Vladimir V. Dotsenko

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Mahopac, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for electrically interconnecting at least two substrates and...
- Patent number 10,373,928
- Issue date Aug 6, 2019
- Hypres, Inc.
- Vladimir V. Dotsenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconductive multi-chip module for high speed digital circuits
- Patent number 9,647,194
- Issue date May 9, 2017
- Hypres, Inc.
- Vladimir V. Dotsenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconductive multi-chip module for high speed digital circuits
- Patent number 8,937,255
- Issue date Jan 20, 2015
- Hypres Inc.
- Vladimir V. Dotsenko
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of forming an electronic multichip module
- Patent number 8,804,358
- Issue date Aug 12, 2014
- Hypres Inc.
- Vladimir V. Dotsenko
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for fabrication of electrical contacts to superconducting ci...
- Patent number 8,159,825
- Issue date Apr 17, 2012
- Hypres Inc.
- Vladimir V. Dotsenko
- H03 - BASIC ELECTRONIC CIRCUITRY