Vishnu Prasad

Person

Putzbrunn, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal contacts at periphery of integrated circuit packages
- Patent number 12,249,553
- Issue date Mar 11, 2025
- Intel Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with switchable heat path
- Patent number 10,091,866
- Issue date Oct 2, 2018
- Intel IP Corporation
- Sonja Koller
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20240395655
- Publication date Nov 28, 2024
- Intel Corporation
- Avi Tsarfati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS
- Publication number 20230317551
- Publication date Oct 5, 2023
- Intel Corporation
- Vishnu Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED TERMINAL DEVICE WITH SPLIT SIGNAL AND POWER ROUTING
- Publication number 20230317562
- Publication date Oct 5, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT AND HEAT PATH
- Publication number 20230317544
- Publication date Oct 5, 2023
- Intel Corporation
- Jan Proschwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACK COOLING WINGS
- Publication number 20230317681
- Publication date Oct 5, 2023
- Intel Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LAYERS FOR STRESS MONITORING AND METHOD
- Publication number 20230307300
- Publication date Sep 28, 2023
- Intel Corporation
- Jan Proschwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING NANOWIRE AND SOLDER INTERCONNECTS
- Publication number 20230299032
- Publication date Sep 21, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT
- Publication number 20230300975
- Publication date Sep 21, 2023
- Intel Corporation
- Jan Proschwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGING ARCHITECTURE WITH CONDUCTIVE VIAS ON INTERPOSER
- Publication number 20230282615
- Publication date Sep 7, 2023
- Intel Corporation
- Thomas Wagner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONTACTS AT PERIPHERY OF INTEGRATED CIRCUIT PACKAGES
- Publication number 20190393125
- Publication date Dec 26, 2019
- Intel IP Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLER INTERFACE HEAT TRANSFER SYSTEM AND DEVICES AND METHODS FOR SAME
- Publication number 20180284851
- Publication date Oct 4, 2018
- Georg Seidemann
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEVICE WITH SWITCHABLE HEAT PATH
- Publication number 20180177037
- Publication date Jun 21, 2018
- Sonja Koller
- G06 - COMPUTING CALCULATING COUNTING

Vishnu Prasad

Person

Patents Grantslast 30 patents

Thermal contacts at periphery of integrated circuit packages

Device with switchable heat path

Patents Applicationslast 30 patents

HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS

DUAL-SIDED TERMINAL DEVICE WITH SPLIT SIGNAL AND POWER ROUTING

INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT AND HEAT PATH

THREE-DIMENSIONAL STACK COOLING WINGS

PACKAGE LAYERS FOR STRESS MONITORING AND METHOD

MICROELECTRONIC ASSEMBLIES INCLUDING NANOWIRE AND SOLDER INTERCONNECTS

INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT

STACKED DIE PACKAGING ARCHITECTURE WITH CONDUCTIVE VIAS ON INTERPOSER

THERMAL CONTACTS AT PERIPHERY OF INTEGRATED CIRCUIT PACKAGES

FILLER INTERFACE HEAT TRANSFER SYSTEM AND DEVICES AND METHODS FOR SAME

DEVICE WITH SWITCHABLE HEAT PATH