Wagno Alves Braganca JR.

Person

Incheon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Thermally enhanced FCBGA package
- Patent number 12,107,028
- Issue date Oct 1, 2024
- STATS ChipPAC Pte. Ltd.
- KyungOe Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of controlling warpage during LAB
- Patent number 12,074,135
- Issue date Aug 27, 2024
- STATS ChipPAC Pte. Ltd.
- Wagno Alves Braganca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-beam alignment for laser-assisted bonding
- Patent number 11,929,334
- Issue date Mar 12, 2024
- STATS ChipPAC Pte. Ltd.
- Wagno Alves Braganca
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Region-of-interest positioning for laser-assisted bonding
- Patent number 11,817,357
- Issue date Nov 14, 2023
- STATS ChipPAC Pte. Ltd.
- Wagno Alves Braganca
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of controlling warpage during LAB
- Patent number 11,688,718
- Issue date Jun 27, 2023
- STATS ChipPAC Pte. Ltd.
- Wagno Alves Braganca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced FCBGA package
- Patent number 11,670,563
- Issue date Jun 6, 2023
- STATS ChipPAC Pte. Ltd.
- KyungOe Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Thermally Enhanced FCBGA Package
- Publication number 20240421024
- Publication date Dec 19, 2024
- STATS ChipPAC Pte Ltd.
- KyungOe Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-Beam Alignment for Laser-Assisted Bonding
- Publication number 20240170422
- Publication date May 23, 2024
- STATS ChipPAC Pte Ltd.
- Wagno Alves Braganca
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Controlling Warpage During LAB
- Publication number 20230307414
- Publication date Sep 28, 2023
- STATS ChipPAC Pte Ltd.
- Wagno Alves Braganca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Enhanced FCBGA Package
- Publication number 20230260865
- Publication date Aug 17, 2023
- STATS ChipPAC Pte Ltd.
- KyungOe Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Controlling Warpage During LAB
- Publication number 20230077132
- Publication date Mar 9, 2023
- STATS ChipPAC Pte Ltd.
- Wagno Alves Braganca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Enhanced FCBGA Package
- Publication number 20220415744
- Publication date Dec 29, 2022
- STATS ChipPAC Pte Ltd.
- KyungOe Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Region-of-Interest Positioning for Laser-Assisted Bonding
- Publication number 20220399236
- Publication date Dec 15, 2022
- STATS ChipPAC Pte Ltd.
- Wagno Alves Braganca
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Die-Beam Alignment for Laser-Assisted Bonding
- Publication number 20210296268
- Publication date Sep 23, 2021
- STATS ChipPAC Pte Ltd.
- Wagno Alves Braganca
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Wagno Alves Braganca JR.

Person

Patents Grantslast 30 patents

Thermally enhanced FCBGA package

Semiconductor device and method of controlling warpage during LAB

Die-beam alignment for laser-assisted bonding

Region-of-interest positioning for laser-assisted bonding

Semiconductor device and method of controlling warpage during LAB

Thermally enhanced FCBGA package

Patents Applicationslast 30 patents

Thermally Enhanced FCBGA Package

Die-Beam Alignment for Laser-Assisted Bonding

Semiconductor Device and Method of Controlling Warpage During LAB

Thermally Enhanced FCBGA Package

Semiconductor Device and Method of Controlling Warpage During LAB

Thermally Enhanced FCBGA Package

Region-of-Interest Positioning for Laser-Assisted Bonding

Die-Beam Alignment for Laser-Assisted Bonding