Vincent Jarry

Person

La Membrolle Sur Choisille, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device including interposer substrate carrying mica subs...
- Patent number 11,575,172
- Issue date Feb 7, 2023
- STMicroelectronics (Tours) SAS
- Vincent Jarry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated flexible thin-film micro-batteries
- Patent number 11,251,478
- Issue date Feb 15, 2022
- STMicroelectronics (Tours) SAS
- Vincent Jarry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor device for geometrically testing parts
- Patent number 10,444,002
- Issue date Oct 15, 2019
- ACTIMESURE
- Samuel Tregret
- G01 - MEASURING TESTING
Information Patent Grant
Methods for encapsulating flexible thin-film micro-batteries to pro...
- Patent number 10,290,838
- Issue date May 14, 2019
- STMicroelectronics (Tours) SAS
- Vincent Jarry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a microbattery
- Patent number 9,356,310
- Issue date May 31, 2016
- STMicroelectronics (Tours) SAS
- Vincent Jarry
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for encapsulating electronic components on a wafer
- Patent number 8,785,297
- Issue date Jul 22, 2014
- STMicroelectronics (Tours) SAS
- Marc Feron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor chips from a semiconductor w...
- Patent number 8,772,134
- Issue date Jul 8, 2014
- STMicroelectronics (Tours) SAS
- Vincent Jarry
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for thinning and dicing electronic circuit wafers
- Patent number 8,486,763
- Issue date Jul 16, 2013
- STMicroelectronics (Tours) SAS
- Vincent Jarry
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing semiconductor chips from a semiconductor w...
- Patent number 8,409,967
- Issue date Apr 2, 2013
- STMicroelectronics (Tours) SAS
- Vincent Jarry
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Surface-mounted silicon chip
- Patent number 8,319,339
- Issue date Nov 27, 2012
- STMicroelectronics (Tours) SAS
- Christophe Serre
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for encapsulating electronic components on a wafer
- Patent number 8,309,403
- Issue date Nov 13, 2012
- STMicroelectronics (Tours) SAS
- Marc Feron
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BATTERY ENCAPSULATION METHOD
- Publication number 20220131215
- Publication date Apr 28, 2022
- STMicroelectronics (Tours) SAS
- Vincent Jarry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY ENCAPSULATION METHOD
- Publication number 20190229302
- Publication date Jul 25, 2019
- STMicroelectronics (Tours) SAS
- Vincent Jarry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR DEVICE FOR GEOMETRICALLY TESTING PARTS
- Publication number 20190011245
- Publication date Jan 10, 2019
- ACTIMESURE
- Samuel Tregret
- G01 - MEASURING TESTING
Information Patent Application
BATTERY ENCAPSULATON METHOD
- Publication number 20170069883
- Publication date Mar 9, 2017
- STMicroelectronics (Tours) SAS
- Vincent Jarry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A MICROBATTERY
- Publication number 20160240864
- Publication date Aug 18, 2016
- STMicroelectronics (Tours) SAS
- Vincent Jarry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A MICROBATTERY
- Publication number 20130216904
- Publication date Aug 22, 2013
- STMicroelectronics (Tours) SAS
- Vincent Jarry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CUTTING METHOD AND DEVICE
- Publication number 20130192435
- Publication date Aug 1, 2013
- STMicroelectronics (Tours) SAS
- Vincent Jarry
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS FROM A SEMICONDUCTOR W...
- Publication number 20130178017
- Publication date Jul 11, 2013
- STMicroelectronics (Tours) SAS
- Vincent Jarry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS ON A WAFER
- Publication number 20130043586
- Publication date Feb 21, 2013
- STMicroelectronics (Tours) SAS
- Marc Feron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THINNING AND DICING ELECTRONIC CIRCUIT WAFERS
- Publication number 20120149174
- Publication date Jun 14, 2012
- Vincent Jarry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP MANUFACTURING METHOD
- Publication number 20120009763
- Publication date Jan 12, 2012
- STMicroelectronics (Tours) SAS
- Vincent Jarry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS FROM A SEMICONDUCTOR W...
- Publication number 20110300647
- Publication date Dec 8, 2011
- STMicroelectronics (Tours) SAS
- Vincent Jarry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS ON A WAFER
- Publication number 20110124157
- Publication date May 26, 2011
- STMicroelectronics (Tours) SAS
- Marc Feron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE-MOUNTED SILICON CHIP
- Publication number 20110006423
- Publication date Jan 13, 2011
- STMicroelectronics (Tours) SAS
- Christophe Serre
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Connection ball positioning method and device for integrated circuits
- Publication number 20060134903
- Publication date Jun 22, 2006
- STMicroelectronics S.A.
- Mohamed Boufnichel
- H01 - BASIC ELECTRIC ELEMENTS

Vincent Jarry

Person

Patents Grantslast 30 patents

Electronic device including interposer substrate carrying mica subs...

Encapsulated flexible thin-film micro-batteries

Sensor device for geometrically testing parts

Methods for encapsulating flexible thin-film micro-batteries to pro...

Method for forming a microbattery

Method for encapsulating electronic components on a wafer

Method for manufacturing semiconductor chips from a semiconductor w...

Method for thinning and dicing electronic circuit wafers

Method for manufacturing semiconductor chips from a semiconductor w...

Surface-mounted silicon chip

Method for encapsulating electronic components on a wafer

Patents Applicationslast 30 patents

BATTERY ENCAPSULATION METHOD

BATTERY ENCAPSULATION METHOD

SENSOR DEVICE FOR GEOMETRICALLY TESTING PARTS

BATTERY ENCAPSULATON METHOD

METHOD FOR FORMING A MICROBATTERY

METHOD FOR FORMING A MICROBATTERY

WAFER CUTTING METHOD AND DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS FROM A SEMICONDUCTOR W...

METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS ON A WAFER

METHOD FOR THINNING AND DICING ELECTRONIC CIRCUIT WAFERS

SEMICONDUCTOR CHIP MANUFACTURING METHOD

METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS FROM A SEMICONDUCTOR W...

METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS ON A WAFER

SURFACE-MOUNTED SILICON CHIP

Connection ball positioning method and device for integrated circuits