Claims
- 1. An aqueous acid copper plating solution comprising one or more bath soluble copper salts in a concentration sufficient to provide a total copper ion content in an amount varying between 1 and 10 grams per liter and sufficient to support plating, acid as an electrolyte and a surfactant conforming to the formula
- R--O--(CH.sub.2 CH.sub.2 O).sub.n H
- where R is an aryl or alkyl group containing from about 2 to 20 carbon atoms and n is an integer whereby the molecular weight of the surfactant is at least 500,000.
- 2. The copper plating solution of claim 1 where the copper salt is cupric sulfate and the acid is sulfuric acid.
- 3. The copper plating solution of claim 1 where R is ethylene.
- 4. The copper plating solution of claim 1 where the molecular weight of the surfactant is at least 2,500,000.
Parent Case Info
This is a continuation of co-pending application Ser. No. 07/235,051, filed on Aug. 23, 1988, now U.S. Pat. No. 4,897,165.
US Referenced Citations (6)
Foreign Referenced Citations (1)
Number |
Date |
Country |
2123036A |
Jan 1984 |
GBX |
Continuations (1)
|
Number |
Date |
Country |
Parent |
235051 |
Aug 1988 |
|