Wai Yew Lo

Person

Petaling Jaya, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Cavity-down pressure sensor device
- Patent number 9,638,596
- Issue date May 2, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package-in-package semiconductor sensor device
- Patent number 9,362,479
- Issue date Jun 7, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor device with through silicon via
- Patent number 9,297,713
- Issue date Mar 29, 2016
- Freescale Semiconductor,INC
- Wai Yew Lo
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package with lead mounted power bar
- Patent number 9,209,120
- Issue date Dec 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Kong Bee Tiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die sensor device
- Patent number 9,190,352
- Issue date Nov 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Kong Bee Tiu
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor sensor device with footed lid
- Patent number 9,029,999
- Issue date May 12, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat semiconductor device with additional contacts
- Patent number 8,981,541
- Issue date Mar 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Kong Bee Tiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor device having bump chip carrier (BCC)
- Patent number 8,941,194
- Issue date Jan 27, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar powered IC chip
- Patent number 8,809,078
- Issue date Aug 19, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Teck Beng Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor and method of packaging same
- Patent number 8,802,474
- Issue date Aug 12, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar powered IC chip
- Patent number 8,778,704
- Issue date Jul 15, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Teck Beng Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor and method of packaging same
- Patent number 8,716,846
- Issue date May 6, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor device and method of assembling same
- Patent number 8,546,169
- Issue date Oct 1, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming semiconductor package
- Patent number 8,460,972
- Issue date Jun 11, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor and method of assembling same
- Patent number 8,378,435
- Issue date Feb 19, 2013
- Wai Yew Lo
- G01 - MEASURING TESTING
Information Patent Grant
Surface mount semiconductor device
- Patent number 8,283,780
- Issue date Oct 9, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming stacked die package
- Patent number 7,955,953
- Issue date Jun 7, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor package
- Patent number 7,886,609
- Issue date Feb 15, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming semiconductor package
- Patent number 7,745,260
- Issue date Jun 29, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer with improved crack protection
- Patent number 7,741,196
- Issue date Jun 22, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Heng Keong Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip and wire bond semiconductor package
- Patent number 7,554,185
- Issue date Jun 30, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array quad flat no-lead package and method of forming same
- Patent number 7,531,383
- Issue date May 12, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming flip-chip bump carrier type package
- Patent number 7,473,586
- Issue date Jan 6, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor attachment method
- Patent number 7,452,750
- Issue date Nov 18, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making stacked die package
- Patent number 7,378,298
- Issue date May 27, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die semiconductor device
- Patent number 7,211,466
- Issue date May 1, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a substrateless semiconductor package
- Patent number 7,160,755
- Issue date Jan 9, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die semiconductor device
- Patent number 6,885,093
- Issue date Apr 26, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
UNIVERSAL BGA SUBSTRATE
- Publication number 20170062320
- Publication date Mar 2, 2017
- FREESCALE SEMICONDUCTOR, INC.
- CHEE SENG FOONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRE THROUGH SILICON VIA CONNECTION
- Publication number 20160086880
- Publication date Mar 24, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SENSOR DEVICE FORMED WITH GEL SHEET
- Publication number 20160069763
- Publication date Mar 10, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE-IN-PACKAGE SEMICONDUCTOR SENSOR DEVICE
- Publication number 20160027992
- Publication date Jan 28, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGE WITH REDISTRIBUTION LAYER
- Publication number 20150340305
- Publication date Nov 26, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY-DOWN PRESSURE SENSOR DEVICE
- Publication number 20150285702
- Publication date Oct 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR DEVICE WITH THROUGH SILICON VIA
- Publication number 20150270206
- Publication date Sep 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE WITH LEAD MOUNTED POWER BAR
- Publication number 20150262924
- Publication date Sep 17, 2015
- Kong Bee Tiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH INSULATED WIRES FOR ROUTING POWER SI...
- Publication number 20150162269
- Publication date Jun 11, 2015
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE SENSOR DEVICE
- Publication number 20150137279
- Publication date May 21, 2015
- Kong Bee Tiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR SENSOR DEVICE
- Publication number 20150069537
- Publication date Mar 12, 2015
- Wai Yew Lo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR SENSOR DEVICE WITH FOOTED LID
- Publication number 20150024535
- Publication date Jan 22, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT SEMICONDUCTOR DEVICE WITH ADDITIONAL CONTACTS
- Publication number 20150014833
- Publication date Jan 15, 2015
- Kong Bee Tiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SENSOR AND METHOD OF PACKAGING SAME
- Publication number 20140374855
- Publication date Dec 25, 2014
- Wai Yew Lo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR SENSOR DEVICE WITH METAL LID
- Publication number 20140374848
- Publication date Dec 25, 2014
- Wen Shi Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLAR POWERED IC CHIP
- Publication number 20140225211
- Publication date Aug 14, 2014
- Teck Beng Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SENSOR AND METHOD OF PACKAGING SAME
- Publication number 20140206124
- Publication date Jul 24, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PACKAGING SAME
- Publication number 20120306031
- Publication date Dec 6, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR AND METHOD OF PACKAGING SAME
- Publication number 20120168884
- Publication date Jul 5, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong Yao
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR AND METHOD OF PACKAGING SAME
- Publication number 20120139067
- Publication date Jun 7, 2012
- FREESCALE SEMICONDUCTOR, INC.
- WAI YEW LO
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR AND METHOD OF ASSEMBLING SAME
- Publication number 20120139063
- Publication date Jun 7, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- G01 - MEASURING TESTING
Information Patent Application
SURFACE MOUNT SEMICONDUCTOR DEVICE
- Publication number 20120133053
- Publication date May 31, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER CORE WIRE
- Publication number 20120073859
- Publication date Mar 29, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SENSOR PACKAGE
- Publication number 20100281993
- Publication date Nov 11, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew LO
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR PACKAGE
- Publication number 20100075462
- Publication date Mar 25, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING STACKED DIE PACKAGE
- Publication number 20090152717
- Publication date Jun 18, 2009
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER WITH IMPROVED CRACK PROTECTION
- Publication number 20080179710
- Publication date Jul 31, 2008
- Heng Keong Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip Chip And Wire Bond Semiconductor Package
- Publication number 20080111248
- Publication date May 15, 2008
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY QUAD FLAT NO-LEAD PACKAGE AND METHOD OF FORMING SAME
- Publication number 20080099784
- Publication date May 1, 2008
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming semiconductor packaged device
- Publication number 20070281397
- Publication date Dec 6, 2007
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Cavity-down pressure sensor device

Package-in-package semiconductor sensor device

Pressure sensor device with through silicon via

Semiconductor package with lead mounted power bar

Multi-die sensor device

Semiconductor sensor device with footed lid

Quad flat semiconductor device with additional contacts

Pressure sensor device having bump chip carrier (BCC)

Solar powered IC chip

Pressure sensor and method of packaging same

Solar powered IC chip

Pressure sensor and method of packaging same

Pressure sensor device and method of assembling same

Method of forming semiconductor package

Pressure sensor and method of assembling same

Surface mount semiconductor device

Method of forming stacked die package

Pressure sensor package

Method of forming semiconductor package

Semiconductor wafer with improved crack protection

Flip chip and wire bond semiconductor package

Array quad flat no-lead package and method of forming same

Method of forming flip-chip bump carrier type package

Capacitor attachment method

Method of making stacked die package

Stacked die semiconductor device

Method of forming a substrateless semiconductor package

Stacked die semiconductor device

Patents Applicationslast 30 patents

UNIVERSAL BGA SUBSTRATE

COPPER WIRE THROUGH SILICON VIA CONNECTION

SEMICONDUCTOR SENSOR DEVICE FORMED WITH GEL SHEET

PACKAGE-IN-PACKAGE SEMICONDUCTOR SENSOR DEVICE

STACKED DIE PACKAGE WITH REDISTRIBUTION LAYER

CAVITY-DOWN PRESSURE SENSOR DEVICE

PRESSURE SENSOR DEVICE WITH THROUGH SILICON VIA

SEMICONDUCTOR PACKAGE WITH LEAD MOUNTED POWER BAR

SEMICONDUCTOR DIE PACKAGE WITH INSULATED WIRES FOR ROUTING POWER SI...

MULTI-DIE SENSOR DEVICE

PACKAGE-ON-PACKAGE SEMICONDUCTOR SENSOR DEVICE

SEMICONDUCTOR SENSOR DEVICE WITH FOOTED LID

QUAD FLAT SEMICONDUCTOR DEVICE WITH ADDITIONAL CONTACTS

PRESSURE SENSOR AND METHOD OF PACKAGING SAME

SEMICONDUCTOR SENSOR DEVICE WITH METAL LID

SOLAR POWERED IC CHIP

PRESSURE SENSOR AND METHOD OF PACKAGING SAME

SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PACKAGING SAME

PRESSURE SENSOR AND METHOD OF PACKAGING SAME

PRESSURE SENSOR AND METHOD OF PACKAGING SAME

PRESSURE SENSOR AND METHOD OF ASSEMBLING SAME

SURFACE MOUNT SEMICONDUCTOR DEVICE

POLYMER CORE WIRE

PRESSURE SENSOR PACKAGE

METHOD OF FORMING SEMICONDUCTOR PACKAGE

METHOD OF FORMING STACKED DIE PACKAGE

SEMICONDUCTOR WAFER WITH IMPROVED CRACK PROTECTION

Flip Chip And Wire Bond Semiconductor Package

ARRAY QUAD FLAT NO-LEAD PACKAGE AND METHOD OF FORMING SAME

Method of forming semiconductor packaged device