Wai Mun Chong

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Patents Grantslast 30 patents

Information Patent Grant
Seal ring bonding structures
- Patent number 10,811,361
- Issue date Oct 20, 2020
- VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- Lieneng Low
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE and fabrication metho...
- Publication number 20230382713
- Publication date Nov 30, 2023
- Vanguard International Semiconductor Corporation
- RAMACHANDRAMURTHY PRADEEP YELEHANKA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE and fabrication metho...
- Publication number 20230348259
- Publication date Nov 2, 2023
- Vanguard International Semiconductor Corporation
- WAI MUN CHONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL RING BONDING STRUCTURES
- Publication number 20190378798
- Publication date Dec 12, 2019
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Lieneng LOW
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of manufacturing an accelerometer
- Publication number 20050079684
- Publication date Apr 14, 2005
- Wai Mun Chong
- B81 - MICRO-STRUCTURAL TECHNOLOGY