Usman M. Chaudhry

Person

Richardson, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
QFN device having a mechanism that enables an inspectable solder jo...
- Patent number 12,087,673
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hall-effect sensor package with added current path
- Patent number 11,557,722
- Issue date Jan 17, 2023
- Texas Instruments Incorporated
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package for integrated circuits and related methods
- Patent number 11,538,717
- Issue date Dec 27, 2022
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
QFN device having a mechanism that enables an inspectable solder jo...
- Patent number 11,495,524
- Issue date Nov 8, 2022
- Texas Instruments Incorporated
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hall-effect sensor package with added current path
- Patent number 10,892,405
- Issue date Jan 12, 2021
- Texas Instruments Incorporated
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package for integrated circuits and related methods
- Patent number 10,861,741
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Metal plugged substrates with no adhesive between metal and polyimide
- Patent number 8,471,155
- Issue date Jun 25, 2013
- Texas Instruments Incorporated
- Donald C Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 7,918,018
- Issue date Apr 5, 2011
- Texas Instruments Incorporated
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HYBRID CHIP CARRIER PACKAGE
- Publication number 20240128170
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Built-In Serial Via Chain for Integrity Monitoring of Laminate Subs...
- Publication number 20230352387
- Publication date Nov 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN Device Having A Mechanism That Enables An Inspectable Solder Jo...
- Publication number 20230057405
- Publication date Feb 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALL-EFFECT SENSOR PACKAGE WITH ADDED CURRENT PATH
- Publication number 20210159403
- Publication date May 27, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE FOR INTEGRATED CIRCUITS AND RELATED METHODS
- Publication number 20210090940
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HALL-EFFECT SENSOR PACKAGE WITH ADDED CURRENT PATH
- Publication number 20200357987
- Publication date Nov 12, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Ming Li
- G01 - MEASURING TESTING
Information Patent Application
QFN Device Having A Mechanism That Enables An Inspectable Solder Jo...
- Publication number 20190378783
- Publication date Dec 12, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Abram Castro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND STRUCTURE TO ELIMINATE SUBSTRATE COUPLING IN COMMON DRAI...
- Publication number 20190206741
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Anindya PODDAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE FOR INTEGRATED CIRCUITS AND RELATED METHODS
- Publication number 20190164807
- Publication date May 30, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Metal Plugged Substrates with No Adhesive Between Metal and Polyimide
- Publication number 20110147934
- Publication date Jun 23, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal plugged substrates with no adhesive between metal and polyimide
- Publication number 20080307644
- Publication date Dec 18, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Usman M. Chaudhry

Person

Patents Grantslast 30 patents

QFN device having a mechanism that enables an inspectable solder jo...

Hall-effect sensor package with added current path

Electronic package for integrated circuits and related methods

QFN device having a mechanism that enables an inspectable solder jo...

Hall-effect sensor package with added current path

Electronic package for integrated circuits and related methods

Metal plugged substrates with no adhesive between metal and polyimide

Method of fabricating a semiconductor device

Patents Applicationslast 30 patents

HYBRID CHIP CARRIER PACKAGE

Built-In Serial Via Chain for Integrity Monitoring of Laminate Subs...

QFN Device Having A Mechanism That Enables An Inspectable Solder Jo...

HALL-EFFECT SENSOR PACKAGE WITH ADDED CURRENT PATH

ELECTRONIC PACKAGE FOR INTEGRATED CIRCUITS AND RELATED METHODS

HALL-EFFECT SENSOR PACKAGE WITH ADDED CURRENT PATH

QFN Device Having A Mechanism That Enables An Inspectable Solder Jo...

METHOD AND STRUCTURE TO ELIMINATE SUBSTRATE COUPLING IN COMMON DRAI...

ELECTRONIC PACKAGE FOR INTEGRATED CIRCUITS AND RELATED METHODS

Metal Plugged Substrates with No Adhesive Between Metal and Polyimide

Metal plugged substrates with no adhesive between metal and polyimide