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Walter de MUNNIK
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Arnhem, NL
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last 30 patents
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Patent Grant
Method of fabricating an integrated circuit (IC) package having a p...
Patent number
9,520,306
Issue date
Dec 13, 2016
UTAC HEADQUARTERS PTE. LTD.
Geraldine Tsui Yee Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated circuit package having a plurality of spaced apart pad p...
Patent number
8,330,270
Issue date
Dec 11, 2012
UTAC Hong Kong Limited
Geraldine Tsui Yee Lin
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
INTEGRATED CIRCUIT PACKAGE AND PROCESS FOR FABRICATING THE SAME
Publication number
20160013075
Publication date
Jan 14, 2016
Geraldine Tsui Yee LIN
H01 - BASIC ELECTRIC ELEMENTS