W. Boyd Rogers

Follow

Person

Raleigh, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Solder bump fabrication methods and structures including a titanium...
- Patent number 6,222,279
- Issue date Apr 24, 2001
- MCNC
- Joseph Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump fabrication methods and structure including a titanium...
- Patent number 5,767,010
- Issue date Jun 16, 1998
- MCNC
- Joseph Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS