Wallace Chuang

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Taipei, TW

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Patents Grantslast 30 patents

Information Patent Grant
Sensor and package assembly thereof
- Patent number 12,091,312
- Issue date Sep 17, 2024
- Robert Bosch GmbH
- Ken Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sn—Cu mixed alloy solder paste, method of making the same and solde...
- Patent number 12,030,139
- Issue date Jul 9, 2024
- Robert Bosch GmbH
- Wallace Chuang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor and package assembly thereof
- Patent number 11,685,646
- Issue date Jun 27, 2023
- Robert Bosch GmbH
- Ken Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Mixed Alloy Solder Paste, Method of Making the Same and Soldering M...
- Publication number 20220395934
- Publication date Dec 15, 2022
- ROBERT BOSCH GmbH
- Wallace Chuang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sensor and Package Assembly Thereof
- Publication number 20220009766
- Publication date Jan 13, 2022
- ROBERT BOSCH GmbH
- Ken Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor and Package Assembly Thereof
- Publication number 20220002145
- Publication date Jan 6, 2022
- ROBERT BOSCH GmbH
- Ken Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY