed layery for metallic interconnects

Methods for making multiple seed layers for metallic interconnects

Combined conformal/non-conformal seed layers for metallic interconn...

Enhanced electrochemical deposition (ECD) filling of high aspect ra...

Method for pattern-etching alumina layers and products

Seed layers for interconnects and methods and apparatus for their f...

Multiple seed layers for metallic interconnects

Method for etching gap-vias in a magnetic thin film head and product

Low-noise toroidal thin film head with solenoidal coil

Seed layers for interconnects and methods for fabricating such seed...

Process for fabricating thin film magnetic head including crater fo...

Thin film heads having solenoid coils

Patents Applicationslast 30 patents

High Speed Electroplating Metallic Conductors

Electroplated Metallic Conductors

Metallic Interconnects Products

Void-Free Metallic Filled High Aspect Ratio Openings

ENHANCED ELECTROCHEMICAL DEPOSITION FILLING

Electroplated Metallic Interconnects And Products

SEED LAYERS FOR METALLIC INTERCONNECTS AND PRODUCTS

Apparatus For Making Interconnect Seed Layers And Products

Floating Semiconductor Foils

Methods for Activating Openings for Jets Electroplating

Methods for Passivating Metallic Interconnects

Floating Si and/or Ge Foils

Seed Layers for Electroplated Interconnects

Seed Layers for Metallic Interconnects

Advanced Seed Layers for Interconnects

Apparatus for enhanced electrochemical deposition

Multiple seed layers for interconnects

Methods and structures for interconnect passivation

Apparatus for depositing seed layers

Filling high aspect ratio openings by enhanced electrochemical depo...

Seed layers for metallic interconnects

Interconnect structures and methods for their fabrication

Advanced seed layery for metallic interconnects

Methods and apparatus for activating openings and for jets plating

Combined conformal/non-conformal seed layers for metallic interconn...

Methods for making multiple seed layers for metallic interconnects

Enhanced electrochemical deposition (ECD) filling of high aspect ra...

Multiple seed layers for metallic interconnects