Vernon M. Williams

Person

Meridian, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Reinforced, self-aligning conductive structures for semiconductor d...
- Patent number 7,557,452
- Issue date Jul 7, 2009
- Micron Technology, Inc.
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Standoffs for centralizing internals in packaging process
- Patent number 7,501,309
- Issue date Mar 10, 2009
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standoffs for centralizing internals in packaging process
- Patent number 7,462,510
- Issue date Dec 9, 2008
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standoffs for centralizing internals in packaging process
- Patent number 7,459,797
- Issue date Dec 2, 2008
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standoffs for centralizing internals in packaging process
- Patent number 7,323,767
- Issue date Jan 29, 2008
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for consolidating previously unconsolidated conductive mate...
- Patent number 7,273,802
- Issue date Sep 25, 2007
- Micron Technology, Inc.
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframe and method for reducing mold compound adhesion problems
- Patent number 7,264,456
- Issue date Sep 4, 2007
- Micron Technology, Inc.
- Vernon M. Williams
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Heat sinks including nonlinear passageways
- Patent number 7,239,015
- Issue date Jul 3, 2007
- Micron Technology, Inc.
- Vernon M. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmed material consolidation methods for fabricating heat sinks
- Patent number 7,205,654
- Issue date Apr 17, 2007
- Micron Technology, Inc.
- Vernon M. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmed material consolidation methods for fabricating printed c...
- Patent number 7,137,193
- Issue date Nov 21, 2006
- Micron Technology, Inc.
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframe and method for removing cleaning compound flash from mold...
- Patent number 7,029,256
- Issue date Apr 18, 2006
- Micron Technology, Inc.
- Vernon M. Williams
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Stereolithographic method for fabricating heat sinks, stereolithogr...
- Patent number 7,026,191
- Issue date Apr 11, 2006
- Micron Technology, Inc.
- Vernon M. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective consolidation processes for electrically connecting conta...
- Patent number 6,977,211
- Issue date Dec 20, 2005
- Micron Technology, Inc.
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transfer molding and underfilling apparatus
- Patent number 6,863,516
- Issue date Mar 8, 2005
- Micron Technology, Inc.
- Vernon M. Williams
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Transfer molding and underfilling method and apparatus including or...
- Patent number 6,838,319
- Issue date Jan 4, 2005
- Micron Technology, Inc.
- Vernon M. Williams
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Transfer molding and underfilling method and apparatus
- Patent number 6,830,954
- Issue date Dec 14, 2004
- Micron Technology, Inc.
- Vernon M. Williams
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Stereolithographically fabricated conductive elements, semiconducto...
- Patent number 6,815,253
- Issue date Nov 9, 2004
- Micron Technology, Inc.
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stereolithographic methods for securing conductive elements to cont...
- Patent number 6,780,744
- Issue date Aug 24, 2004
- Micron Technology, Inc.
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stereolithographically fabricated conductive elements, semiconducto...
- Patent number 6,767,815
- Issue date Jul 27, 2004
- Micron Technology, Inc.
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stereolithographic methods for fabricating conductive elements
- Patent number 6,764,935
- Issue date Jul 20, 2004
- Micron Technology, Inc.
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stereolithographically fabricated conductive elements, semiconducto...
- Patent number 6,764,933
- Issue date Jul 20, 2004
- Micron Technology, Inc.
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stereolithographic method for fabricating heat sinks, stereolithogr...
- Patent number 6,730,998
- Issue date May 4, 2004
- Micron Technology, Inc.
- Vernon M. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing cleaning compound flash from mold vents
- Patent number 6,666,997
- Issue date Dec 23, 2003
- Micron Technology, Inc.
- Vernon M. Williams
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Stereolithographically fabricated conductive elements, semiconducto...
- Patent number 6,632,732
- Issue date Oct 14, 2003
- Micron Technology, Inc.
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for finishing microelectronic device packages
- Patent number 6,602,430
- Issue date Aug 5, 2003
- Micron Technology, Inc.
- Steven P. Nally
- B24 - GRINDING POLISHING
Information Patent Grant
Method for packaging microelectronic substrates
- Patent number 6,558,600
- Issue date May 6, 2003
- Micron Technology, Inc.
- Vernon M. Williams
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Stereolithographically fabricated conductive elements, semiconducto...
- Patent number 6,500,746
- Issue date Dec 31, 2002
- Micron Technology, Inc.
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stereolithographically fabricated conductive elements, semiconducto...
- Patent number 6,468,891
- Issue date Oct 22, 2002
- Micron Technology, Inc.
- Vernon M. Williams
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods for fabricating reinforced, self-aligning conductive struct...
- Publication number 20070148817
- Publication date Jun 28, 2007
- Vernon M. Williams
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electrical connection methods employing corresponding, insulator-co...
- Publication number 20070148818
- Publication date Jun 28, 2007
- Vernon M. Williams
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Selective consolidation methods for fabricating semiconductor devic...
- Publication number 20070062033
- Publication date Mar 22, 2007
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Standoffs for centralizing internals in packaging process
- Publication number 20060292750
- Publication date Dec 28, 2006
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Standoffs for centralizing internals in packaging process
- Publication number 20060237832
- Publication date Oct 26, 2006
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe and method for reducing mold compound adhesion problems
- Publication number 20060082021
- Publication date Apr 20, 2006
- Vernon M. Williams
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flip-chip type semiconductor devices and conductive elements thereof
- Publication number 20050230843
- Publication date Oct 20, 2005
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive elements with adjacent, mutually adhered regions and sem...
- Publication number 20050230806
- Publication date Oct 20, 2005
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier substrates and conductive elements thereof
- Publication number 20050221531
- Publication date Oct 6, 2005
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Programmed material consolidation methods for fabricating heat sinks
- Publication number 20050148115
- Publication date Jul 7, 2005
- Vernon M. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for consolidating previously unconsolidated conductive mate...
- Publication number 20050026414
- Publication date Feb 3, 2005
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Standoffs for centralizing internals in packaging process
- Publication number 20050023562
- Publication date Feb 3, 2005
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective consolidation processes for electrically connecting conta...
- Publication number 20050006736
- Publication date Jan 13, 2005
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Programmed material consolidation methods for fabricating semicondu...
- Publication number 20040255458
- Publication date Dec 23, 2004
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Standoffs for centralizing internals in packaging process
- Publication number 20040169292
- Publication date Sep 2, 2004
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for finishing microelectronic device packages
- Publication number 20040104200
- Publication date Jun 3, 2004
- Steven P. Nally
- B24 - GRINDING POLISHING
Information Patent Application
Heat sinks including nonlinear passageways
- Publication number 20040036161
- Publication date Feb 26, 2004
- Vernon M. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stereolithographic methods for securing conductive elements to cont...
- Publication number 20040018709
- Publication date Jan 29, 2004
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for packaging microelectronic substrates
- Publication number 20030235663
- Publication date Dec 25, 2003
- Vernon M. Williams
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method and apparatus for packaging microelectronic substrates
- Publication number 20030209831
- Publication date Nov 13, 2003
- Vernon M. Williams
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Stereolithographic method for fabricating heat sinks, stereolithogr...
- Publication number 20030211657
- Publication date Nov 13, 2003
- Vernon M. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Standoffs for centralizing internals in packaging process
- Publication number 20030201525
- Publication date Oct 30, 2003
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stereolithographically fabricated conductive elements, semiconducto...
- Publication number 20030098470
- Publication date May 29, 2003
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Leadframe and method for reducing mold compound adhesion problems
- Publication number 20030067061
- Publication date Apr 10, 2003
- Vernon M. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe and method for removing cleaning compound flash from mold...
- Publication number 20030062642
- Publication date Apr 3, 2003
- Vernon M. Williams
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Leadframe and method for removing cleaning compound flash from mold...
- Publication number 20030062603
- Publication date Apr 3, 2003
- Vernon M. Williams
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Stereolithographically fabricated conductive elements, semiconducto...
- Publication number 20030045047
- Publication date Mar 6, 2003
- Vernon M. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stereolithographically fabricated conductive elements, semiconducto...
- Publication number 20020123213
- Publication date Sep 5, 2002
- Vernon M. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer molding and underfilling method and apparatus
- Publication number 20020115237
- Publication date Aug 22, 2002
- Vernon M. Williams
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Stereolithographically fabricated conductive elements, semiconducto...
- Publication number 20020111003
- Publication date Aug 15, 2002
- Vernon M. Williams
- H01 - BASIC ELECTRIC ELEMENTS

Vernon M. Williams

Person

Patents Grantslast 30 patents

Reinforced, self-aligning conductive structures for semiconductor d...

Standoffs for centralizing internals in packaging process

Standoffs for centralizing internals in packaging process

Standoffs for centralizing internals in packaging process

Standoffs for centralizing internals in packaging process

Methods for consolidating previously unconsolidated conductive mate...

Leadframe and method for reducing mold compound adhesion problems

Heat sinks including nonlinear passageways

Programmed material consolidation methods for fabricating heat sinks

Programmed material consolidation methods for fabricating printed c...

Leadframe and method for removing cleaning compound flash from mold...

Stereolithographic method for fabricating heat sinks, stereolithogr...

Selective consolidation processes for electrically connecting conta...

Transfer molding and underfilling apparatus

Transfer molding and underfilling method and apparatus including or...

Transfer molding and underfilling method and apparatus

Stereolithographically fabricated conductive elements, semiconducto...

Stereolithographic methods for securing conductive elements to cont...

Stereolithographically fabricated conductive elements, semiconducto...

Stereolithographic methods for fabricating conductive elements

Stereolithographically fabricated conductive elements, semiconducto...

Stereolithographic method for fabricating heat sinks, stereolithogr...

Method for removing cleaning compound flash from mold vents

Stereolithographically fabricated conductive elements, semiconducto...

Methods for finishing microelectronic device packages

Method for packaging microelectronic substrates

Stereolithographically fabricated conductive elements, semiconducto...

Stereolithographically fabricated conductive elements, semiconducto...

Patents Applicationslast 30 patents

Methods for fabricating reinforced, self-aligning conductive struct...

Electrical connection methods employing corresponding, insulator-co...

Selective consolidation methods for fabricating semiconductor devic...

Standoffs for centralizing internals in packaging process

Standoffs for centralizing internals in packaging process

Leadframe and method for reducing mold compound adhesion problems

Flip-chip type semiconductor devices and conductive elements thereof

Conductive elements with adjacent, mutually adhered regions and sem...

Carrier substrates and conductive elements thereof

Programmed material consolidation methods for fabricating heat sinks

Methods for consolidating previously unconsolidated conductive mate...

Standoffs for centralizing internals in packaging process

Selective consolidation processes for electrically connecting conta...

Programmed material consolidation methods for fabricating semicondu...

Standoffs for centralizing internals in packaging process

Methods for finishing microelectronic device packages

Heat sinks including nonlinear passageways

Stereolithographic methods for securing conductive elements to cont...

Method and apparatus for packaging microelectronic substrates

Method and apparatus for packaging microelectronic substrates

Stereolithographic method for fabricating heat sinks, stereolithogr...

Standoffs for centralizing internals in packaging process

Stereolithographically fabricated conductive elements, semiconducto...

Leadframe and method for reducing mold compound adhesion problems

Leadframe and method for removing cleaning compound flash from mold...

Leadframe and method for removing cleaning compound flash from mold...

Stereolithographically fabricated conductive elements, semiconducto...

Stereolithographically fabricated conductive elements, semiconducto...

Transfer molding and underfilling method and apparatus

Stereolithographically fabricated conductive elements, semiconducto...