Wahei Kitamura

Person

Nakano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,785,986
- Issue date Aug 31, 2010
- Renesas Electronics Corp.
- Yoshihisa Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transporting semiconductor device and method of manufactu...
- Patent number 7,504,315
- Issue date Mar 17, 2009
- Renesas Technology Corp.
- Yoshihisa Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for carrying a semiconductor device
- Patent number 7,261,207
- Issue date Aug 28, 2007
- Renesas Technology Corp.
- Hiromichi Suzuki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Surface package type semiconductor package and method of producing...
- Patent number 6,981,585
- Issue date Jan 3, 2006
- Renesas Technology Corp.
- Wahei Kitamura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Surface package type semiconductor package and method of producing...
- Patent number 6,443,298
- Issue date Sep 3, 2002
- Hitachi, Ltd.
- Wahei Kitamura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Surface package type semiconductor package and method of producing...
- Patent number 6,223,893
- Issue date May 1, 2001
- Hitachi, Ltd.
- Wahei Kitamura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Resist pattern forming method using anti-reflective layer resist pa...
- Patent number 5,988,368
- Issue date Nov 23, 1999
- Hitachi, Ltd.
- Wahei Kitamura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Surface package type semiconductor package and method of producing...
- Patent number 5,803,246
- Issue date Sep 8, 1998
- Hitachi, Ltd.
- Wahei Kitamura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Surface package type semiconductor package and method of producing...
- Patent number 5,607,059
- Issue date Mar 4, 1997
- Hitachi, Ltd.
- Wahei Kitamura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method of producing semiconductor memory
- Patent number 5,295,297
- Issue date Mar 22, 1994
- Hitachi, Ltd.
- Wahei Kitamura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method of producing surface package type semiconductor package
- Patent number 5,274,914
- Issue date Jan 4, 1994
- Hitachi, Ltd.
- Wahei Kitamura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method of producing semiconductor memory packages
- Patent number 5,095,626
- Issue date Mar 17, 1992
- Hitachi, Ltd.
- Wahei Kitamura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Process of producing semiconductor device
- Patent number 4,994,411
- Issue date Feb 19, 1991
- Hitachi, Ltd.
- Takahiro Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface package type semiconductor package
- Patent number 4,971,196
- Issue date Nov 20, 1990
- Hitachi, Ltd.
- Wahei Kitamura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 4,845,543
- Issue date Jul 4, 1989
- Hitachi, Ltd.
- Susumu Okikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20090176333
- Publication date Jul 9, 2009
- Yoshihisa Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for carrying a semiconductor device
- Publication number 20070235371
- Publication date Oct 11, 2007
- RENESAS TECHNOLOGY CORP.
- Hiromichi Suzuki
- G05 - CONTROLLING REGULATING
Information Patent Application
Method of transporting semiconductor device and method of manufactu...
- Publication number 20050147488
- Publication date Jul 7, 2005
- Yoshihisa Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for carrying a semiconductor device
- Publication number 20040181938
- Publication date Sep 23, 2004
- RENESAS TECHNOLOGY CORP.
- Hiromichi Suzuki
- G05 - CONTROLLING REGULATING
Information Patent Application
Surface package type semiconductor package and method of producing...
- Publication number 20030057113
- Publication date Mar 27, 2003
- Wahei Kitamura
- B32 - LAYERED PRODUCTS
Information Patent Application
Surface package type semiconductor package and method of producing...
- Publication number 20020179460
- Publication date Dec 5, 2002
- Wahei Kitamura
- B32 - LAYERED PRODUCTS
Information Patent Application
Surface package type semiconductor package and method of producing...
- Publication number 20020174627
- Publication date Nov 28, 2002
- Wahei Kitamura
- B32 - LAYERED PRODUCTS
Information Patent Application
Surface package type semiconductor package and method of producing...
- Publication number 20010015327
- Publication date Aug 23, 2001
- Wahei Kitamura
- B32 - LAYERED PRODUCTS

Wahei Kitamura

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor device

Method of transporting semiconductor device and method of manufactu...

Method for carrying a semiconductor device

Surface package type semiconductor package and method of producing...

Surface package type semiconductor package and method of producing...

Surface package type semiconductor package and method of producing...

Resist pattern forming method using anti-reflective layer resist pa...

Surface package type semiconductor package and method of producing...

Surface package type semiconductor package and method of producing...

Method of producing semiconductor memory

Method of producing surface package type semiconductor package

Method of producing semiconductor memory packages

Process of producing semiconductor device

Surface package type semiconductor package

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method for carrying a semiconductor device

Method of transporting semiconductor device and method of manufactu...

Method for carrying a semiconductor device

Surface package type semiconductor package and method of producing...

Surface package type semiconductor package and method of producing...

Surface package type semiconductor package and method of producing...

Surface package type semiconductor package and method of producing...