Vamsi Paruchuri

Person

Clifton Park, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ultrathin multilayer metal alloy liner for nano Cu interconnects
- Patent number 11,177,167
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Daniel Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Complementary metal oxide semiconductor replacement gate high-k met...
- Patent number 10,930,566
- Issue date Feb 23, 2021
- International Business Machines Corporation
- Lisa F. Edge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin multilayer metal alloy liner for nano Cu interconnects
- Patent number 10,643,890
- Issue date May 5, 2020
- International Business Machines Corporation
- Daniel Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Complementary metal oxide semiconductor replacement gate high-k met...
- Patent number 10,573,565
- Issue date Feb 25, 2020
- International Business Machines Corporation
- Lisa F. Edge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complementary metal oxide semiconductor replacement gate high-K met...
- Patent number 10,304,746
- Issue date May 28, 2019
- International Business Machines Corporation
- Lisa F. Edge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-forming barrier for subtractive copper
- Patent number 10,008,449
- Issue date Jun 26, 2018
- International Business Machines Corporation
- Theodorus E. Standaert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement gate electrode with multi-thickness conductive metallic...
- Patent number 9,881,797
- Issue date Jan 30, 2018
- International Business Machines Corporation
- Hemanth Jagannathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-forming barrier for subtractive copper
- Patent number 9,721,893
- Issue date Aug 1, 2017
- International Business Machines Corporation
- Theodorus E. Standaert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin cut enabling single diffusion breaks
- Patent number 9,589,845
- Issue date Mar 7, 2017
- International Business Machines Corporation
- Hemanth Jagannathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Changing effective work function using ion implantation during dual...
- Patent number 9,564,505
- Issue date Feb 7, 2017
- GLOBALFOUNDRIES Inc.
- Michael P. Chudzik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complementary metal oxide semiconductor replacement gate high-k met...
- Patent number 9,490,255
- Issue date Nov 8, 2016
- International Business Machines Corporation
- Lisa F. Edge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-forming barrier for subtractive copper
- Patent number 9,449,874
- Issue date Sep 20, 2016
- International Business Machines Corporation
- Theodorus E. Standaert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding for 3D device packaging fabrication
- Patent number 9,412,629
- Issue date Aug 9, 2016
- GLOBALFOUNDRIES Inc.
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Locally raised epitaxy for improved contact by local silicon cappin...
- Patent number 9,305,883
- Issue date Apr 5, 2016
- GLOBALFOUNDRIES Inc.
- Sebastian Naczas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-K/metal gate stack using capping layer methods, IC and related...
- Patent number 9,236,314
- Issue date Jan 12, 2016
- GLOBALFOUNDRIES, INC.
- Michael P. Chudzik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement gate electrode with multi-thickness conductive metallic...
- Patent number 9,202,698
- Issue date Dec 1, 2015
- International Business Machines Corporation
- Hemanth Jagannathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method to obtain EOT scaled dielectric stacks
- Patent number 9,059,314
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Hemanth Jagannathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclical physical vapor deposition of dielectric layers
- Patent number 9,053,926
- Issue date Jun 9, 2015
- International Business Machines Corporation
- Paul Jamison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion/etching protection in integration circuit fabrications
- Patent number 9,054,109
- Issue date Jun 9, 2015
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Locally raised epitaxy for improved contact by local silicon cappin...
- Patent number 8,999,779
- Issue date Apr 7, 2015
- International Business Machines Corporation
- Sebastian Naczas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer dielectric structures for semiconductor nano-devices
- Patent number 8,981,466
- Issue date Mar 17, 2015
- International Business Machines Corporation
- Alfred Grill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer dielectric structures for semiconductor nano-devices
- Patent number 8,980,715
- Issue date Mar 17, 2015
- International Business Machines Corporation
- Alfred Grill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for electroplating on SOI and bulk semiconduct...
- Patent number 8,926,805
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Veeraraghavan S. Basker
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Changing effective work function using ion implantation during dual...
- Patent number 8,753,936
- Issue date Jun 17, 2014
- International Business Machines Corporation
- Michael P. Chudzik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement gate electrode with multi-thickness conductive metallic...
- Patent number 8,741,757
- Issue date Jun 3, 2014
- International Business Machines Corporation
- Hemanth Jagannathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for enabling multiple Vt devices using high-K metal gate...
- Patent number 8,680,623
- Issue date Mar 25, 2014
- International Business Machines Corporation
- Martin M. Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for flatband voltage tuning of high-k field ef...
- Patent number 8,658,501
- Issue date Feb 25, 2014
- International Business Machines Corporation
- Supratik Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gate CMOS with at least a single gate metal and dual gate die...
- Patent number 8,569,844
- Issue date Oct 29, 2013
- International Business Machines Corporation
- Bruce B. Doris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for electroplating on soi and bulk semiconduct...
- Patent number 8,551,313
- Issue date Oct 8, 2013
- International Business Machines Corporation
- Veeraraghavan S. Basker
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of forming switching device having a molybdenum oxynitride m...
- Patent number 8,518,766
- Issue date Aug 27, 2013
- International Business Machines Corporation
- Nestor A. Bojarczuk
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPLEMENTARY METAL OXIDE SEMICONDUCTOR REPLACEMENT GATE HIGH-K MET...
- Publication number 20200144134
- Publication date May 7, 2020
- International Business Machines Corporation
- Lisa F. Edge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEMENTARY METAL OXIDE SEMICONDUCTOR REPLACEMENT GATE HIGH-K MET...
- Publication number 20190189524
- Publication date Jun 20, 2019
- International Business Machines Corporation
- Lisa F. Edge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMING BARRIER FOR SUBTRACTIVE COPPER
- Publication number 20170256498
- Publication date Sep 7, 2017
- International Business Machines Corporation
- Theodorus E. Standaert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEMENTARY METAL OXIDE SEMICONDUCTOR REPLACEMENT GATE HIGH-K MET...
- Publication number 20170154825
- Publication date Jun 1, 2017
- International Business Machines Corporation
- Lisa F. Edge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMING BARRIER FOR SUBTRACTIVE COPPER
- Publication number 20170005039
- Publication date Jan 5, 2017
- International Business Machines Corporation
- Theodorus E. Standaert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRATHIN MULTILAYER METAL ALLOY LINER FOR NANO CU INTERCONNECTS
- Publication number 20160276216
- Publication date Sep 22, 2016
- International Business Machines Corporation
- Daniel Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ULTRATHIN MULTILAYER METAL ALLOY LINER FOR NANO CU INTERCONNECTS
- Publication number 20160276280
- Publication date Sep 22, 2016
- International Business Machines Corporation
- Daniel Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ULTRATHIN MULTILAYER METAL ALLOY LINER FOR NANO CU INTERCONNECTS
- Publication number 20160268160
- Publication date Sep 15, 2016
- International Business Machines Corporation
- DANIEL EDELSTEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultrathin Multilayer Metal Alloy Liner for Nano Cu Interconnects
- Publication number 20150357236
- Publication date Dec 10, 2015
- International Business Machines Corporation
- Daniel Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STRUCTURE AND METHOD TO OBTAIN EOT SCALED DIELECTRIC STACKS
- Publication number 20150311303
- Publication date Oct 29, 2015
- International Business Machines Corporation
- Hemanth Jagannathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO OBTAIN EOT SCALED DIELECTRIC STACKS
- Publication number 20150311127
- Publication date Oct 29, 2015
- International Business Machines Corporation
- Hemanth Jagannathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO OBTAIN EOT SCALED DIELECTRIC STACKS
- Publication number 20150279746
- Publication date Oct 1, 2015
- International Business Machines Corporation
- Hemanth Jagannathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO OBTAIN EOT SCALED DIELECTRIC STACKS
- Publication number 20150279937
- Publication date Oct 1, 2015
- International Business Machines Corporation
- Hemanth Jagannathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALLY RAISED EPITAXY FOR IMPROVED CONTACT BY LOCAL SILICON CAPPIN...
- Publication number 20150179576
- Publication date Jun 25, 2015
- International Business Machines Corporation
- Sebastian Naczas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALLY RAISED EPITAXY FOR IMPROVED CONTACT BY LOCAL SILICON CAPPIN...
- Publication number 20150069531
- Publication date Mar 12, 2015
- International Business Machines Corporation
- Sebastian Naczas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CYCLICAL PHYSICAL VAPOR DEPOSITION OF DIELECTRIC LAYERS
- Publication number 20140273425
- Publication date Sep 18, 2014
- CANON ANELVA CORPORATION
- Paul Jamison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER DIELECTRIC STRUCTURES FOR SEMICONDUCTOR NANO-DEVICES
- Publication number 20140256153
- Publication date Sep 11, 2014
- International Business Machines Corporation
- Alfred Grill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER DIELECTRIC STRUCTURES FOR SEMICONDUCTOR NANO-DEVICES
- Publication number 20140252502
- Publication date Sep 11, 2014
- International Business Machines Corporation
- Alfred Grill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHANGING EFFECTIVE WORK FUNCTION USING ION IMPLANTATION DURING DUAL...
- Publication number 20140225199
- Publication date Aug 14, 2014
- International Business Machines Corporation
- Michael P. Chudzik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET HYBRID FULL METAL GATE WITH BORDERLESS CONTACTS
- Publication number 20140162447
- Publication date Jun 12, 2014
- International Business Machines Corporation
- Lisa F. Edge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT GATE ELECTRODE WITH MULTI-THICKNESS CONDUCTIVE METALLIC...
- Publication number 20140117466
- Publication date May 1, 2014
- International Business Machines Corporation
- Hemanth Jagannathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING FOR 3D DEVICE PACKAGING FABRICATION
- Publication number 20140113433
- Publication date Apr 24, 2014
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORROSION/ETCHING PROTECTION IN INTEGRATION CIRCUIT FABRICATIONS
- Publication number 20130320544
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT GATE ELECTRODE WITH MULTI-THICKNESS CONDUCTIVE METALLIC...
- Publication number 20130221441
- Publication date Aug 29, 2013
- INTERNATIONAL BUSINESS MACHINES CORPORATION
- Hemanth Jagannathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT GATE ELECTRODE WITH MULTI-THICKNESS CONDUCTIVE METALLIC...
- Publication number 20130224939
- Publication date Aug 29, 2013
- INTERNATIONAL BUSINESS MACHINES CORPORATION
- Hemanth Jagannathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT GATE ELECTRODE WITH A TANTALUM ALLOY METAL LAYER
- Publication number 20130217220
- Publication date Aug 22, 2013
- International Business Machines Corporation
- Hemanth Jagannathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT GATE ELECTRODE WITH A TANTALUM ALLOY METAL LAYER
- Publication number 20130214364
- Publication date Aug 22, 2013
- International Business Machines Corporation
- Hemanth Jagannathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO OBTAIN EOT SCALED DIELECTRIC STACKS
- Publication number 20130005156
- Publication date Jan 3, 2013
- International Business Machines Corporation
- Hemanth Jagannathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING ON SOI AND BULK SEMICONDUCT...
- Publication number 20120318666
- Publication date Dec 20, 2012
- International Business Machines Corporation
- Veeraraghavan S. Basker
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SWITCHING DEVICE HAVING A MOLYBDENUM OXYNITRIDE METAL GATE
- Publication number 20120270385
- Publication date Oct 25, 2012
- International Business Machines Corporation
- Nestor A. Bojarczuk
- H01 - BASIC ELECTRIC ELEMENTS

Vamsi Paruchuri

Person

Patents Grantslast 30 patents

Ultrathin multilayer metal alloy liner for nano Cu interconnects

Complementary metal oxide semiconductor replacement gate high-k met...

Ultrathin multilayer metal alloy liner for nano Cu interconnects

Complementary metal oxide semiconductor replacement gate high-k met...

Complementary metal oxide semiconductor replacement gate high-K met...

Self-forming barrier for subtractive copper

Replacement gate electrode with multi-thickness conductive metallic...

Self-forming barrier for subtractive copper

Fin cut enabling single diffusion breaks

Changing effective work function using ion implantation during dual...

Complementary metal oxide semiconductor replacement gate high-k met...

Self-forming barrier for subtractive copper

Wafer bonding for 3D device packaging fabrication

Locally raised epitaxy for improved contact by local silicon cappin...

High-K/metal gate stack using capping layer methods, IC and related...

Replacement gate electrode with multi-thickness conductive metallic...

Structure and method to obtain EOT scaled dielectric stacks

Cyclical physical vapor deposition of dielectric layers

Corrosion/etching protection in integration circuit fabrications

Locally raised epitaxy for improved contact by local silicon cappin...

Multilayer dielectric structures for semiconductor nano-devices

Multilayer dielectric structures for semiconductor nano-devices

Method and apparatus for electroplating on SOI and bulk semiconduct...

Changing effective work function using ion implantation during dual...

Replacement gate electrode with multi-thickness conductive metallic...

Techniques for enabling multiple Vt devices using high-K metal gate...

Method and apparatus for flatband voltage tuning of high-k field ef...

Metal gate CMOS with at least a single gate metal and dual gate die...

Method and apparatus for electroplating on soi and bulk semiconduct...

Method of forming switching device having a molybdenum oxynitride m...

Patents Applicationslast 30 patents

COMPLEMENTARY METAL OXIDE SEMICONDUCTOR REPLACEMENT GATE HIGH-K MET...

COMPLEMENTARY METAL OXIDE SEMICONDUCTOR REPLACEMENT GATE HIGH-K MET...

SELF-FORMING BARRIER FOR SUBTRACTIVE COPPER

COMPLEMENTARY METAL OXIDE SEMICONDUCTOR REPLACEMENT GATE HIGH-K MET...

SELF-FORMING BARRIER FOR SUBTRACTIVE COPPER

ULTRATHIN MULTILAYER METAL ALLOY LINER FOR NANO CU INTERCONNECTS

ULTRATHIN MULTILAYER METAL ALLOY LINER FOR NANO CU INTERCONNECTS

ULTRATHIN MULTILAYER METAL ALLOY LINER FOR NANO CU INTERCONNECTS

Ultrathin Multilayer Metal Alloy Liner for Nano Cu Interconnects

STRUCTURE AND METHOD TO OBTAIN EOT SCALED DIELECTRIC STACKS

STRUCTURE AND METHOD TO OBTAIN EOT SCALED DIELECTRIC STACKS

STRUCTURE AND METHOD TO OBTAIN EOT SCALED DIELECTRIC STACKS

STRUCTURE AND METHOD TO OBTAIN EOT SCALED DIELECTRIC STACKS

LOCALLY RAISED EPITAXY FOR IMPROVED CONTACT BY LOCAL SILICON CAPPIN...

LOCALLY RAISED EPITAXY FOR IMPROVED CONTACT BY LOCAL SILICON CAPPIN...

CYCLICAL PHYSICAL VAPOR DEPOSITION OF DIELECTRIC LAYERS

MULTILAYER DIELECTRIC STRUCTURES FOR SEMICONDUCTOR NANO-DEVICES

MULTILAYER DIELECTRIC STRUCTURES FOR SEMICONDUCTOR NANO-DEVICES

CHANGING EFFECTIVE WORK FUNCTION USING ION IMPLANTATION DURING DUAL...

FINFET HYBRID FULL METAL GATE WITH BORDERLESS CONTACTS

REPLACEMENT GATE ELECTRODE WITH MULTI-THICKNESS CONDUCTIVE METALLIC...

WAFER BONDING FOR 3D DEVICE PACKAGING FABRICATION

CORROSION/ETCHING PROTECTION IN INTEGRATION CIRCUIT FABRICATIONS

REPLACEMENT GATE ELECTRODE WITH MULTI-THICKNESS CONDUCTIVE METALLIC...

REPLACEMENT GATE ELECTRODE WITH MULTI-THICKNESS CONDUCTIVE METALLIC...

REPLACEMENT GATE ELECTRODE WITH A TANTALUM ALLOY METAL LAYER

REPLACEMENT GATE ELECTRODE WITH A TANTALUM ALLOY METAL LAYER

STRUCTURE AND METHOD TO OBTAIN EOT SCALED DIELECTRIC STACKS

METHOD AND APPARATUS FOR ELECTROPLATING ON SOI AND BULK SEMICONDUCT...

SWITCHING DEVICE HAVING A MOLYBDENUM OXYNITRIDE METAL GATE