Wade Sonnenberg

Person

Foxboro, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bath analysis
- Patent number 7,384,535
- Issue date Jun 10, 2008
- Rohm and Haas Electronic Materials LLC
- Wade Sonnenberg
- G01 - MEASURING TESTING
Information Patent Grant
Plating bath and method for depositing a metal layer on a substrate
- Patent number 6,911,068
- Issue date Jun 28, 2005
- Shipley Company, L.L.C.
- Andrew J. Cobley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive polymer colloidal compositions with selectivity for non-...
- Patent number 6,899,829
- Issue date May 31, 2005
- Shipley Company, L.L.C.
- James G. Shelnut
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating bath analysis
- Patent number 6,827,839
- Issue date Dec 7, 2004
- Shipley Company, L.L.C.
- Wade Sonnenberg
- G01 - MEASURING TESTING
Information Patent Grant
Plating bath and method for depositing a metal layer on a substrate
- Patent number 6,773,573
- Issue date Aug 10, 2004
- Shipley Company, L.L.C.
- David R. Gabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for treating adhesion promoted metal surfaces
- Patent number 6,752,878
- Issue date Jun 22, 2004
- Shipley Company, L.L.C.
- Joseph R. Montano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating bath and method for depositing a metal layer on a substrate
- Patent number 6,736,954
- Issue date May 18, 2004
- Shipley Company, L.L.C.
- Andrew J. Cobley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating bath and method for depositing a metal layer on a substrate
- Patent number 6,652,731
- Issue date Nov 25, 2003
- Shipley Company, L.L.C.
- Andrew J. Cobley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric composition
- Patent number 6,440,642
- Issue date Aug 27, 2002
- Shipley Company, L.L.C.
- James G. Shelnut
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Metallization process and component
- Patent number 6,174,647
- Issue date Jan 16, 2001
- Shipley Company, L.L.C.
- John P. Cahalen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of manufacture of multilayer circuit boards
- Patent number 6,123,995
- Issue date Sep 26, 2000
- Shipley Company, L.L.C.
- Wade Sonnenberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for electroplating using stabilized dispersions of conductiv...
- Patent number 6,039,859
- Issue date Mar 21, 2000
- Shipley Company, L.L.C.
- Wade Sonnenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of microetching a conductive polymer on multilayer circuit b...
- Patent number 6,036,835
- Issue date Mar 14, 2000
- Shipley Company, L.L.C.
- Wade Sonnenberg
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating process and composition
- Patent number 6,017,967
- Issue date Jan 25, 2000
- Shipley Company, L.L.C.
- Egon Matijevic
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Stabilized dispersions of graphite particles
- Patent number 5,800,739
- Issue date Sep 1, 1998
- Shipley Company, L.L.C.
- Wade Sonnenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating process and composition
- Patent number 5,667,662
- Issue date Sep 16, 1997
- Shipley Company, L.L.C.
- Wade Sonnenberg
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating process
- Patent number 5,425,873
- Issue date Jun 20, 1995
- Shipley Company LLC
- John J. Bladon
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating process
- Patent number 5,419,829
- Issue date May 30, 1995
- Rohm & Haas Company
- Gordon Fisher
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating catalyst formed from noble metal ions and bromide ions
- Patent number 5,395,652
- Issue date Mar 7, 1995
- Shipley Company Inc.
- Roger F. Bernards
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper electroplating solutions and processes
- Patent number 5,252,196
- Issue date Oct 12, 1993
- Shipley Company Inc.
- Wade Sonnenberg
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for analyzing organic additives in an electroplating bath
- Patent number 5,223,118
- Issue date Jun 29, 1993
- Shipley Company Inc.
- Wade Sonnenberg
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating composition and process
- Patent number 5,068,013
- Issue date Nov 26, 1991
- Shipley Company Inc.
- Roger F. Bernards
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Additive for acid-copper electroplating baths to increase throwing...
- Patent number 5,051,154
- Issue date Sep 24, 1991
- Shipley Company Inc.
- Roger F. Bernards
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electroplating composition
- Patent number 5,004,525
- Issue date Apr 2, 1991
- Shipley Company Inc.
- Roger F. Bernards
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for determining throwing power of an electropl...
- Patent number 4,932,518
- Issue date Jun 12, 1990
- Shipley Company Inc.
- Roger F. Bernards
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating composition and process for plating through holes in...
- Patent number 4,897,165
- Issue date Jan 30, 1990
- Shipley Company Inc.
- Roger F. Bernards
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Analysis method
- Publication number 20060151327
- Publication date Jul 13, 2006
- Rohm and Haas Electronic Materials, L.L.C.
- Wade Sonnenberg
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Reverse pulse plating composition and method
- Publication number 20060081475
- Publication date Apr 20, 2006
- Shipley Company, L.L.C.
- Leon R. Barstad
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20050155866
- Publication date Jul 21, 2005
- Shipley Company, L.L.C.
- David R. Gabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20050139118
- Publication date Jun 30, 2005
- Shipley Company, L.L.C.
- Andrew J. Cobley
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Reverse pulse plating composition and method
- Publication number 20050016858
- Publication date Jan 27, 2005
- Shipley Company, L.L.C.
- Leon R. Barstad
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Bath analysis
- Publication number 20050016856
- Publication date Jan 27, 2005
- Rohm and Haas Electronic Materials, L.L.C.
- Wade Sonnenberg
- G01 - MEASURING TESTING
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20040206631
- Publication date Oct 21, 2004
- Shipley Company, L.L.C.
- Andrew J. Cobley
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20040104124
- Publication date Jun 3, 2004
- Shipley Company, L.L.C.
- Andrew J. Cobley
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20040074778
- Publication date Apr 22, 2004
- Shipley Company, L.L.C.
- Andrew J. Cobley
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20030102226
- Publication date Jun 5, 2003
- Shipley Company, L.L.C.
- David R. Gabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20030085132
- Publication date May 8, 2003
- Shipley Company, L.L.C.
- Andrew J. Cobley
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20030070934
- Publication date Apr 17, 2003
- Shipley Company, L.L.C.
- Andrew J. Cobley
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath and method for depositing a metal layer on a substrate
- Publication number 20030066756
- Publication date Apr 10, 2003
- Shipley Company, L.L.C.
- David R. Gabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process for treating adhesion promoted metal surfaces
- Publication number 20020108678
- Publication date Aug 15, 2002
- Shipley Comapny, L.L.C.
- Joseph R. Montano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Conductive polymer colloidal compositions with selectivity for non-...
- Publication number 20020110645
- Publication date Aug 15, 2002
- Shipley Company, L.L.C.
- James G. Shelnut
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating bath analysis
- Publication number 20020074244
- Publication date Jun 20, 2002
- Shipley Company, L.L.C.
- Wade Sonnenberg
- G01 - MEASURING TESTING
Information Patent Application
RADIATION SENSITIVE COMPOSITIONS
- Publication number 20010006759
- Publication date Jul 5, 2001
- Charles R. Shipley Jr.
- CHARLES R. SHIPLEY
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Wade Sonnenberg

Person

Patents Grantslast 30 patents

Bath analysis

Plating bath and method for depositing a metal layer on a substrate

Conductive polymer colloidal compositions with selectivity for non-...

Plating bath analysis

Plating bath and method for depositing a metal layer on a substrate

Process for treating adhesion promoted metal surfaces

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Dielectric composition

Metallization process and component

Method of manufacture of multilayer circuit boards

Method for electroplating using stabilized dispersions of conductiv...

Method of microetching a conductive polymer on multilayer circuit b...

Electroplating process and composition

Stabilized dispersions of graphite particles

Electroplating process and composition

Electroplating process

Electroplating process

Plating catalyst formed from noble metal ions and bromide ions

Copper electroplating solutions and processes

Method for analyzing organic additives in an electroplating bath

Electroplating composition and process

Additive for acid-copper electroplating baths to increase throwing...

Copper electroplating composition

Method and apparatus for determining throwing power of an electropl...

Electroplating composition and process for plating through holes in...

Patents Applicationslast 30 patents

Analysis method

Reverse pulse plating composition and method

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Reverse pulse plating composition and method

Bath analysis

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Plating bath and method for depositing a metal layer on a substrate

Process for treating adhesion promoted metal surfaces

Conductive polymer colloidal compositions with selectivity for non-...

Plating bath analysis

RADIATION SENSITIVE COMPOSITIONS