Vijayeshwar Das Khanna

Person

Millwood, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Direct bonded heterogeneous integration silicon bridge
- Patent number 11,791,270
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Kamal K Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Server node connector mating condition health monitoring and reporting
- Patent number 11,570,928
- Issue date Jan 31, 2023
- International Business Machines Corporation
- Sri M Sri-Jayantha
- G08 - SIGNALLING
Information Patent Grant
Optimum warp in organic substrates
- Patent number 11,245,075
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Sri Sri-Jayantha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Server node connnector mating condition health monitoring and repor...
- Patent number 10,834,844
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Sri M Sri-Jayantha
- G01 - MEASURING TESTING
Information Patent Grant
Reduction of solder interconnect stress
- Patent number 10,276,534
- Issue date Apr 30, 2019
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating contacts of an electronic package structure t...
- Patent number 10,276,535
- Issue date Apr 30, 2019
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate substrate thermal warpage prediction for designing a lamin...
- Patent number 10,108,753
- Issue date Oct 23, 2018
- International Business Machines Corporation
- Anson J. Call
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reduction of solder interconnect stress
- Patent number 9,865,557
- Issue date Jan 9, 2018
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper feature design for warpage control of substrates
- Patent number 9,659,131
- Issue date May 23, 2017
- GLOBALFOUNDRIES Inc.
- Edmund Blackshear
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mechanism to attach a die to a substrate
- Patent number 9,630,269
- Issue date Apr 25, 2017
- GLOBALFOUNDRIES Inc.
- Vijayeshwar D. Khanna
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In-plane copper imbalance for warpage prediction
- Patent number 9,563,732
- Issue date Feb 7, 2017
- International Business Machines Corporation
- Anson J. Call
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for thermomechanically decoupling heatsink
- Patent number 9,550,258
- Issue date Jan 24, 2017
- GLOBALFOUNDRIES Inc.
- Sri M Sri-Jayantha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic components on trenched substrates and method of forming...
- Patent number 9,508,789
- Issue date Nov 29, 2016
- GLOBALFOUNDRIES Inc.
- David Questad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Constrained die adhesion cure process
- Patent number 9,305,894
- Issue date Apr 5, 2016
- GLOBALFOUNDRIES Inc.
- Edmund Blackshear
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Vacuum carriers for substrate bonding
- Patent number 9,227,261
- Issue date Jan 5, 2016
- GLOBALFOUNDRIES Inc.
- Vijayeshwar D. Khanna
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alignment of integrated circuit chip stack
- Patent number 9,171,742
- Issue date Oct 27, 2015
- GlobalFoundries U.S. 2 LLC
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper feature design for warpage control of substrates
- Patent number 9,105,535
- Issue date Aug 11, 2015
- International Business Machines Corporation
- Edmund Blackshear
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stress reduction means for warp control of substrates through clamping
- Patent number 8,685,833
- Issue date Apr 1, 2014
- International Business Machines Corporation
- Vijayeshwar D. Khanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative coefficient thermal expansion engineered particles for com...
- Patent number 8,624,152
- Issue date Jan 7, 2014
- International Business Machines Corporation
- Gareth G. Hougham
- B32 - LAYERED PRODUCTS
Information Patent Grant
Heat transfer device in a rotating structure
- Patent number 8,322,980
- Issue date Dec 4, 2012
- International Business Machines Corporation
- Vijayeshwar D. Khanna
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Negative coefficient thermal expansion engineered particles for com...
- Patent number 8,138,448
- Issue date Mar 20, 2012
- International Business Machines Corporation
- Gareth G. Hougham
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method to extract and apply circuit features in organic substrate f...
- Patent number 8,127,255
- Issue date Feb 28, 2012
- International Business Machines Corporation
- Hien Phu Dang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic components on trenched substrates and method of forming...
- Patent number 8,054,630
- Issue date Nov 8, 2011
- International Business Machines Corporation
- David Questad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate having pattern-matched metal layers
- Patent number 7,901,998
- Issue date Mar 8, 2011
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat transfer device in a rotating structure
- Patent number 7,896,611
- Issue date Mar 1, 2011
- International Business Machines Corporation
- Vijayeshwar D. Khanna
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Electronic components on trenched substrates and method of forming...
- Patent number 7,855,430
- Issue date Dec 21, 2010
- International Business Machines Corporation
- David Questad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for a pull test for controlled collapse chip c...
- Patent number 7,819,027
- Issue date Oct 26, 2010
- International Business Machines Corporation
- Virendra R. Jadhav
- G01 - MEASURING TESTING
Information Patent Grant
Electronic components on trenched substrates and method of forming...
- Patent number 7,777,301
- Issue date Aug 17, 2010
- International Business Machines Corporation
- David Questad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate having pattern-matched metal layers
- Patent number 7,759,787
- Issue date Jul 20, 2010
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic components on trenched substrates and method of forming...
- Patent number 7,732,894
- Issue date Jun 8, 2010
- International Business Machines Corporation
- David Questad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SILICON THERMALIZER FOR CRYOGENIC MICROWAVE APPLICATION USING A COP...
- Publication number 20240230202
- Publication date Jul 11, 2024
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON THERMALIZER FOR CRYOGENIC MICROWAVE APPLICATION USING A COP...
- Publication number 20240133609
- Publication date Apr 25, 2024
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER CREEP LIMITING RIGID SPACER FOR STACKED DIE C4 PACKAGING
- Publication number 20230058638
- Publication date Feb 23, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION SILICON BRIDGE
- Publication number 20220359401
- Publication date Nov 10, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMUM WARP IN ORGANIC SUBSTRATES
- Publication number 20210367152
- Publication date Nov 25, 2021
- International Business Machines Corporation
- Sri Sri-Jayantha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SERVER NODE CONNNECTOR MATING CONDITION HEALTH MONITORING AND REPOR...
- Publication number 20200389994
- Publication date Dec 10, 2020
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- G01 - MEASURING TESTING
Information Patent Application
SERVER NODE CONNNECTOR MATING CONDITION HEALTH MONITORING AND REPOR...
- Publication number 20200146172
- Publication date May 7, 2020
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCTION OF SOLDER INTERCONNECT STRESS
- Publication number 20180061799
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF SOLDER INTERCONNECT STRESS
- Publication number 20180061800
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE SUBSTRATE THERMAL WARPAGE PREDICTION FOR DESIGNING A LAMIN...
- Publication number 20170351783
- Publication date Dec 7, 2017
- International Business Machines Corporation
- Anson J. Call
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONSTRAINED DIE ADHESION CURE PROCESS
- Publication number 20160211161
- Publication date Jul 21, 2016
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Feature Design for Warpage Control of Substrates
- Publication number 20150317423
- Publication date Nov 5, 2015
- International Business Machines Corporation
- Edmund Blackshear
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MECHANISM TO ATTACH A DIE TO A SUBSTRATE
- Publication number 20150118799
- Publication date Apr 30, 2015
- International Business Machines Corporation
- Vijayeshwar D. KHANNA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VACUUM CARRIERS FOR SUBSTRATE BONDING
- Publication number 20150041524
- Publication date Feb 12, 2015
- International Business Machines Corporation
- Vijayeshwar D. Khanna
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
ALIGNMENT OF INTEGRATED CIRCUIT CHIP STACK
- Publication number 20150024549
- Publication date Jan 22, 2015
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR THERMOMECHANICALLY DECOUPLING HEATSINK
- Publication number 20150000868
- Publication date Jan 1, 2015
- International Business Machines Corporation
- Sri M Sri-Jayantha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR THERMOMECHANICALLY DECOUPLING HEATSINK
- Publication number 20150000097
- Publication date Jan 1, 2015
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONSTRAINED DIE ADHESION CURE PROCESS
- Publication number 20140359995
- Publication date Dec 11, 2014
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING...
- Publication number 20140151849
- Publication date Jun 5, 2014
- International Business Machines Corporation
- David Questad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Feature Design for Warpage Control of Substrates
- Publication number 20130334711
- Publication date Dec 19, 2013
- International Business Machines Corporation
- Edmund Blackshear
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRESS REDUCTION MEANS FOR WARP CONTROL OF SUBSTRATES THROUGH CLAMPING
- Publication number 20130260534
- Publication date Oct 3, 2013
- International Business Machines Corporation
- Vijayeshwar D. Khanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conformal Coining of Solder Joints in Electronic Packages
- Publication number 20120309187
- Publication date Dec 6, 2012
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEGATIVE COEFFICIENT THERMAL EXPANSION ENGINEERED PARTICLES FOR COM...
- Publication number 20120121906
- Publication date May 17, 2012
- International Business Machines Corporation
- Gareth G. Hougham
- B32 - LAYERED PRODUCTS
Information Patent Application
HEAT TRANSFER DEVICE IN A ROTATING STRUCTURE
- Publication number 20110123318
- Publication date May 26, 2011
- International Business Machines Corporation
- Vijayeshwar D. Khanna
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
PACKAGING SUBSTRATE HAVING PATTERN-MATCHED METAL LAYERS
- Publication number 20100218364
- Publication date Sep 2, 2010
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Organic Substrate with Asymmetric Thickness for Warp Mitigation
- Publication number 20090265028
- Publication date Oct 22, 2009
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NEGATIVE COEFFICIENT THERMAL EXPANSION ENGINEERED PARTICLES FOR COM...
- Publication number 20090169886
- Publication date Jul 2, 2009
- International Business Machines Corporation
- Gareth G. Hougham
- B32 - LAYERED PRODUCTS
Information Patent Application
PACKAGING SUBSTRATE HAVING PATTERN-MATCHED METAL LAYERS
- Publication number 20090114429
- Publication date May 7, 2009
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING...
- Publication number 20090085161
- Publication date Apr 2, 2009
- International Business Machines Corporation
- David Questad
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD AND STRUCTURE FOR A PULL TEST FOR CONTROLLED COLLAPSE CHIP C...
- Publication number 20080313879
- Publication date Dec 25, 2008
- International Business Machines Corporation
- Virendra R. Jadhav
- G01 - MEASURING TESTING

Vijayeshwar Das Khanna

Person

Patents Grantslast 30 patents

Direct bonded heterogeneous integration silicon bridge

Server node connector mating condition health monitoring and reporting

Optimum warp in organic substrates

Server node connnector mating condition health monitoring and repor...

Reduction of solder interconnect stress

Method of fabricating contacts of an electronic package structure t...

Laminate substrate thermal warpage prediction for designing a lamin...

Reduction of solder interconnect stress

Copper feature design for warpage control of substrates

Mechanism to attach a die to a substrate

In-plane copper imbalance for warpage prediction

Method and system for thermomechanically decoupling heatsink

Electronic components on trenched substrates and method of forming...

Constrained die adhesion cure process

Vacuum carriers for substrate bonding

Alignment of integrated circuit chip stack

Copper feature design for warpage control of substrates

Stress reduction means for warp control of substrates through clamping

Negative coefficient thermal expansion engineered particles for com...

Heat transfer device in a rotating structure

Negative coefficient thermal expansion engineered particles for com...

Method to extract and apply circuit features in organic substrate f...

Electronic components on trenched substrates and method of forming...

Packaging substrate having pattern-matched metal layers

Heat transfer device in a rotating structure

Electronic components on trenched substrates and method of forming...

Method and structure for a pull test for controlled collapse chip c...

Electronic components on trenched substrates and method of forming...

Packaging substrate having pattern-matched metal layers

Electronic components on trenched substrates and method of forming...

Patents Applicationslast 30 patents

SILICON THERMALIZER FOR CRYOGENIC MICROWAVE APPLICATION USING A COP...

SILICON THERMALIZER FOR CRYOGENIC MICROWAVE APPLICATION USING A COP...

SOLDER CREEP LIMITING RIGID SPACER FOR STACKED DIE C4 PACKAGING

DIRECT BONDED HETEROGENEOUS INTEGRATION SILICON BRIDGE

OPTIMUM WARP IN ORGANIC SUBSTRATES

SERVER NODE CONNNECTOR MATING CONDITION HEALTH MONITORING AND REPOR...

SERVER NODE CONNNECTOR MATING CONDITION HEALTH MONITORING AND REPOR...

REDUCTION OF SOLDER INTERCONNECT STRESS

REDUCTION OF SOLDER INTERCONNECT STRESS

LAMINATE SUBSTRATE THERMAL WARPAGE PREDICTION FOR DESIGNING A LAMIN...

CONSTRAINED DIE ADHESION CURE PROCESS

Copper Feature Design for Warpage Control of Substrates

MECHANISM TO ATTACH A DIE TO A SUBSTRATE

VACUUM CARRIERS FOR SUBSTRATE BONDING

ALIGNMENT OF INTEGRATED CIRCUIT CHIP STACK

METHOD AND SYSTEM FOR THERMOMECHANICALLY DECOUPLING HEATSINK

METHOD AND SYSTEM FOR THERMOMECHANICALLY DECOUPLING HEATSINK

CONSTRAINED DIE ADHESION CURE PROCESS

ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING...

Copper Feature Design for Warpage Control of Substrates

STRESS REDUCTION MEANS FOR WARP CONTROL OF SUBSTRATES THROUGH CLAMPING

Conformal Coining of Solder Joints in Electronic Packages

NEGATIVE COEFFICIENT THERMAL EXPANSION ENGINEERED PARTICLES FOR COM...

HEAT TRANSFER DEVICE IN A ROTATING STRUCTURE

PACKAGING SUBSTRATE HAVING PATTERN-MATCHED METAL LAYERS

Organic Substrate with Asymmetric Thickness for Warp Mitigation

NEGATIVE COEFFICIENT THERMAL EXPANSION ENGINEERED PARTICLES FOR COM...

PACKAGING SUBSTRATE HAVING PATTERN-MATCHED METAL LAYERS

ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING...

METHOD AND STRUCTURE FOR A PULL TEST FOR CONTROLLED COLLAPSE CHIP C...