Vittal Raja Manikam

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Shah Alam, MY

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with protective tape
- Patent number 8,237,293
- Issue date Aug 7, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Tzu Ling Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for molding substrate
- Patent number 8,062,424
- Issue date Nov 22, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Vermal Raja Manikam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill dispensing system for integrated circuits
- Patent number 7,989,965
- Issue date Aug 2, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Vittal Raja Manikam
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME
- Publication number 20110121468
- Publication date May 26, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Tzu Ling WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MOLDING SUBSTRATE
- Publication number 20110115125
- Publication date May 19, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Vermal Raja MANIKAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL DISPENSING SYSTEM FOR INTEGRATED CIRCUITS
- Publication number 20100279471
- Publication date Nov 4, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Vittal Raja MANIKAM
- H01 - BASIC ELECTRIC ELEMENTS