Vernon Solberg

Person

Saratoga, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked microelectronic assemblies
- Patent number 7,149,095
- Issue date Dec 12, 2006
- Tessera, Inc.
- Michael Warner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked microelectronic assembly and method therefor
- Patent number 6,699,730
- Issue date Mar 2, 2004
- Tessers, Inc.
- Young Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant multichip package
- Patent number 6,313,528
- Issue date Nov 6, 2001
- Tessera, Inc.
- Vernon Solberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic assembly and method therefor
- Patent number 6,225,688
- Issue date May 1, 2001
- Tessera, Inc.
- Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant multichip package
- Patent number 6,147,401
- Issue date Nov 14, 2000
- Tessera, Inc.
- Vernon Solberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic assembly and method therefor
- Patent number 6,121,676
- Issue date Sep 19, 2000
- Tessera, Inc.
- Vernon Solberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a compliant multichip package
- Patent number 6,054,337
- Issue date Apr 25, 2000
- Tessera, Inc.
- Vernon Solberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making microelectronic assemblies
- Patent number 5,885,849
- Issue date Mar 23, 1999
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic connections with solid core joining units
- Patent number 5,801,446
- Issue date Sep 1, 1998
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stacked microelectronic assemblies having basal compliant layers
- Publication number 20060286717
- Publication date Dec 21, 2006
- Tessera, Inc.
- Vernon Solberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of making microelectronic assemblies including folded subst...
- Publication number 20030168725
- Publication date Sep 11, 2003
- Tessera, Inc.
- Michael Warner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked microelectronic assembly and method therefor
- Publication number 20010006252
- Publication date Jul 5, 2001
- Young Kim
- H01 - BASIC ELECTRIC ELEMENTS

Vernon Solberg

Person

Patents Grantslast 30 patents

Stacked microelectronic assemblies

Stacked microelectronic assembly and method therefor

Compliant multichip package

Stacked microelectronic assembly and method therefor

Compliant multichip package

Stacked microelectronic assembly and method therefor

Method of making a compliant multichip package

Methods of making microelectronic assemblies

Microelectronic connections with solid core joining units

Patents Applicationslast 30 patents

Stacked microelectronic assemblies having basal compliant layers

Methods of making microelectronic assemblies including folded subst...

Stacked microelectronic assembly and method therefor