Vikas Rao

Person

Bangalore, IN

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal solutions for package on package (PoP) architectures
- Patent number 11,538,731
- Issue date Dec 27, 2022
- Intel Corporation
- Bijendra Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor with visual indicator
- Patent number 11,340,287
- Issue date May 24, 2022
- Intel Corporation
- Ramaswamy Parthasarathy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe connector for a probing pad structure around a thermal attach...
- Patent number 10,656,177
- Issue date May 19, 2020
- Intel Corporation
- Vikas Rao
- G01 - MEASURING TESTING
Information Patent Grant
Probe connector for a probing pad structure around a thermal attach...
- Patent number 10,317,428
- Issue date Jun 11, 2019
- Intel Corporation
- Vikas Rao
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
COLD PLATES FOR SECONDARY SIDE COMPONENTS OF PRINTED CIRCUIT BOARDS
- Publication number 20230422389
- Publication date Dec 28, 2023
- Intel Corporation
- Prabhakar Subrahmanyam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL CONDUCTION BAND FOR IMPROVED MOBILE COMPUTING DEVICE PERFOR...
- Publication number 20230035081
- Publication date Feb 2, 2023
- Intel Corporation
- Smit Kapila
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL SOLUTIONS FOR PACKAGE ON PACKAGE (POP) ARCHITECTURES
- Publication number 20200312736
- Publication date Oct 1, 2020
- Intel Corporation
- Bijendra SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR WITH VISUAL INDICATOR
- Publication number 20200033401
- Publication date Jan 30, 2020
- Intel Corporation
- Ramaswamy PARTHASARATHY
- G01 - MEASURING TESTING
Information Patent Application
PROBE CONNECTOR FOR A PROBING PAD STRUCTURE AROUND A THERMAL ATTACH...
- Publication number 20190271720
- Publication date Sep 5, 2019
- Intel Corporation
- Vikas Rao
- G01 - MEASURING TESTING
Information Patent Application
PROBE CONNECTOR FOR A PROBING PAD STRUCTURE AROUND A THERMAL ATTACH...
- Publication number 20180120347
- Publication date May 3, 2018
- Intel Corporation
- Vikas Rao
- G01 - MEASURING TESTING
Information Patent Application
MULTI-SOCKET MEMORY MODULE T-CONNECTOR
- Publication number 20140065881
- Publication date Mar 6, 2014
- S. Vinay
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Thermal solutions for package on package (PoP) architectures

Capacitor with visual indicator

Probe connector for a probing pad structure around a thermal attach...

Probe connector for a probing pad structure around a thermal attach...

Patents Applicationslast 30 patents

COLD PLATES FOR SECONDARY SIDE COMPONENTS OF PRINTED CIRCUIT BOARDS

THERMAL CONDUCTION BAND FOR IMPROVED MOBILE COMPUTING DEVICE PERFOR...

THERMAL SOLUTIONS FOR PACKAGE ON PACKAGE (POP) ARCHITECTURES

CAPACITOR WITH VISUAL INDICATOR

PROBE CONNECTOR FOR A PROBING PAD STRUCTURE AROUND A THERMAL ATTACH...

PROBE CONNECTOR FOR A PROBING PAD STRUCTURE AROUND A THERMAL ATTACH...

MULTI-SOCKET MEMORY MODULE T-CONNECTOR