Walter Hartner

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor apparatuses with radio-frequency line elements, and a...
- Patent number 12,368,111
- Issue date Jul 22, 2025
- Infineon Technologies AG
- Walter Hartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit arrangement with a thermal interface
- Patent number 12,107,026
- Issue date Oct 1, 2024
- Infineon Technologies AG
- Raphael Hellwig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an antenna arranged over an active main...
- Patent number 12,094,842
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency devices and methods for producing radio-frequency d...
- Patent number 12,040,543
- Issue date Jul 16, 2024
- Infineon Technologies AG
- Walter Hartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission of wireless signal having information on a local oscil...
- Patent number 11,879,966
- Issue date Jan 23, 2024
- Infineon Technologies AG
- Josef Boeck
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chip package with substrate integrated waveguide and waveguide inte...
- Patent number 11,824,019
- Issue date Nov 21, 2023
- Infineon Technologies AG
- Tuncay Erdoel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising electrical redistribution layer al...
- Patent number 11,798,874
- Issue date Oct 24, 2023
- Infineon Technologies AG
- Walter Hartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency devices and associated production methods
- Patent number 11,791,529
- Issue date Oct 17, 2023
- Infineon Technologies AG
- Walter Hartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices including an RF chip having an electrical redistribution...
- Patent number 11,764,453
- Issue date Sep 19, 2023
- Infineon Technologies AG
- Walter Hartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plastic waveguide
- Patent number 11,387,533
- Issue date Jul 12, 2022
- Infineon Technologies AG
- Maciej Wojnowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a non-galvanic connection
- Patent number 11,251,146
- Issue date Feb 15, 2022
- Infineon Technologies AG
- Walter Hartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having cutouts in an encapsulation material a...
- Patent number 11,145,563
- Issue date Oct 12, 2021
- Infineon Technologies AG
- Christian Geissler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including redistribution layer pad having a void
- Patent number 10,916,484
- Issue date Feb 9, 2021
- Infineon Technologies AG
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier laminate with high frequency dielectric and thermomech...
- Patent number 10,607,911
- Issue date Mar 31, 2020
- Infineon Technologies AG
- Martin Richard Niessner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded chip packages and methods for manufacturing an embedded ch...
- Patent number 10,008,470
- Issue date Jun 26, 2018
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package having a semiconduc...
- Patent number 9,922,946
- Issue date Mar 20, 2018
- Infineon Technologies AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless communication system, a radar system and a method for dete...
- Patent number 9,910,145
- Issue date Mar 6, 2018
- Infineon Technologies AG
- Josef Boeck
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Embedded chip packages and methods for manufacturing an embedded ch...
- Patent number 9,721,920
- Issue date Aug 1, 2017
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package having an integrate...
- Patent number 9,653,426
- Issue date May 16, 2017
- Infineon Technologies AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transition between a plastic waveguide and a semiconductor chip, wh...
- Patent number 9,583,811
- Issue date Feb 28, 2017
- Infineon Technologies AG
- Ernst Seler
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated-circuit module with waveguide transition element
- Patent number 9,356,332
- Issue date May 31, 2016
- Infineon Technologies AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated microwave component
- Patent number 9,337,159
- Issue date May 10, 2016
- Infineon Technologies AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and methods for producing a semiconductor c...
- Patent number 9,275,895
- Issue date Mar 1, 2016
- Infineon Technologies AG
- Andreas Meiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with integrated antenna and method of formin...
- Patent number 8,952,521
- Issue date Feb 10, 2015
- Infineon Technologies AG
- Maciej Wojnowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a chip package
- Patent number 8,912,087
- Issue date Dec 16, 2014
- Infineon Technologies AG
- Josef Hirtreiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,669,655
- Issue date Mar 11, 2014
- Infineon Technologies AG
- Ottmar Geitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and methods for producing a semiconductor c...
- Patent number 8,637,378
- Issue date Jan 28, 2014
- Infineon Technologies AG
- Andreas Meiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and methods for producing a semiconductor c...
- Patent number 8,476,734
- Issue date Jul 2, 2013
- Infineon Technologies AG
- Andreas Meiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component including an isolation structure and a cont...
- Patent number 7,982,284
- Issue date Jul 19, 2011
- Infineon Technologies AG
- Andreas Meiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method
- Patent number 7,468,307
- Issue date Dec 23, 2008
- Infineon Technologies AG
- Walter Hartner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PAD OVER ACTIVE SENSOR CELLS INTEGRATED IN A CHIP PACKAGE
- Publication number 20250160219
- Publication date May 15, 2025
- INFINEON TECHNOLOGIES AG
- Walter HARTNER
- G01 - MEASURING TESTING
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MOUNTING AT LEAST ONE SEMICOND...
- Publication number 20250016918
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Martin Richard NIEßNER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIO FREQUENCY SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A R...
- Publication number 20240429177
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Simon KORNPROBST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR AUTHENTICATING AN OBJECT, AND MOBILE CONSUMER DEVICE
- Publication number 20240393433
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Klaus ELIAN
- G01 - MEASURING TESTING
Information Patent Application
TRANSFORMER ARRANGEMENT
- Publication number 20240312975
- Publication date Sep 19, 2024
- Infineon Technologies Austria AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A R...
- Publication number 20240290733
- Publication date Aug 29, 2024
- INFINEON TECHNOLOGIES AG
- Simon KORNPROBST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING SHIELDING STRUCTURES
- Publication number 20240290729
- Publication date Aug 29, 2024
- Infineon Techologies AG
- Tuncay ERDOEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER-LEVEL PACKAGES AND ASSOCIATED PRODUCTION METHODS
- Publication number 20240196757
- Publication date Jun 13, 2024
- INFINEON TECHNOLOGIES AG
- Horst THEUSS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY DEVICES INCLUDING RADIO FREQUENCY ABSORBENT FEATURES
- Publication number 20240030092
- Publication date Jan 25, 2024
- INFINEON TECHNOLOGIES AG
- Tuncay ERDOEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH SUBSTRATE INTEGRATED WAVEGUIDE AND WAVEGUIDE INTE...
- Publication number 20220415830
- Publication date Dec 29, 2022
- INFINEON TECHNOLOGIES AG
- Tuncay ERDOEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY DEVICES AND METHODS FOR PRODUCING RADIO-FREQUENCY D...
- Publication number 20220247089
- Publication date Aug 4, 2022
- INFINEON TECHNOLOGIES AG
- Walter HARTNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ARRANGEMENT WITH A THERMAL INTERFACE
- Publication number 20220199481
- Publication date Jun 23, 2022
- INFINEON TECHNOLOGIES AG
- Raphael HELLWIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY DEVICES INCLUDING ATTENUATING DIELECTRIC MATERIALS
- Publication number 20220189892
- Publication date Jun 16, 2022
- INFINEON TECHNOLOGIES AG
- Pietro BRENNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THEREOF
- Publication number 20220181246
- Publication date Jun 9, 2022
- INFINEON TECHNOLOGIES AG
- Walter HARTNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY DEVICES AND ASSOCIATED PRODUCTION METHODS
- Publication number 20220059918
- Publication date Feb 24, 2022
- INFINEON TECHNOLOGIES AG
- Walter Hartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY DEVICES AND ASSOCIATED PRODUCTION METHODS
- Publication number 20210359387
- Publication date Nov 18, 2021
- INFINEON TECHNOLOGIES AG
- Walter Hartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION OF WIRELESS SIGNAL HAVING INFORMATION ON A LOCAL OSCIL...
- Publication number 20210247510
- Publication date Aug 12, 2021
- INFINEON TECHNOLOGIES AG
- Josef Boeck
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICES HAVING A NON-GALVANIC CONNECTION
- Publication number 20200321295
- Publication date Oct 8, 2020
- INFINEON TECHNOLOGIES AG
- Walter HARTNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PLASTIC WAVEGUIDE
- Publication number 20200021002
- Publication date Jan 16, 2020
- INFINEON TECHNOLOGIES AG
- Maciej Wojnowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CUTOUTS IN AN ENCAPSULATION MATERIAL A...
- Publication number 20200006174
- Publication date Jan 2, 2020
- INFINEON TECHNOLOGIES AG
- Christian GEISSLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-Chip Antennas for Semiconductor Devices and Related Manufacturin...
- Publication number 20190221531
- Publication date Jul 18, 2019
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING METALLIZATIONS COMPOSED OF POROUS...
- Publication number 20190221533
- Publication date Jul 18, 2019
- INFINEON TECHNOLOGIES AG
- Horst THEUSS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUSES WITH RADIO-FREQUENCY LINE ELEMENTS, AND A...
- Publication number 20190198455
- Publication date Jun 27, 2019
- INFINEON TECHNOLOGIES AG
- Walter HARTNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING REDISTRIBUTION LAYER PAD HAVING A VOID
- Publication number 20180374769
- Publication date Dec 27, 2018
- INFINEON TECHNOLOGIES AG
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION OF WIRELESS SIGNAL HAVING INFORMATION ON A LOCAL OSCIL...
- Publication number 20180180730
- Publication date Jun 28, 2018
- INFINEON TECHNOLOGIES AG
- Josef Boeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices with On-Chip Antennas and Manufacturing Thereof
- Publication number 20170309582
- Publication date Oct 26, 2017
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIP PACKAGES AND METHODS FOR MANUFACTURING AN EMBEDDED CH...
- Publication number 20170288176
- Publication date Oct 5, 2017
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Package Having a Semiconduc...
- Publication number 20170213800
- Publication date Jul 27, 2017
- INFINEON TECHNOLOGIES AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Package Having an Integrate...
- Publication number 20160247780
- Publication date Aug 25, 2016
- INFINEON TECHNOLOGIES AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip carrier laminate with high frequency dielectric and thermomech...
- Publication number 20160211189
- Publication date Jul 21, 2016
- INFINEON TECHNOLOGIES AG
- Martin Richard NIESSNER
- H01 - BASIC ELECTRIC ELEMENTS

Walter Hartner

Person

Patents Grantslast 30 patents

Semiconductor apparatuses with radio-frequency line elements, and a...

Circuit arrangement with a thermal interface

Semiconductor device having an antenna arranged over an active main...

Radio-frequency devices and methods for producing radio-frequency d...

Transmission of wireless signal having information on a local oscil...

Chip package with substrate integrated waveguide and waveguide inte...

Semiconductor devices comprising electrical redistribution layer al...

Radio-frequency devices and associated production methods

RF devices including an RF chip having an electrical redistribution...

Semiconductor package with plastic waveguide

Semiconductor devices having a non-galvanic connection

Semiconductor devices having cutouts in an encapsulation material a...

Electronic device including redistribution layer pad having a void

Chip carrier laminate with high frequency dielectric and thermomech...

Embedded chip packages and methods for manufacturing an embedded ch...

Method of manufacturing a semiconductor package having a semiconduc...

Wireless communication system, a radar system and a method for dete...

Embedded chip packages and methods for manufacturing an embedded ch...

Method of manufacturing a semiconductor package having an integrate...

Transition between a plastic waveguide and a semiconductor chip, wh...

Integrated-circuit module with waveguide transition element

Semiconductor package with integrated microwave component

Semiconductor component and methods for producing a semiconductor c...

Semiconductor packages with integrated antenna and method of formin...

Method of fabricating a chip package

Chip package and a method for manufacturing a chip package

Semiconductor component and methods for producing a semiconductor c...

Semiconductor component and methods for producing a semiconductor c...

Semiconductor component including an isolation structure and a cont...

Semiconductor structure and method

Patents Applicationslast 30 patents

PAD OVER ACTIVE SENSOR CELLS INTEGRATED IN A CHIP PACKAGE

PRINTED CIRCUIT BOARD AND METHOD FOR MOUNTING AT LEAST ONE SEMICOND...

RADIO FREQUENCY SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A R...

METHOD FOR AUTHENTICATING AN OBJECT, AND MOBILE CONSUMER DEVICE

TRANSFORMER ARRANGEMENT

RADIO FREQUENCY SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A R...

SEMICONDUCTOR PACKAGES INCLUDING SHIELDING STRUCTURES

FAN-OUT WAFER-LEVEL PACKAGES AND ASSOCIATED PRODUCTION METHODS

RADIO FREQUENCY DEVICES INCLUDING RADIO FREQUENCY ABSORBENT FEATURES

CHIP PACKAGE WITH SUBSTRATE INTEGRATED WAVEGUIDE AND WAVEGUIDE INTE...

RADIO-FREQUENCY DEVICES AND METHODS FOR PRODUCING RADIO-FREQUENCY D...

CIRCUIT ARRANGEMENT WITH A THERMAL INTERFACE

HIGH FREQUENCY DEVICES INCLUDING ATTENUATING DIELECTRIC MATERIALS

SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THEREOF

RADIO-FREQUENCY DEVICES AND ASSOCIATED PRODUCTION METHODS

RADIO-FREQUENCY DEVICES AND ASSOCIATED PRODUCTION METHODS

TRANSMISSION OF WIRELESS SIGNAL HAVING INFORMATION ON A LOCAL OSCIL...

SEMICONDUCTOR DEVICES HAVING A NON-GALVANIC CONNECTION

SEMICONDUCTOR PACKAGE WITH PLASTIC WAVEGUIDE

SEMICONDUCTOR DEVICES HAVING CUTOUTS IN AN ENCAPSULATION MATERIAL A...

On-Chip Antennas for Semiconductor Devices and Related Manufacturin...

SEMICONDUCTOR DEVICES COMPRISING METALLIZATIONS COMPOSED OF POROUS...

SEMICONDUCTOR APPARATUSES WITH RADIO-FREQUENCY LINE ELEMENTS, AND A...

ELECTRONIC DEVICE INCLUDING REDISTRIBUTION LAYER PAD HAVING A VOID

TRANSMISSION OF WIRELESS SIGNAL HAVING INFORMATION ON A LOCAL OSCIL...

Semiconductor Devices with On-Chip Antennas and Manufacturing Thereof

EMBEDDED CHIP PACKAGES AND METHODS FOR MANUFACTURING AN EMBEDDED CH...

Method of Manufacturing a Semiconductor Package Having a Semiconduc...

Method of Manufacturing a Semiconductor Package Having an Integrate...

Chip carrier laminate with high frequency dielectric and thermomech...