Walter L. Moden

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatuses including ball grid arrays and associated systems and m...
- Patent number 11,996,359
- Issue date May 28, 2024
- Micron Technology, Inc.
- David K. Ovard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid arrays and associated apparatuses and systems
- Patent number 11,670,578
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- David K. Ovard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and packages and methods of forming semicondu...
- Patent number 10,083,937
- Issue date Sep 25, 2018
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and packages
- Patent number 9,502,369
- Issue date Nov 22, 2016
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grid array packages and assemblies including the same
- Patent number 8,299,598
- Issue date Oct 30, 2012
- Round Rock Research, LLC
- Walter L. Moden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for providing and using grid array packages
- Patent number 8,198,138
- Issue date Jun 12, 2012
- Round Rock Research, LLC
- Walter L. Moden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable semiconductor device assemblies
- Patent number 8,164,175
- Issue date Apr 24, 2012
- Round Rock Research, LLC
- Walter L. Moden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable ball grid array package
- Patent number RE43112
- Issue date Jan 17, 2012
- Round Rock Research, LLC
- David J. Corisis
- 438 - Semiconductor device manufacturing: process
Information Patent Grant
Grid array packages
- Patent number 8,049,317
- Issue date Nov 1, 2011
- Round Rock Research, LLC
- Walter L. Moden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package support system
- Patent number 8,035,974
- Issue date Oct 11, 2011
- Round Rock Research, LLC
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package support system
- Patent number 7,894,192
- Issue date Feb 22, 2011
- Round Rock Research, LLC
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical surface mount assembly and methods
- Patent number 7,871,859
- Issue date Jan 18, 2011
- Round Rock Research, LLC
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable ceramic FBGA for high thermal applications
- Patent number 7,829,991
- Issue date Nov 9, 2010
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor BGA package having a segmented voltage plane
- Patent number 7,663,224
- Issue date Feb 16, 2010
- Micron Technology, Inc.
- Michael W. Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for installing a plurality of circuit devices
- Patent number 7,600,314
- Issue date Oct 13, 2009
- Micron Technology, Inc.
- Larry Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for securing packaged semiconductor devices to carrier subs...
- Patent number 7,569,418
- Issue date Aug 4, 2009
- Micron Technology, Inc.
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making semiconductor BGA package having a segmented volta...
- Patent number 7,501,313
- Issue date Mar 10, 2009
- Micron Technology, Inc.
- Michael W. Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly for stacked BGA packages
- Patent number 7,408,255
- Issue date Aug 5, 2008
- Micron Technology, Inc.
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module assembly for stacked BGA packages
- Patent number 7,400,032
- Issue date Jul 15, 2008
- Micron Technology, Inc.
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module assembly and method for stacked BGA packages
- Patent number 7,396,702
- Issue date Jul 8, 2008
- Micron Technology, Inc.
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip adaptor package for bare die
- Patent number 7,381,591
- Issue date Jun 3, 2008
- Micron Technology, Inc.
- Walter L. Moden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip adaptor package for bare die
- Patent number 7,329,945
- Issue date Feb 12, 2008
- Micron Technology, Inc.
- Walter L. Moden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable ceramic FBGA for high thermal applications
- Patent number 7,285,442
- Issue date Oct 23, 2007
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module assembly and method for stacked BGA packages
- Patent number 7,279,797
- Issue date Oct 9, 2007
- Micron Technology, Inc.
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor BGA package having a segmented voltage plane and meth...
- Patent number 7,233,064
- Issue date Jun 19, 2007
- Micron Technology, Inc.
- Michael W. Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical surface mount assembly and methods
- Patent number 7,227,261
- Issue date Jun 5, 2007
- Micron Technology, Inc.
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imaging system
- Patent number 7,215,015
- Issue date May 8, 2007
- Micron Technology, Inc.
- Walter Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for mounting microelectronic devices on a mirr...
- Patent number 7,200,022
- Issue date Apr 3, 2007
- Micron Technology, Inc.
- Chris G. Martin
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatus and method for mounting microelectronic devices on a mirr...
- Patent number 7,161,821
- Issue date Jan 9, 2007
- Micron Technology, Inc.
- Chris G. Martin
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of temporarily securing a die to a burn-in carrier
- Patent number 7,105,380
- Issue date Sep 12, 2006
- Micron Technology, Inc.
- Walter L. Moden
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
HIGH-PERFORMANCE SEMICONDUCTOR FAN OUT PACKAGE
- Publication number 20240355748
- Publication date Oct 24, 2024
- Micron Technology, Inc.
- Chan H. YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES INCLUDING BALL GRID ARRAYS AND ASSOCIATED SYSTEMS
- Publication number 20240282691
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- David K. Ovard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MASK FAULT FIBER OPTICS SENSOR
- Publication number 20240284590
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Chan H. Yoo
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH A THERMALLY-CONDUCTIVE CHANNEL
- Publication number 20240145337
- Publication date May 2, 2024
- Koustav SINHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH CONTINUOUS SLOT VIAS
- Publication number 20240074055
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTISTEP ETCH FOR DIRECT CHIP ATTACH (DCA) SUBSTRATES, AND ASSOCIA...
- Publication number 20240047351
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES INCLUDING BALL GRID ARRAYS AND ASSOCIATED SYSTEMS AND M...
- Publication number 20230275016
- Publication date Aug 31, 2023
- Micron Technology, Inc.
- David K. Ovard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAYS AND ASSOCIATED APPARATUSES AND SYSTEMS
- Publication number 20210375738
- Publication date Dec 2, 2021
- Micron Technology, Inc.
- David K. Ovard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PACKAGES AND METHODS OF FORMING SEMICONDU...
- Publication number 20170069603
- Publication date Mar 9, 2017
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PACKAGES AND METHODS OF FORMING SEMICONDU...
- Publication number 20160225734
- Publication date Aug 4, 2016
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SURFACE MOUNT ASSEMBLY AND METHODS
- Publication number 20110101514
- Publication date May 5, 2011
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKABLE SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20100155930
- Publication date Jun 24, 2010
- Micron Technology, Inc.
- Walter L. Moden
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
GRID ARRAY PACKAGES
- Publication number 20100155966
- Publication date Jun 24, 2010
- Micron Technology, Inc.
- Walter L. Moden
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
INTERGRATED CIRCUIT PACKAGE SUPPORT SYSTEM
- Publication number 20100148334
- Publication date Jun 17, 2010
- Micron Technology, Inc.
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GRID ARRAY PACKAGES AND ASSEMBLIES INCLUDING THE SAME
- Publication number 20100148352
- Publication date Jun 17, 2010
- Micron Technology, Inc.
- Walter L. Moden
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
STACKABLE CERAMIC FBGA FOR HIGH THERMAL APPLICATIONS
- Publication number 20080042252
- Publication date Feb 21, 2008
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ADAPTOR PACKAGE FOR BARE DIE
- Publication number 20080023853
- Publication date Jan 31, 2008
- Micron Technology, Inc.
- Walter L. Moden
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Methods of making semiconductor fuses
- Publication number 20080003712
- Publication date Jan 3, 2008
- Walter L. Moden
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Apparatus and method for mounting microelectronic devices on a mirr...
- Publication number 20070115712
- Publication date May 24, 2007
- Chris G. Martin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor BGA package having a segmented voltage plane
- Publication number 20060267177
- Publication date Nov 30, 2006
- Michael W. Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making semiconductor BGA package having a segmented volta...
- Publication number 20060270107
- Publication date Nov 30, 2006
- Michael W. Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for a low profile multi-IC chip package connector
- Publication number 20060252180
- Publication date Nov 9, 2006
- Walter L. Moden
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flip-chip adaptor package for bare die
- Publication number 20060211174
- Publication date Sep 21, 2006
- Walter L. Moden
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Module assembly and method for stacked BGA packages
- Publication number 20060060957
- Publication date Mar 23, 2006
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Module assembly and method for stacked BGA packages
- Publication number 20060049504
- Publication date Mar 9, 2006
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for installing a circuit device
- Publication number 20060048382
- Publication date Mar 9, 2006
- Larry Kinsman
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Module assembly and method for stacked BGA packages
- Publication number 20060051953
- Publication date Mar 9, 2006
- David J. Corisis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vertically mountable and alignable semiconductor device packages an...
- Publication number 20060033190
- Publication date Feb 16, 2006
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for securing packaged semiconductor devices to carrier subs...
- Publication number 20060030072
- Publication date Feb 9, 2006
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Alignment devices for securing semiconductor devices to carrier sub...
- Publication number 20060001150
- Publication date Jan 5, 2006
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Walter L. Moden

Person

Patents Grantslast 30 patents

Apparatuses including ball grid arrays and associated systems and m...

Ball grid arrays and associated apparatuses and systems

Semiconductor devices and packages and methods of forming semicondu...

Semiconductor devices and packages

Grid array packages and assemblies including the same

Methods for providing and using grid array packages

Stackable semiconductor device assemblies

Stackable ball grid array package

Grid array packages

Integrated circuit package support system

Integrated circuit package support system

Vertical surface mount assembly and methods

Stackable ceramic FBGA for high thermal applications

Semiconductor BGA package having a segmented voltage plane

Methods for installing a plurality of circuit devices

Methods for securing packaged semiconductor devices to carrier subs...

Method of making semiconductor BGA package having a segmented volta...

Assembly for stacked BGA packages

Module assembly for stacked BGA packages

Module assembly and method for stacked BGA packages

Flip-chip adaptor package for bare die

Flip-chip adaptor package for bare die

Stackable ceramic FBGA for high thermal applications

Module assembly and method for stacked BGA packages

Semiconductor BGA package having a segmented voltage plane and meth...

Vertical surface mount assembly and methods

Imaging system

Apparatus and method for mounting microelectronic devices on a mirr...

Apparatus and method for mounting microelectronic devices on a mirr...

Method of temporarily securing a die to a burn-in carrier

Patents Applicationslast 30 patents

HIGH-PERFORMANCE SEMICONDUCTOR FAN OUT PACKAGE

APPARATUSES INCLUDING BALL GRID ARRAYS AND ASSOCIATED SYSTEMS

SOLDER MASK FAULT FIBER OPTICS SENSOR

SEMICONDUCTOR DEVICE ASSEMBLY WITH A THERMALLY-CONDUCTIVE CHANNEL

SUBSTRATES WITH CONTINUOUS SLOT VIAS

MULTISTEP ETCH FOR DIRECT CHIP ATTACH (DCA) SUBSTRATES, AND ASSOCIA...

APPARATUSES INCLUDING BALL GRID ARRAYS AND ASSOCIATED SYSTEMS AND M...

BALL GRID ARRAYS AND ASSOCIATED APPARATUSES AND SYSTEMS

SEMICONDUCTOR DEVICES AND PACKAGES AND METHODS OF FORMING SEMICONDU...

SEMICONDUCTOR DEVICES AND PACKAGES AND METHODS OF FORMING SEMICONDU...

VERTICAL SURFACE MOUNT ASSEMBLY AND METHODS

STACKABLE SEMICONDUCTOR DEVICE ASSEMBLIES

GRID ARRAY PACKAGES

INTERGRATED CIRCUIT PACKAGE SUPPORT SYSTEM

GRID ARRAY PACKAGES AND ASSEMBLIES INCLUDING THE SAME

STACKABLE CERAMIC FBGA FOR HIGH THERMAL APPLICATIONS

FLIP CHIP ADAPTOR PACKAGE FOR BARE DIE

Methods of making semiconductor fuses

Apparatus and method for mounting microelectronic devices on a mirr...

Semiconductor BGA package having a segmented voltage plane

Method of making semiconductor BGA package having a segmented volta...

Method for a low profile multi-IC chip package connector

Flip-chip adaptor package for bare die

Module assembly and method for stacked BGA packages

Module assembly and method for stacked BGA packages

Method and apparatus for installing a circuit device

Module assembly and method for stacked BGA packages

Vertically mountable and alignable semiconductor device packages an...

Methods for securing packaged semiconductor devices to carrier subs...

Alignment devices for securing semiconductor devices to carrier sub...