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Vincent DICAPRIO
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Pleasanton, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Package core assembly and fabrication methods
Patent number
12,087,679
Issue date
Sep 10, 2024
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Modular mainframe layout for supporting multiple semiconductor proc...
Patent number
11,935,771
Issue date
Mar 19, 2024
Applied Materials, Inc.
Randy A. Harris
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Modular mainframe layout for supporting multiple semiconductor proc...
Patent number
11,935,770
Issue date
Mar 19, 2024
Applied Materials, Inc.
Randy A. Harris
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and fabrication methods
Patent number
11,887,934
Issue date
Jan 30, 2024
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package core assembly and fabrication methods
Patent number
11,881,447
Issue date
Jan 23, 2024
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package core assembly and fabrication methods
Patent number
11,862,546
Issue date
Jan 2, 2024
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
Patent number
11,715,700
Issue date
Aug 1, 2023
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and fabrication methods
Patent number
11,521,935
Issue date
Dec 6, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
Patent number
11,476,202
Issue date
Oct 18, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
Patent number
11,398,433
Issue date
Jul 26, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fine redistribution interconnect formation for advanced p...
Patent number
11,342,256
Issue date
May 24, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for via formation by micro-imprinting
Patent number
11,281,094
Issue date
Mar 22, 2022
Applied Materials, Inc.
Roman Gouk
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
Patent number
11,264,333
Issue date
Mar 1, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and fabrication methods
Patent number
11,264,331
Issue date
Mar 1, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure with embedded core
Patent number
10,937,726
Issue date
Mar 2, 2021
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and fabrication methods
Patent number
10,886,232
Issue date
Jan 5, 2021
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for via formation in flowable epoxy materials by micro-imprint
Patent number
10,727,083
Issue date
Jul 28, 2020
Applied Materials, Inc.
Roman Gouk
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Patents Applications
last 30 patents
Information
Patent Application
MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROC...
Publication number
20240194503
Publication date
Jun 13, 2024
Applied Materials, Inc.
Randy A. HARRIS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for collective dishing of singulated dies
Publication number
20240170452
Publication date
May 23, 2024
Anup PANCHOLI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BONDING OF SEMICONDUCTOR STRUCTURES TO ADVANCED SUBSTRATE PA...
Publication number
20240021571
Publication date
Jan 18, 2024
Anup PANCHOLI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
Publication number
20240021533
Publication date
Jan 18, 2024
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR ALTERING LITHOGRAPHIC PATTERNS TO ADJUST...
Publication number
20230304183
Publication date
Sep 28, 2023
Marvin Louis BERNT
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PACKAGE STRUCTURE AND FABRICATION METHODS
Publication number
20230187370
Publication date
Jun 15, 2023
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROC...
Publication number
20220262653
Publication date
Aug 18, 2022
Randy A. HARRIS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROC...
Publication number
20220262652
Publication date
Aug 18, 2022
Randy A. HARRIS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR VIA FORMATION BY MICRO-IMPRINTING
Publication number
20220171281
Publication date
Jun 2, 2022
Applied Materials, Inc.
Roman GOUK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE CORE ASSEMBLY AND FABRICATION METHODS
Publication number
20210257289
Publication date
Aug 19, 2021
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND FABRICATION METHODS
Publication number
20210257306
Publication date
Aug 19, 2021
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
Publication number
20210257307
Publication date
Aug 19, 2021
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE CORE ASSEMBLY AND FABRICATION METHODS
Publication number
20210249345
Publication date
Aug 12, 2021
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE CORE ASSEMBLY AND FABRICATION METHODS
Publication number
20210159160
Publication date
May 27, 2021
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE CORE ASSEMBLY AND FABRICATION METHODS
Publication number
20210159158
Publication date
May 27, 2021
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
Publication number
20200395306
Publication date
Dec 17, 2020
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
Publication number
20200395305
Publication date
Dec 17, 2020
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
Publication number
20200395304
Publication date
Dec 17, 2020
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND FABRICATION METHODS
Publication number
20200357749
Publication date
Nov 12, 2020
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND FABRICATION METHODS
Publication number
20200357750
Publication date
Nov 12, 2020
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FINE REDISTRIBUTION INTERCONNECT FORMATION FOR ADVANCED P...
Publication number
20200243432
Publication date
Jul 30, 2020
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR VIA FORMATION BY MICRO-IMPRINTING
Publication number
20200159113
Publication date
May 21, 2020
Applied Materials, Inc.
Roman GOUK
H01 - BASIC ELECTRIC ELEMENTS