VIKAS S. SHILIMKAR

Person

CHANDLER, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged power amplifier device with air cavity over die
- Patent number 12,328,107
- Issue date Jun 10, 2025
- NXP USA, INC.
- Kevin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged power amplifier device
- Patent number 12,327,805
- Issue date Jun 10, 2025
- NXP USA, INC.
- Kevin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact transistor utilizing shield structure arrangement
- Patent number 12,237,257
- Issue date Feb 25, 2025
- NXP USA, INC.
- Vikas Shilimkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with integrated passive components
- Patent number 12,159,845
- Issue date Dec 3, 2024
- NXP USA, INC.
- Humayun Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with center fed gate
- Patent number 11,804,527
- Issue date Oct 31, 2023
- NXP USA, INC.
- Vikas Shilimkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules with flip-chip and non-flip-chip power tran...
- Patent number 11,587,852
- Issue date Feb 21, 2023
- NXP USA, INC.
- Vikas Shilimkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact RFIC with stacked inductor and capacitor
- Patent number 11,522,506
- Issue date Dec 6, 2022
- NXP B.V.
- Vikas Shilimkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF amplifiers with series-coupled output bondwire arrays and shunt...
- Patent number 11,476,209
- Issue date Oct 18, 2022
- NXP B.V.
- Vikas Shilimkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact transistor utilizing shield structure arrangement
- Patent number 11,177,207
- Issue date Nov 16, 2021
- NXP USA, INC.
- Vikas Shilimkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internally-shielded microelectronic packages and methods for the fa...
- Patent number 10,861,774
- Issue date Dec 8, 2020
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with shield structure, packaged device, and method of fa...
- Patent number 10,672,703
- Issue date Jun 2, 2020
- NXP USA, INC.
- Vikas Shilimkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internally-shielded microelectronic packages and methods for the fa...
- Patent number 10,629,518
- Issue date Apr 21, 2020
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices with selectively arranged through substr...
- Patent number 10,574,198
- Issue date Feb 25, 2020
- NXP USA, INC.
- Vikas Shilimkar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electromagnetically-shielded microelectronic assemblies and methods...
- Patent number 10,506,704
- Issue date Dec 10, 2019
- NXP USA, INC.
- Ramanujam Srinidhi Embar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device with a conductive feature formed over a cavity and method th...
- Patent number 9,871,107
- Issue date Jan 16, 2018
- NXP USA, INC.
- Bruce M. Green
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER AMPLIFIER MODULE WITH INTERLEAVED WIREBONDS
- Publication number 20250119102
- Publication date Apr 10, 2025
- NXP USA, Inc.
- Vikas SHILIMKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER DEVICE HAVING VERTICAL DIE INTERCONNECT STRUCTURE
- Publication number 20240162861
- Publication date May 16, 2024
- NXP USA, Inc.
- Kevin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER DEVICE HAVING DIES WITH ELONGATED BONDPADS CONNECTE...
- Publication number 20240072740
- Publication date Feb 29, 2024
- NXP USA, Inc.
- Kevin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED POWER AMPLIFIER DEVICE
- Publication number 20240071960
- Publication date Feb 29, 2024
- NXP USA, Inc.
- Kevin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged power amplifier device with air cavity over die
- Publication number 20240072739
- Publication date Feb 29, 2024
- NXP USA, Inc.
- Kevin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR HEAT DISSIPATION STRUCTURE
- Publication number 20240055314
- Publication date Feb 15, 2024
- NXP B.V.
- Ljubo Radic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARMONIC TRAP FILTER WITH NON-UNIFORM RESONANCE FREQUENCY DISTRIBUTION
- Publication number 20230361726
- Publication date Nov 9, 2023
- NXP USA, Inc.
- Joseph Gerard Schultz
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
POWER AMPLIFIER MODULES, SYSTEMS, AND SUBSTRATES CONTAINING FIELD T...
- Publication number 20230291369
- Publication date Sep 14, 2023
- NXP USA, Inc.
- Kevin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR WITH INTEGRATED PASSIVE COMPONENTS
- Publication number 20230260935
- Publication date Aug 17, 2023
- NXP USA, Inc.
- Humayun KABIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistor With Center Fed Gate
- Publication number 20230019549
- Publication date Jan 19, 2023
- NXP USA, Inc.
- Vikas Shilimkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES WITH FLIP-CHIP AND NON-FLIP-CHIP POWER TRAN...
- Publication number 20220115298
- Publication date Apr 14, 2022
- NXP USA, Inc.
- Vikas Shilimkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT TRANSISTOR UTILIZING SHIELD STRUCTURE ARRANGEMENT
- Publication number 20220013451
- Publication date Jan 13, 2022
- NXP USA, Inc.
- Vikas Shilimkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT RFIC WITH STACKED INDUCTOR AND CAPACITOR
- Publication number 20210242840
- Publication date Aug 5, 2021
- NXP. B.V.
- Vikas SHILIMKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF AMPLIFIERS WITH SERIES-COUPLED OUTPUT BONDWIRE ARRAYS AND SHUNT...
- Publication number 20210225784
- Publication date Jul 22, 2021
- NXP B.V.
- Vikas SHILIMKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT TRANSISTOR UTILIZING SHIELD STRUCTURE ARRANGEMENT
- Publication number 20210193569
- Publication date Jun 24, 2021
- NXP USA, Inc.
- Vikas Shilimkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERNALLY-SHIELDED MICROELECTRONIC PACKAGES AND METHODS FOR THE FA...
- Publication number 20200211932
- Publication date Jul 2, 2020
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR WITH SHIELD STRUCTURE, PACKAGED DEVICE, AND METHOD OF FA...
- Publication number 20200098683
- Publication date Mar 26, 2020
- NXP USA, Inc.
- Vikas Shilimkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR, PACKAGED DEVICE, AND METHOD OF FABRICATION
- Publication number 20200098684
- Publication date Mar 26, 2020
- NXP USA, Inc.
- Vikas Shilimkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERNALLY-SHIELDED MICROELECTRONIC PACKAGES AND METHODS FOR THE FA...
- Publication number 20200075463
- Publication date Mar 5, 2020
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH SELECTIVELY ARRANGED THROUGH SUBSTR...
- Publication number 20180182717
- Publication date Jun 28, 2018
- NXP USA, INC.
- Vikas Shilimkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH A CONDUCTIVE FEATURE FORMED OVER A CAVITY AND METHOD TH...
- Publication number 20160343809
- Publication date Nov 24, 2016
- FREESCALE SEMICONDUCTOR, INC.
- BRUCE M. GREEN
- H01 - BASIC ELECTRIC ELEMENTS

VIKAS S. SHILIMKAR

Person

Patents Grantslast 30 patents

Packaged power amplifier device with air cavity over die

Packaged power amplifier device

Compact transistor utilizing shield structure arrangement

Transistor with integrated passive components

Transistor with center fed gate

Power amplifier modules with flip-chip and non-flip-chip power tran...

Compact RFIC with stacked inductor and capacitor

RF amplifiers with series-coupled output bondwire arrays and shunt...

Compact transistor utilizing shield structure arrangement

Internally-shielded microelectronic packages and methods for the fa...

Transistor with shield structure, packaged device, and method of fa...

Internally-shielded microelectronic packages and methods for the fa...

Integrated circuit devices with selectively arranged through substr...

Electromagnetically-shielded microelectronic assemblies and methods...

Device with a conductive feature formed over a cavity and method th...

Patents Applicationslast 30 patents

POWER AMPLIFIER MODULE WITH INTERLEAVED WIREBONDS

POWER AMPLIFIER DEVICE HAVING VERTICAL DIE INTERCONNECT STRUCTURE

POWER AMPLIFIER DEVICE HAVING DIES WITH ELONGATED BONDPADS CONNECTE...

PACKAGED POWER AMPLIFIER DEVICE

Packaged power amplifier device with air cavity over die

TRANSISTOR HEAT DISSIPATION STRUCTURE

HARMONIC TRAP FILTER WITH NON-UNIFORM RESONANCE FREQUENCY DISTRIBUTION

POWER AMPLIFIER MODULES, SYSTEMS, AND SUBSTRATES CONTAINING FIELD T...

TRANSISTOR WITH INTEGRATED PASSIVE COMPONENTS

Transistor With Center Fed Gate

POWER AMPLIFIER MODULES WITH FLIP-CHIP AND NON-FLIP-CHIP POWER TRAN...

COMPACT TRANSISTOR UTILIZING SHIELD STRUCTURE ARRANGEMENT

COMPACT RFIC WITH STACKED INDUCTOR AND CAPACITOR

RF AMPLIFIERS WITH SERIES-COUPLED OUTPUT BONDWIRE ARRAYS AND SHUNT...

COMPACT TRANSISTOR UTILIZING SHIELD STRUCTURE ARRANGEMENT

INTERNALLY-SHIELDED MICROELECTRONIC PACKAGES AND METHODS FOR THE FA...

TRANSISTOR WITH SHIELD STRUCTURE, PACKAGED DEVICE, AND METHOD OF FA...

TRANSISTOR, PACKAGED DEVICE, AND METHOD OF FABRICATION

INTERNALLY-SHIELDED MICROELECTRONIC PACKAGES AND METHODS FOR THE FA...

INTEGRATED CIRCUIT DEVICES WITH SELECTIVELY ARRANGED THROUGH SUBSTR...

DEVICE WITH A CONDUCTIVE FEATURE FORMED OVER A CAVITY AND METHOD TH...