Vance D. Archer, III

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Greensboro, NC, US

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Patents Grantslast 30 patents

Information Patent Grant
Routing under bond pad for the replacement of an interconnect layer
- Patent number 8,319,343
- Issue date Nov 27, 2012
- Agere Systems LLC
- Vance D. Archer, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal monitoring and management of integrated circuits
- Patent number 7,973,544
- Issue date Jul 5, 2011
- Agere Systems Inc.
- Vance D. Archer, III
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit device incorporating metallurgical bond to enhan...
- Patent number 7,429,502
- Issue date Sep 30, 2008
- Agere Systems, INC
- Vance D. Archer, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device incorporating metallurigical bond to enha...
- Patent number 7,327,029
- Issue date Feb 5, 2008
- Agere Systems, INC
- Vance D. Archer, III
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL MONITORING AND MANAGEMENT OF INTEGRATED CIRCUITS
- Publication number 20100045326
- Publication date Feb 25, 2010
- Agere Systems Inc.
- Vance D. Archer, III
- G01 - MEASURING TESTING