Veronica A. Strong

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
High-density interconnects for integrated circuit packages
- Patent number 12,205,902
- Issue date Jan 21, 2025
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 11,942,334
- Issue date Mar 26, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die backend diodes for electrostatic discharge (ESD) protection
- Patent number 11,784,181
- Issue date Oct 10, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial redistribution layer in microelectronic assemblies havi...
- Patent number 11,749,628
- Issue date Sep 5, 2023
- Intel Corporation
- Adel A. Elsherbini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic package electrostatic discharge (ESD) protection
- Patent number 11,751,367
- Issue date Sep 5, 2023
- Intel Corporation
- Veronica Aleman Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless metal-defined thin pad first level interconnects for li...
- Patent number 11,728,258
- Issue date Aug 15, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zero-misalignment two-via structures
- Patent number 11,694,951
- Issue date Jul 4, 2023
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection in integrated circuits
- Patent number 11,676,918
- Issue date Jun 13, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure fabrication using grayscale lithography
- Patent number 11,664,303
- Issue date May 30, 2023
- Intel Corporation
- Johanna Swan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Electrostatic discharge protection in integrated circuits using pos...
- Patent number 11,621,236
- Issue date Apr 4, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading layer integrated within a composite IC die structure...
- Patent number 11,581,238
- Issue date Feb 14, 2023
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial redistribution layer in microelectronic assemblies havi...
- Patent number 11,527,501
- Issue date Dec 13, 2022
- Intel Corporation
- Adel A. Elsherbini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Zero-misalignment two-via structures using photoimageable dielectri...
- Patent number 11,502,037
- Issue date Nov 15, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual sided thermal management solutions for integrated circuit pack...
- Patent number 11,460,499
- Issue date Oct 4, 2022
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diodes for package substrate electrostatic discharge (ESD) protection
- Patent number 11,424,239
- Issue date Aug 23, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package spark gap structure
- Patent number 11,348,882
- Issue date May 31, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zero-misalignment two-via structures using photoimageable dielectri...
- Patent number 11,328,996
- Issue date May 10, 2022
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection in integrated circuits
- Patent number 11,296,040
- Issue date Apr 5, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection in integrated circuits using mat...
- Patent number 11,289,431
- Issue date Mar 29, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die backend diodes for electrostatic discharge (ESD) protection
- Patent number 11,264,373
- Issue date Mar 1, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless metal-defined thin pad first level interconnects for li...
- Patent number 11,257,745
- Issue date Feb 22, 2022
- Intel Corporation
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive contact structures for electrostatic discharge protectio...
- Patent number 11,239,155
- Issue date Feb 1, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zero-misalignment two-via structures
- Patent number 11,222,836
- Issue date Jan 11, 2022
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-integrated bistable switch for electrostatic discharge (ESD...
- Patent number 11,222,856
- Issue date Jan 11, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection in integrated circuits
- Patent number 11,189,580
- Issue date Nov 30, 2021
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package electrostatic discharge (ESD) protection
- Patent number 11,147,197
- Issue date Oct 12, 2021
- Intel Corporation
- Veronica Aleman Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density interconnects for integrated circuit packages
- Patent number 11,133,263
- Issue date Sep 28, 2021
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure fabrication using grayscale lithography
- Patent number 11,101,205
- Issue date Aug 24, 2021
- Intel Corporation
- Johanna Swan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading layer integrated within a composite IC die structure...
- Patent number 11,049,791
- Issue date Jun 29, 2021
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic interposers for integrated circuit packages
- Patent number 10,998,272
- Issue date May 4, 2021
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTE...
- Publication number 20240339381
- Publication date Oct 10, 2024
- Intel Corporation
- Hiroki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ASSISTED ETCHING OF DIELECTRICS IN IC DEVICES
- Publication number 20240063072
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT VIA-PAD AND VIA-PLANE STRUCTURES
- Publication number 20240006292
- Publication date Jan 4, 2024
- Intel Corporation
- Veronica Aleman Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURE INCLUDING DIE BONDING FILM BETWEEN EMBEDD...
- Publication number 20230317619
- Publication date Oct 5, 2023
- Intel Corporation
- Ravindranath V. Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR WITH INTEGRATED MAGNETICS
- Publication number 20230207493
- Publication date Jun 29, 2023
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATE-UP HYBRID STRUCTURES USING MODIFIED GLASS PATTERNING PROCESSES
- Publication number 20230207407
- Publication date Jun 29, 2023
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D ARRAYED GLASS-BASED MMWAVE AND THZ STRUCTURES
- Publication number 20230208010
- Publication date Jun 29, 2023
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSPENDED STRUCTURES IN GLASS USING MODIFIED GLASS PATTERNING PROCE...
- Publication number 20230207408
- Publication date Jun 29, 2023
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL INDUCTOR WITH PLATED HIGH RESISTIVITY AND HIGH PERMEABILITY...
- Publication number 20230207492
- Publication date Jun 29, 2023
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL INDUCTORS FABRICATED THROUGH A DRILL-LESS VIA PROCESS
- Publication number 20230207404
- Publication date Jun 29, 2023
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDEBAND ANTENNAS IN GLASS THROUGH DIRECT VIA FEEDING AND GLASS STA...
- Publication number 20230208009
- Publication date Jun 29, 2023
- Neelam PRABHU GAUNKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC FILM COATING FOR THROUGH GLASS VIAS AND PLANE SURFACE RO...
- Publication number 20230207332
- Publication date Jun 29, 2023
- Veronica STRONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BATTERIES WITHIN GLASS CORES OF PACKAGE SUBSTRATES
- Publication number 20230198058
- Publication date Jun 22, 2023
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY TECHNIQUES FOR GLASS SUBSTRATE WITH HIGH DENSITY SIG...
- Publication number 20230197592
- Publication date Jun 22, 2023
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE FOR INTEGR...
- Publication number 20230197620
- Publication date Jun 22, 2023
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS VIAS AND PLANES WITH REDUCED TAPERING
- Publication number 20230197541
- Publication date Jun 22, 2023
- Intel Corporation
- Veronica STRONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW LOSS MICROSTRIP AND STRIPLINE ROUTING WITH BLIND TRENCH VIAS FO...
- Publication number 20230197646
- Publication date Jun 22, 2023
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL REDISTRIBUTION LAYER IN MICROELECTRONIC ASSEMBLIES HAV...
- Publication number 20230074970
- Publication date Mar 9, 2023
- Intel Corporation
- Adel A. Elsherbini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SIGNAL AND GROUND VIAS IN A GLASS CORE TO CONTROL IMPEDANCE
- Publication number 20220416391
- Publication date Dec 29, 2022
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANGLED INTERCONNECT USING GLASS CORE TECHNOLOGY
- Publication number 20220415779
- Publication date Dec 29, 2022
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PACKAGE MAGNETIC SWITCHING USING GLASS CORE TECHNOLOGY
- Publication number 20220406991
- Publication date Dec 22, 2022
- Intel Corporation
- Neelam PRABHU GAUNKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDED GLASS INTERCONNECT DUAL DAMASCENE VIAS
- Publication number 20220406617
- Publication date Dec 22, 2022
- Intel Corporation
- Veronica STRONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH OPTICAL WAVEGUIDE IN A GLASS CORE
- Publication number 20220404568
- Publication date Dec 22, 2022
- Intel Corporation
- Aleksandar ALEKSOV
- G02 - OPTICS
Information Patent Application
RF FILTERS AND MULTIPLEXERS MANUFACTURED IN THE CORE OF A PACKAGE S...
- Publication number 20220407199
- Publication date Dec 22, 2022
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT SURFACE TRANSMISSION LINE WAVEGUIDES WITH VERTICAL GROUND P...
- Publication number 20220407202
- Publication date Dec 22, 2022
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE COMPONENTS IN A GLASS CORE OF A SUBSTRATE
- Publication number 20220407212
- Publication date Dec 22, 2022
- Intel Corporation
- Neelam PRABHU GAUNKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PACKAGE MMWAVE ANTENNAS AND LAUNCHERS USING GLASS CORE TECHNOLOGY
- Publication number 20220407216
- Publication date Dec 22, 2022
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS PACKAGE CORE WITH PLANAR STRUCTURES
- Publication number 20220406725
- Publication date Dec 22, 2022
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITORS IN A GLASS SUBSTRATE
- Publication number 20220406523
- Publication date Dec 22, 2022
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH GLASS CORE HAVING VERTICAL POWER PLANES FOR...
- Publication number 20220406696
- Publication date Dec 22, 2022
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS

Veronica A. Strong

Person

Patents Grantslast 30 patents

High-density interconnects for integrated circuit packages

Microelectronic assemblies having conductive structures with differ...

Die backend diodes for electrostatic discharge (ESD) protection

Sacrificial redistribution layer in microelectronic assemblies havi...

Microelectronic package electrostatic discharge (ESD) protection

Electroless metal-defined thin pad first level interconnects for li...

Zero-misalignment two-via structures

Electrostatic discharge protection in integrated circuits

Interconnection structure fabrication using grayscale lithography

Electrostatic discharge protection in integrated circuits using pos...

Heat spreading layer integrated within a composite IC die structure...

Sacrificial redistribution layer in microelectronic assemblies havi...

Zero-misalignment two-via structures using photoimageable dielectri...

Dual sided thermal management solutions for integrated circuit pack...

Diodes for package substrate electrostatic discharge (ESD) protection

Package spark gap structure

Zero-misalignment two-via structures using photoimageable dielectri...

Electrostatic discharge protection in integrated circuits

Electrostatic discharge protection in integrated circuits using mat...

Die backend diodes for electrostatic discharge (ESD) protection

Electroless metal-defined thin pad first level interconnects for li...

Conductive contact structures for electrostatic discharge protectio...

Zero-misalignment two-via structures

Package-integrated bistable switch for electrostatic discharge (ESD...

Electrostatic discharge protection in integrated circuits

Microelectronic package electrostatic discharge (ESD) protection

High-density interconnects for integrated circuit packages

Interconnection structure fabrication using grayscale lithography

Heat spreading layer integrated within a composite IC die structure...

Organic interposers for integrated circuit packages

Patents Applicationslast 30 patents

AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTE...

LASER ASSISTED ETCHING OF DIELECTRICS IN IC DEVICES

ALIGNMENT VIA-PAD AND VIA-PLANE STRUCTURES

MICROELECTRONIC STRUCTURE INCLUDING DIE BONDING FILM BETWEEN EMBEDD...

INDUCTOR WITH INTEGRATED MAGNETICS

PLATE-UP HYBRID STRUCTURES USING MODIFIED GLASS PATTERNING PROCESSES

3D ARRAYED GLASS-BASED MMWAVE AND THZ STRUCTURES

SUSPENDED STRUCTURES IN GLASS USING MODIFIED GLASS PATTERNING PROCE...

COAXIAL INDUCTOR WITH PLATED HIGH RESISTIVITY AND HIGH PERMEABILITY...

COAXIAL INDUCTORS FABRICATED THROUGH A DRILL-LESS VIA PROCESS

WIDEBAND ANTENNAS IN GLASS THROUGH DIRECT VIA FEEDING AND GLASS STA...

DIELECTRIC FILM COATING FOR THROUGH GLASS VIAS AND PLANE SURFACE RO...

EMBEDDED BATTERIES WITHIN GLASS CORES OF PACKAGE SUBSTRATES

POWER DELIVERY TECHNIQUES FOR GLASS SUBSTRATE WITH HIGH DENSITY SIG...

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE FOR INTEGR...

GLASS VIAS AND PLANES WITH REDUCED TAPERING

LOW LOSS MICROSTRIP AND STRIPLINE ROUTING WITH BLIND TRENCH VIAS FO...

SACRIFICIAL REDISTRIBUTION LAYER IN MICROELECTRONIC ASSEMBLIES HAV...

SIGNAL AND GROUND VIAS IN A GLASS CORE TO CONTROL IMPEDANCE

ANGLED INTERCONNECT USING GLASS CORE TECHNOLOGY

IN-PACKAGE MAGNETIC SWITCHING USING GLASS CORE TECHNOLOGY

DUAL SIDED GLASS INTERCONNECT DUAL DAMASCENE VIAS

PACKAGE WITH OPTICAL WAVEGUIDE IN A GLASS CORE

RF FILTERS AND MULTIPLEXERS MANUFACTURED IN THE CORE OF A PACKAGE S...

COMPACT SURFACE TRANSMISSION LINE WAVEGUIDES WITH VERTICAL GROUND P...

MILLIMETER WAVE COMPONENTS IN A GLASS CORE OF A SUBSTRATE

IN-PACKAGE MMWAVE ANTENNAS AND LAUNCHERS USING GLASS CORE TECHNOLOGY

GLASS PACKAGE CORE WITH PLANAR STRUCTURES

CAPACITORS IN A GLASS SUBSTRATE

PACKAGE SUBSTRATE WITH GLASS CORE HAVING VERTICAL POWER PLANES FOR...