Vivian W. Ryan

Person

Berne, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Combinatorial screening of metallic diffusion barriers
- Patent number 9,297,775
- Issue date Mar 29, 2016
- Intermolecular, Inc.
- Edwin Adhiprakasha
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-layer barrier layer for interconnect structure
- Patent number 9,269,615
- Issue date Feb 23, 2016
- GLOBALFOUNDRIES Inc.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing wettability of interconnect material at corner...
- Patent number 9,209,135
- Issue date Dec 8, 2015
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer barrier layer stacks for interconnect structures
- Patent number 9,076,792
- Issue date Jul 7, 2015
- GLOBALFOUNDRIES Inc.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming non-continuous conductive layers for conductive...
- Patent number 9,059,255
- Issue date Jun 16, 2015
- GLOBALFOUNDRIES Inc.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detecting anomalous weak BEOL sites in a metallization system
- Patent number 9,021,894
- Issue date May 5, 2015
- GLOBALFOUNDRIES Inc.
- Vivian W. Ryan
- G01 - MEASURING TESTING
Information Patent Grant
Detecting anomalous stiff pillar bumps formed above a metallization...
- Patent number 8,950,269
- Issue date Feb 10, 2015
- GLOBALFOUNDRIES Inc.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad configurations for controlling semiconductor chip package...
- Patent number 8,928,146
- Issue date Jan 6, 2015
- GLOBALFOUNDRIES Inc.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a barrier system containing an alloy of metals i...
- Patent number 8,877,633
- Issue date Nov 4, 2014
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repairing anomalous stiff pillar bumps
- Patent number 8,829,675
- Issue date Sep 9, 2014
- GLOBALFOUNDRIES Inc.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer barrier layer stacks for interconnect structures
- Patent number 8,772,158
- Issue date Jul 8, 2014
- GLOBALFOUNDRIES Inc.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer barrier layer for interconnect structure
- Patent number 8,728,931
- Issue date May 20, 2014
- GLOBALFOUNDRIES, INC.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing wettability of interconnect material at corner...
- Patent number 8,722,534
- Issue date May 13, 2014
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad configurations for controlling semiconductor chip package...
- Patent number 8,680,681
- Issue date Mar 25, 2014
- GLOBALFOUNDRIES Inc.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive metal multi-layer barrier layer for interconnect structure
- Patent number 8,623,758
- Issue date Jan 7, 2014
- GLOBALFOUNDRIES Inc.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repairing anomalous stiff pillar bumps
- Patent number 8,623,754
- Issue date Jan 7, 2014
- GLOBALFOUNDRIES Inc.
- Vivian W. Ryan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Strain-compensating fill patterns for controlling semiconductor chi...
- Patent number 8,441,131
- Issue date May 14, 2013
- GLOBALFOUNDRIES Inc.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Combinatorial screening of metallic diffusion barriers
- Publication number 20150338362
- Publication date Nov 26, 2015
- INTERMOLECULAR INC.
- Edwin Adhiprakasha
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Mixed-metal barrier films optimized by high-productivity combinator...
- Publication number 20150021772
- Publication date Jan 22, 2015
- INTERMOLECULAR INC.
- Edwin Adhiprakasha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A BARRIER SYSTEM CONTAINING AN ALLOY OF METALS I...
- Publication number 20140291847
- Publication date Oct 2, 2014
- GLOBALFOUNDRIES INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER BARRIER LAYER STACKS FOR INTERCONNECT STRUCTURES
- Publication number 20140264876
- Publication date Sep 18, 2014
- GLOBALFOUNDRIES INC.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING NON-CONTINUOUS CONDUCTIVE LAYERS FOR CONDUCTIVE...
- Publication number 20140246775
- Publication date Sep 4, 2014
- GLOBALFOUNDRIES INC.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER BARRIER LAYER FOR INTERCONNECT STRUCTURE
- Publication number 20140217591
- Publication date Aug 7, 2014
- GLOBALFOUNDRIES INC.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING WETTABILITY OF INTERCONNECT MATERIAL AT CORNER...
- Publication number 20140210088
- Publication date Jul 31, 2014
- GLOBALFOUNDRIES INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD CONFIGURATIONS FOR CONTROLLING SEMICONDUCTOR CHIP PACKAGE...
- Publication number 20140145330
- Publication date May 29, 2014
- GLOBLAFOUNDRIES INC.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPAIRING ANOMALOUS STIFF PILLAR BUMPS
- Publication number 20140077368
- Publication date Mar 20, 2014
- GLOBALFOUNDRIES INC.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPAIRING ANOMALOUS STIFF PILLAR BUMPS
- Publication number 20140027902
- Publication date Jan 30, 2014
- GLOBALFOUNDRIES INC.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTING ANOMALOUS STIFF PILLAR BUMPS FORMED ABOVE A METALLIZATION...
- Publication number 20140026675
- Publication date Jan 30, 2014
- GLOBALFOUNDRIES INC.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING WETTABILITY OF INTERCONNECT MATERIAL AT CORNER...
- Publication number 20140027910
- Publication date Jan 30, 2014
- GLOBALFOUNDRIES INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTING ANOMALOUS WEAK BEOL SITES IN A METALLIZATION SYSTEM
- Publication number 20140026676
- Publication date Jan 30, 2014
- GLOBALFOUNDRIES INC.
- Vivian W. Ryan
- G01 - MEASURING TESTING
Information Patent Application
MULTI-LAYER BARRIER LAYER STACKS FOR INTERCONNECT STRUCTURES
- Publication number 20140021615
- Publication date Jan 23, 2014
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER BARRIER LAYER FOR INTERCONNECT STRUCTURE
- Publication number 20140024212
- Publication date Jan 23, 2014
- GLOBALFOUNDRIES INC.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER BARRIER LAYER FOR INTERCONNECT STRUCTURE
- Publication number 20140021613
- Publication date Jan 23, 2014
- GLOBALFOUNDRIES INC.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS GAUGE COMPRISED OF A PIEZOELECTRIC MATERIAL FOR USE WITH INT...
- Publication number 20130334532
- Publication date Dec 19, 2013
- GLOBALFOUNDRIES INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Strain-Compensating Fill Patterns for Controlling Semiconductor Chi...
- Publication number 20130062775
- Publication date Mar 14, 2013
- GLOBALFOUNDRIES INC.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Pad Configurations for Controlling Semiconductor Chip Package...
- Publication number 20130049206
- Publication date Feb 28, 2013
- GLOBALFOUNDRIES INC.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS

Vivian W. Ryan

Person

Patents Grantslast 30 patents

Combinatorial screening of metallic diffusion barriers

Multi-layer barrier layer for interconnect structure

Method for reducing wettability of interconnect material at corner...

Multi-layer barrier layer stacks for interconnect structures

Methods of forming non-continuous conductive layers for conductive...

Detecting anomalous weak BEOL sites in a metallization system

Detecting anomalous stiff pillar bumps formed above a metallization...

Bond pad configurations for controlling semiconductor chip package...

Methods of forming a barrier system containing an alloy of metals i...

Repairing anomalous stiff pillar bumps

Multi-layer barrier layer stacks for interconnect structures

Multi-layer barrier layer for interconnect structure

Method for reducing wettability of interconnect material at corner...

Bond pad configurations for controlling semiconductor chip package...

Subtractive metal multi-layer barrier layer for interconnect structure

Repairing anomalous stiff pillar bumps

Strain-compensating fill patterns for controlling semiconductor chi...

Patents Applicationslast 30 patents

Combinatorial screening of metallic diffusion barriers

Mixed-metal barrier films optimized by high-productivity combinator...

METHODS OF FORMING A BARRIER SYSTEM CONTAINING AN ALLOY OF METALS I...

MULTI-LAYER BARRIER LAYER STACKS FOR INTERCONNECT STRUCTURES

METHODS OF FORMING NON-CONTINUOUS CONDUCTIVE LAYERS FOR CONDUCTIVE...

MULTI-LAYER BARRIER LAYER FOR INTERCONNECT STRUCTURE

METHOD FOR REDUCING WETTABILITY OF INTERCONNECT MATERIAL AT CORNER...

BOND PAD CONFIGURATIONS FOR CONTROLLING SEMICONDUCTOR CHIP PACKAGE...

REPAIRING ANOMALOUS STIFF PILLAR BUMPS

REPAIRING ANOMALOUS STIFF PILLAR BUMPS

DETECTING ANOMALOUS STIFF PILLAR BUMPS FORMED ABOVE A METALLIZATION...

METHOD FOR REDUCING WETTABILITY OF INTERCONNECT MATERIAL AT CORNER...

DETECTING ANOMALOUS WEAK BEOL SITES IN A METALLIZATION SYSTEM

MULTI-LAYER BARRIER LAYER STACKS FOR INTERCONNECT STRUCTURES

MULTI-LAYER BARRIER LAYER FOR INTERCONNECT STRUCTURE

MULTI-LAYER BARRIER LAYER FOR INTERCONNECT STRUCTURE

STRESS GAUGE COMPRISED OF A PIEZOELECTRIC MATERIAL FOR USE WITH INT...

Strain-Compensating Fill Patterns for Controlling Semiconductor Chi...

Bond Pad Configurations for Controlling Semiconductor Chip Package...