Membership
Tour
Register
Log in
Volker Kahlert
Follow
Person
Dresden, DE
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Metal cap layer with enhanced etch resistivity for copper-based met...
Patent number
8,432,035
Issue date
Apr 30, 2013
GLOBALFOUNDRIES Inc.
Volker Kahlert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Increasing reliability of copper-based metallization structures in...
Patent number
8,384,217
Issue date
Feb 26, 2013
GLOBALFOUNDRIES Inc.
Christof Streck
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Increasing reliability of copper-based metallization structures in...
Patent number
8,222,135
Issue date
Jul 17, 2012
GLOBALFOUNDRIES Inc.
Christof Streck
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method of forming a dielectric cap layer for a copper metallization...
Patent number
8,211,795
Issue date
Jul 3, 2012
Advanced Micro Devices, Inc.
Joerg Hohage
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device comprising a copper alloy as a barrier layer i...
Patent number
8,124,532
Issue date
Feb 28, 2012
Advanced Micro Devices, Inc.
Christof Streck
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Enhancing structural integrity and defining critical dimensions of...
Patent number
8,105,943
Issue date
Jan 31, 2012
GLOBALFOUNDRIES Inc.
Christof Streck
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating a metal cap layer with enhanced etch resistiv...
Patent number
8,084,354
Issue date
Dec 27, 2011
GLOBALFOUNDRIES Inc.
Volker Kahlert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Etch stop layer for a metallization layer with enhanced adhesion, e...
Patent number
7,867,917
Issue date
Jan 11, 2011
Advanced Micro Devices, Inc.
Joerg Hohage
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Method of manufracturing increasing reliability of copper-based met...
Patent number
7,829,460
Issue date
Nov 9, 2010
GLOBALFOUNDRIES, Inc.
Christof Streck
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Technique for forming nickel silicide by depositing nickel from a g...
Patent number
7,687,398
Issue date
Mar 30, 2010
Advanced Micro Devices, Inc.
Christof Streck
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method of forming an insulating capping layer for a copper metalliz...
Patent number
7,678,699
Issue date
Mar 16, 2010
Advanced Micro Devices, Inc.
Joerg Hohage
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method of forming the same
Patent number
7,638,428
Issue date
Dec 29, 2009
GLOBALFOUNDRIES, INC.
Christof Streck
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device comprising a copper alloy as a barrier layer i...
Patent number
7,595,269
Issue date
Sep 29, 2009
Advanced Micro Devices, Inc.
Christof Streck
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Technique for strain engineering in Si-based Transistors by using e...
Patent number
7,544,551
Issue date
Jun 9, 2009
Advanced Micro Devices, Inc.
Christof Streck
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming an insulating capping layer for a copper metalliz...
Patent number
7,491,638
Issue date
Feb 17, 2009
Advanced Micro Devices, Inc.
Joerg Hohage
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Etch stop layer for a metallization layer with enhanced etch select...
Patent number
7,476,626
Issue date
Jan 13, 2009
Advanced Micro Devices, Inc.
Joerg Hohage
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming a tungsten interconnect structure with enhanced...
Patent number
7,442,638
Issue date
Oct 28, 2008
Advanced Micro Devices, Inc.
Kai Frohberg
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method for forming a self-aligned nitrogen-containing copper silici...
Patent number
7,413,985
Issue date
Aug 19, 2008
Advanced Micro Devices, Inc.
Christof Streck
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Technique for reducing silicide defects by reducing deleterious eff...
Patent number
7,384,877
Issue date
Jun 10, 2008
Advanced Micro Devices, Inc.
Volker Kahlert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a conductive barrier layer within critical openin...
Patent number
7,071,096
Issue date
Jul 4, 2006
Advanced Micro Devices, Inc.
Michael Friedemann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for cleaning the surface of a substrate
Patent number
7,063,091
Issue date
Jun 20, 2006
Advanced Micro Devices, Inc.
Frank Koschinsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a conductive barrier layer having improved covera...
Patent number
6,984,294
Issue date
Jan 10, 2006
Advanced Micro Devices, Inc.
Michael Friedemann
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method of forming a conductive barrier layer having improve adhesio...
Patent number
6,841,468
Issue date
Jan 11, 2005
Advanced Micro Devices, Inc.
Michael Friedemann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interface void monitoring in a damascene process
Patent number
6,716,650
Issue date
Apr 6, 2004
Advanced Micro Devices, Inc.
Eckhard Langer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metallization process sequence for a barrier metal layer
Patent number
6,613,660
Issue date
Sep 2, 2003
Advanced Micro Devices, Inc.
Volker Kahlert
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Increasing reliability of copper-based metallization structures in...
Publication number
20120241958
Publication date
Sep 27, 2012
GLOBALFOUNDRIES, INC.
CHRISTOF STRECK
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
METAL CAP LAYER WITH ENHANCED ETCH RESISTIVITY FOR COPPER-BASED MET...
Publication number
20120061839
Publication date
Mar 15, 2012
GLOBALFOUNDRIES INC.
Volker Kahlert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Increasing reliability of copper-based metallization structures in...
Publication number
20110018134
Publication date
Jan 27, 2011
GLOBALFOUNDRIES,Inc.
Christof Streck
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
METAL CAP LAYER WITH ENHANCED ETCH RESISTIVITY FOR COPPER-BASED MET...
Publication number
20100078821
Publication date
Apr 1, 2010
Volker Kahlert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENHANCING STRUCTURAL INTEGRITY AND DEFINING CRITICAL DIMENSIONS OF...
Publication number
20100025855
Publication date
Feb 4, 2010
Christof Streck
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE COMPRISING A COPPER ALLOY AS A BARRIER LAYER I...
Publication number
20090305498
Publication date
Dec 10, 2009
Advanced Micro Devices, Inc.
Christof Streck
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A DIELECTRIC CAP LAYER FOR A COPPER METALLIZATION...
Publication number
20080286966
Publication date
Nov 20, 2008
Joerg Hohage
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INCREASING RELIABILITY OF COPPER-BASED METALLIZATION STRUCTURES IN...
Publication number
20080179741
Publication date
Jul 31, 2008
Christof Streck
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20080128912
Publication date
Jun 5, 2008
Christof Streck
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING A SELF-ALIGNED NITROGEN-CONTAINING COPPER SILICI...
Publication number
20080132064
Publication date
Jun 5, 2008
Christof Streck
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS LOW-K MATERIAL LAYER STACK...
Publication number
20080099918
Publication date
May 1, 2008
Christof Streck
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUE FOR FORMING A SILICON NITRIDE LAYER HAVING HIGH INTRINSIC...
Publication number
20070254492
Publication date
Nov 1, 2007
Steffen Baer
C30 - CRYSTAL GROWTH
Information
Patent Application
Method of forming an insulating capping layer for a copper metalliz...
Publication number
20070123044
Publication date
May 31, 2007
Joerg Hohage
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
A SEMICONDUCTOR DEVICE COMPRISING A COPPER ALLOY AS A BARRIER LAYER...
Publication number
20070123043
Publication date
May 31, 2007
Christof Streck
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AN ETCH STOP LAYER FOR A METALLIZATION LAYER WITH ENHANCED ADHESION...
Publication number
20070099010
Publication date
May 3, 2007
Joerg Hohage
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ETCH STOP LAYER FOR A METALLIZATION LAYER WITH ENHANCED ETCH SELECT...
Publication number
20070096108
Publication date
May 3, 2007
Joerg Hohage
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUE FOR STRAIN ENGINEERING IN SI-BASED TRANSISTORS BY USING E...
Publication number
20070096194
Publication date
May 3, 2007
Christof Streck
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING A TUNGSTEN INTERCONNECT STRUCTURE WITH ENHANCED...
Publication number
20070077749
Publication date
Apr 5, 2007
Kai Frohberg
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
TECHNIQUE FOR REDUCING SILICIDE DEFECTS BY REDUCING DELETERIOUS EFF...
Publication number
20070045226
Publication date
Mar 1, 2007
Volker Kahlert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING AN INSULATING CAPPING LAYER FOR A COPPER METALLIZ...
Publication number
20070037388
Publication date
Feb 15, 2007
JOERG HOHAGE
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
TECHNIQUE FOR FORMING NICKEL SILICIDE BY DEPOSITING NICKEL FROM A G...
Publication number
20070004203
Publication date
Jan 4, 2007
Christof Streck
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method of forming a conductive barrier layer within critical openin...
Publication number
20050233582
Publication date
Oct 20, 2005
Michael Friedemann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for cleaning the surface of a substrate
Publication number
20050230344
Publication date
Oct 20, 2005
Frank Koschinsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming local interconnect barrier layers
Publication number
20050101120
Publication date
May 12, 2005
Fred Hause
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Barrier layer including a titanium nitride liner for a copper metal...
Publication number
20050093155
Publication date
May 5, 2005
Volker Kahlert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming a conductive barrier layer having improved covera...
Publication number
20040168908
Publication date
Sep 2, 2004
Michael Friedemann
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method of forming a conductive barrier layer having improve adhesio...
Publication number
20040137714
Publication date
Jul 15, 2004
Michael Friedemann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for forming an improved metal silicide portion in a silicon-...
Publication number
20030186523
Publication date
Oct 2, 2003
Karsten Wieczorek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Metallization process sequence
Publication number
20030054625
Publication date
Mar 20, 2003
Volker Kahlert
H01 - BASIC ELECTRIC ELEMENTS