Vinh H. DIEP

Person

Palo Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal flow assembly including integrated fan
- Patent number 11,297,732
- Issue date Apr 5, 2022
- Apple Inc.
- Eric R. Prather
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Combination parallel path heatsink and EMI shield
- Patent number 10,963,024
- Issue date Mar 30, 2021
- Apple Inc.
- Jonathan A. Matheson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal flow assembly including integrated fan
- Patent number 10,653,034
- Issue date May 12, 2020
- Apple Inc.
- Eric R. Prather
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Foldable case for use with an electronic device
- Patent number 10,591,956
- Issue date Mar 17, 2020
- Apple Inc.
- Matthew D. Rohrbach
- A45 - HAND OR TRAVELLING ARTICLES
Information Patent Grant
Electronic device with integrated passive and active cooling
- Patent number 10,285,303
- Issue date May 7, 2019
- Apple Inc.
- Reuben J. Williams
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Combination parallel path heatsink and EMI shield
- Patent number 10,061,363
- Issue date Aug 28, 2018
- Apple Inc.
- Jonathan A. Matheson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal flow assembly including integrated fan
- Patent number 10,034,411
- Issue date Jul 24, 2018
- Apple Inc.
- Eric R. Prather
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Foldable case for use with an electronic device
- Patent number 9,760,118
- Issue date Sep 12, 2017
- Apple Inc.
- Matthew D. Rohrbach
- A45 - HAND OR TRAVELLING ARTICLES
Information Patent Grant
Wireless electronic device with component cooling structures
- Patent number 9,612,632
- Issue date Apr 4, 2017
- Apple Inc.
- Vikas K. Sinha
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic device with component shielding structures and input-out...
- Patent number 9,408,334
- Issue date Aug 2, 2016
- Apple Inc.
- Vikas K. Sinha
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic device enclosures and heatsink structures with thermal m...
- Patent number 9,095,076
- Issue date Jul 28, 2015
- Apple Inc.
- Vinh Diep
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sinking and electromagnetic shielding structures
- Patent number 9,048,124
- Issue date Jun 2, 2015
- Apple Inc.
- Dominic E. Dolci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device enclosures and heatsink structures with thermal m...
- Patent number 8,760,868
- Issue date Jun 24, 2014
- Apple Inc.
- Vinh Diep
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Foldable case for use with an electronic device
- Patent number 8,672,126
- Issue date Mar 18, 2014
- Apple Inc.
- Matthew D. Rohrbach
- A45 - HAND OR TRAVELLING ARTICLES
Information Patent Grant
Component retention mechanism
- Patent number 8,493,740
- Issue date Jul 23, 2013
- Apple Inc.
- Vinh H. Diep
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component retention mechanism
- Patent number 7,995,350
- Issue date Aug 9, 2011
- Apple Inc.
- Vinh H. Diep
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Riser card housing
- Patent number 7,539,015
- Issue date May 26, 2009
- Apple Inc.
- Gregory Springer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Handset access mechanism and method
- Patent number 6,041,121
- Issue date Mar 21, 2000
- Harris Corporation
- Vinh Hew Diep
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
THERMAL FLOW ASSEMBLY INCLUDING INTEGRATED FAN
- Publication number 20210059071
- Publication date Feb 25, 2021
- Apple Inc.
- Eric R. PRATHER
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ELECTRONIC DEVICE WITH INTEGRATED PASSIVE AND ACTIVE COOLING
- Publication number 20190021184
- Publication date Jan 17, 2019
- Apple Inc.
- Reuben J. WILLIAMS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMBINATION PARALLEL PATH HEATSINK AND EMI SHIELD
- Publication number 20180348827
- Publication date Dec 6, 2018
- Apple Inc.
- Jonathan A. Matheson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL FLOW ASSEMBLY INCLUDING INTEGRATED FAN
- Publication number 20180324977
- Publication date Nov 8, 2018
- Apple Inc.
- Eric R. PRATHER
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
FOLDABLE CASE FOR USE WITH AN ELECTRONIC DEVICE
- Publication number 20180024591
- Publication date Jan 25, 2018
- Apple Inc.
- Matthew D. Rohrbach
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL FLOW ASSEMBLY INCLUDING INTEGRATED FAN
- Publication number 20170094835
- Publication date Mar 30, 2017
- Apple Inc.
- Eric R. PRATHER
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COMBINATION PARALLEL PATH HEATSINK AND EMI SHIELD
- Publication number 20170071074
- Publication date Mar 9, 2017
- Apple Inc.
- Jonathan A. Matheson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic Device With Component Shielding Structures and Input-Out...
- Publication number 20140321045
- Publication date Oct 30, 2014
- Apple Inc.
- Vikas K. Sinha
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Wireless Electronic Device With Component Cooling Structures
- Publication number 20140321046
- Publication date Oct 30, 2014
- Apple Inc.
- Vikas K. Sinha
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE ENCLOSURES AND HEATSINK STRUCTURES WITH THERMAL M...
- Publication number 20140293545
- Publication date Oct 2, 2014
- Apple Inc.
- Vinh Diep
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FOLDABLE CASE FOR USE WITH AN ELECTRONIC DEVICE
- Publication number 20140183068
- Publication date Jul 3, 2014
- Apple Inc.
- Matthew D. Rohrbach
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Heat Sinking and Electromagnetic Shielding Structures
- Publication number 20140078677
- Publication date Mar 20, 2014
- Dominic E. Dolci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE ENCLOSURES AND HEATSINK STRUCTURES WITH THERMAL M...
- Publication number 20130050943
- Publication date Feb 28, 2013
- Vinh Diep
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Device Enclosures with Engagement Features
- Publication number 20130050945
- Publication date Feb 28, 2013
- Vinh Diep
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPOSITE STRUCTURES WITH UNIDIRECTIONAL FIBERS
- Publication number 20110281044
- Publication date Nov 17, 2011
- Spyros Michail
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
COMPONENT RETENTION MECHANISM
- Publication number 20110261530
- Publication date Oct 27, 2011
- Apple Inc.
- Vinh H. DIEP
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FOLDABLE CASE FOR USE WITH AN ELECTRONIC DEVICE
- Publication number 20110163642
- Publication date Jul 7, 2011
- Apple Inc.
- Matthew D. Rohrbach
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPONENT RETENTION MECHANISM
- Publication number 20100088450
- Publication date Apr 8, 2010
- Apple Inc.
- Vinh H. DIEP
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RISER CARD HOUSING
- Publication number 20090034189
- Publication date Feb 5, 2009
- Gregory Springer
- G06 - COMPUTING CALCULATING COUNTING

Vinh H. DIEP

Person

Patents Grantslast 30 patents

Thermal flow assembly including integrated fan

Combination parallel path heatsink and EMI shield

Thermal flow assembly including integrated fan

Foldable case for use with an electronic device

Electronic device with integrated passive and active cooling

Combination parallel path heatsink and EMI shield

Thermal flow assembly including integrated fan

Foldable case for use with an electronic device

Wireless electronic device with component cooling structures

Electronic device with component shielding structures and input-out...

Electronic device enclosures and heatsink structures with thermal m...

Heat sinking and electromagnetic shielding structures

Electronic device enclosures and heatsink structures with thermal m...

Foldable case for use with an electronic device

Component retention mechanism

Component retention mechanism

Riser card housing

Handset access mechanism and method

Patents Applicationslast 30 patents

THERMAL FLOW ASSEMBLY INCLUDING INTEGRATED FAN

ELECTRONIC DEVICE WITH INTEGRATED PASSIVE AND ACTIVE COOLING

COMBINATION PARALLEL PATH HEATSINK AND EMI SHIELD

THERMAL FLOW ASSEMBLY INCLUDING INTEGRATED FAN

FOLDABLE CASE FOR USE WITH AN ELECTRONIC DEVICE

THERMAL FLOW ASSEMBLY INCLUDING INTEGRATED FAN

COMBINATION PARALLEL PATH HEATSINK AND EMI SHIELD

Electronic Device With Component Shielding Structures and Input-Out...

Wireless Electronic Device With Component Cooling Structures

ELECTRONIC DEVICE ENCLOSURES AND HEATSINK STRUCTURES WITH THERMAL M...

FOLDABLE CASE FOR USE WITH AN ELECTRONIC DEVICE

Heat Sinking and Electromagnetic Shielding Structures

ELECTRONIC DEVICE ENCLOSURES AND HEATSINK STRUCTURES WITH THERMAL M...

Electronic Device Enclosures with Engagement Features

COMPOSITE STRUCTURES WITH UNIDIRECTIONAL FIBERS

COMPONENT RETENTION MECHANISM

FOLDABLE CASE FOR USE WITH AN ELECTRONIC DEVICE

COMPONENT RETENTION MECHANISM

RISER CARD HOUSING