Walter Schwarzenbach

Person

Saint Nazaire Eymes, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Device architectures with tensile and compressive strained substrates
- Patent number 12,218,201
- Issue date Feb 4, 2025
- National University of Singapore
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor on insulator structure for a front side type imager
- Patent number 12,198,975
- Issue date Jan 14, 2025
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding two substrates
- Patent number 12,176,244
- Issue date Dec 24, 2024
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-side-type image sensor
- Patent number 12,148,755
- Issue date Nov 19, 2024
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a substrate for a front-facing image sensor
- Patent number 12,100,727
- Issue date Sep 24, 2024
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an advanced substrate for hybrid integration
- Patent number 12,074,056
- Issue date Aug 27, 2024
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a CFET device
- Patent number 11,876,020
- Issue date Jan 16, 2024
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for a front-side-type image sensor and method for produci...
- Patent number 11,855,120
- Issue date Dec 26, 2023
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a strained semiconductor-on-insulator substrate
- Patent number 11,728,207
- Issue date Aug 15, 2023
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-side type image sensors
- Patent number 11,552,123
- Issue date Jan 10, 2023
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an advanced substrate for hybrid integration
- Patent number 11,476,153
- Issue date Oct 18, 2022
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for a front-side-type image sensor and method for produci...
- Patent number 11,282,889
- Issue date Mar 22, 2022
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a structure for forming a tridimensional m...
- Patent number 11,205,702
- Issue date Dec 21, 2021
- Soitec
- Christophe Figuet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor on insulator type structure...
- Patent number 11,127,624
- Issue date Sep 21, 2021
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for front side type imager and method of manufacturing su...
- Patent number 11,127,775
- Issue date Sep 21, 2021
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a strained semiconductor-on-insulator substrate
- Patent number 10,957,577
- Issue date Mar 23, 2021
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-side type image sensor and method for manufacturing such a se...
- Patent number 10,903,263
- Issue date Jan 26, 2021
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a strained semiconductor-on-insulator substrate
- Patent number 10,672,646
- Issue date Jun 2, 2020
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of testing a semiconductor-on-insulator structure and applic...
- Patent number 9,698,063
- Issue date Jul 4, 2017
- Soitec
- Patrick Reynaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor layers including transistor ch...
- Patent number 9,576,798
- Issue date Feb 21, 2017
- Soitec
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor layers including transistor ch...
- Patent number 9,209,301
- Issue date Dec 8, 2015
- Soitec
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for treating a semiconductor-on-insulator structure for imp...
- Patent number 9,190,284
- Issue date Nov 17, 2015
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring a layer from a donor substrate onto a handl...
- Patent number 8,728,913
- Issue date May 20, 2014
- Soitec
- Sébastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for finishing a substrate of the semiconductor-on-insulator...
- Patent number 8,617,962
- Issue date Dec 31, 2013
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring a layer from a donor substrate onto a handl...
- Patent number 8,476,148
- Issue date Jul 2, 2013
- Soitec
- Sébastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reclaiming a surface of a substrate
- Patent number 8,435,897
- Issue date May 7, 2013
- S.O.I. Tec Silicon on Insulator Technologies
- Aziz Alami-Idrissi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a structure by layer transfer
- Patent number 8,420,500
- Issue date Apr 16, 2013
- Soitec
- Brigitte Soulier-Bouchet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Finishing method for a silicon on insulator substrate
- Patent number 8,389,412
- Issue date Mar 5, 2013
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for routing a chamfered substrate
- Patent number 8,357,587
- Issue date Jan 22, 2013
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding two substrates
- Patent number 8,349,703
- Issue date Jan 8, 2013
- Soitec
- Sébastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE FOR A FRONT-FACING IMAGE SENSOR
- Publication number 20250015122
- Publication date Jan 9, 2025
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ADVANCED SUBSTRATE FOR HYBRID INTEGRATION
- Publication number 20240379410
- Publication date Nov 14, 2024
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEMENTARY FIELD-EFFECT TRANSISTOR DEVICE INCLUDING AT LEAST ONE...
- Publication number 20240145314
- Publication date May 2, 2024
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A STRAINED SEMICONDUCTOR-ON-INSULATOR SUBSTRATE
- Publication number 20230386896
- Publication date Nov 30, 2023
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE FOR SOI STRUCTURE AND ASSOCIATED MANUFACTURING ME...
- Publication number 20230317496
- Publication date Oct 5, 2023
- SOITEC
- Isabelle Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR-ON-INSULATOR SUBSTRATE FOR...
- Publication number 20230215760
- Publication date Jul 6, 2023
- SOITEC
- Isabelle Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR-ON-INSULATOR SUBSTRATE FOR...
- Publication number 20230207382
- Publication date Jun 29, 2023
- SOITEC
- Isabelle Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-SIDE TYPE IMAGE SENSORS
- Publication number 20230127950
- Publication date Apr 27, 2023
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ADVANCED SUBSTRATE FOR HYBRID INTEGRATION
- Publication number 20230063362
- Publication date Mar 2, 2023
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN IMAGE SENSOR
- Publication number 20230039295
- Publication date Feb 9, 2023
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING TWO SUBSTRATES
- Publication number 20230032336
- Publication date Feb 2, 2023
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE ARCHITECTURES WITH TENSILE AND COMPRESSIVE STRAINED SUBSTRATES
- Publication number 20220399441
- Publication date Dec 15, 2022
- SOITEC
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR A FRONT-SIDE-TYPE IMAGE SENSOR AND METHOD FOR PRODUCI...
- Publication number 20220157882
- Publication date May 19, 2022
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE FOR DIGITAL AND RADIOFREQUENCY APPLICATIONS...
- Publication number 20220076993
- Publication date Mar 10, 2022
- SOITEC
- Yvan Morandini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE FOR DIGITAL AND RADIOFREQUENCY APPLICATIONS
- Publication number 20220076992
- Publication date Mar 10, 2022
- SOITEC
- Yvan Morandini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SUBSTRATE FOR A FRONT-FACING IMAGE SENSOR
- Publication number 20220059603
- Publication date Feb 24, 2022
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ADVANCED SUBSTRATE FOR HYBRID INTEGRATION
- Publication number 20220051934
- Publication date Feb 17, 2022
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-SIDE-TYPE IMAGE SENSOR AND METHOD FR PRODUCING SUCH A SENSOR
- Publication number 20210384223
- Publication date Dec 9, 2021
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ON INSULATOR STRUCTURE FOR A FRONT SIDE TYPE IMAGER
- Publication number 20210366763
- Publication date Nov 25, 2021
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A STRAINED SEMICONDUCTOR-ON-INSULATOR SUBSTRATE
- Publication number 20210225695
- Publication date Jul 22, 2021
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CFET DEVICE
- Publication number 20210202326
- Publication date Jul 1, 2021
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-SIDE TYPE IMAGE SENSORS
- Publication number 20210118936
- Publication date Apr 22, 2021
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A STRAINED SEMICONDUCTOR-ON-INSULATOR SUBSTRATE
- Publication number 20200321243
- Publication date Oct 8, 2020
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A STRUCTURE FOR FORMING A TRIDIMENSIONAL M...
- Publication number 20200295138
- Publication date Sep 17, 2020
- Christophe Figuet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ON INSULATOR TYPE STRUCTURE, NOTABLY FOR A FRONT SIDE...
- Publication number 20200152689
- Publication date May 14, 2020
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR A FRONT-SIDE-TYPE IMAGE SENSOR AND METHOD FOR PRODUCI...
- Publication number 20200127041
- Publication date Apr 23, 2020
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR FRONT SIDE TYPE IMAGER AND METHOD OF MANUFACTURING SU...
- Publication number 20190348462
- Publication date Nov 14, 2019
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-SIDE TYPE IMAGE SENSOR AND METHOD FOR MANUFACTURING SUCH A SE...
- Publication number 20190267425
- Publication date Aug 29, 2019
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A STRAINED SEMICONDUCTOR-ON-INSULATOR SUBSTRATE
- Publication number 20190181035
- Publication date Jun 13, 2019
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR LAYERS INCLUDING TRANSISTOR CH...
- Publication number 20160086803
- Publication date Mar 24, 2016
- SOITEC
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS

Walter Schwarzenbach

Person

Patents Grantslast 30 patents

Device architectures with tensile and compressive strained substrates

Semiconductor on insulator structure for a front side type imager

Method for bonding two substrates

Front-side-type image sensor

Method for manufacturing a substrate for a front-facing image sensor

Method for producing an advanced substrate for hybrid integration

Method for manufacturing a CFET device

Substrate for a front-side-type image sensor and method for produci...

Method for fabricating a strained semiconductor-on-insulator substrate

Front-side type image sensors

Method for producing an advanced substrate for hybrid integration

Substrate for a front-side-type image sensor and method for produci...

Method for manufacturing a structure for forming a tridimensional m...

Method of manufacturing a semiconductor on insulator type structure...

Substrate for front side type imager and method of manufacturing su...

Method for fabricating a strained semiconductor-on-insulator substrate

Front-side type image sensor and method for manufacturing such a se...

Method for fabricating a strained semiconductor-on-insulator substrate

Method of testing a semiconductor-on-insulator structure and applic...

Method for fabricating semiconductor layers including transistor ch...

Method for fabricating semiconductor layers including transistor ch...

Process for treating a semiconductor-on-insulator structure for imp...

Method for transferring a layer from a donor substrate onto a handl...

Method for finishing a substrate of the semiconductor-on-insulator...

Method for transferring a layer from a donor substrate onto a handl...

Method for reclaiming a surface of a substrate

Method of producing a structure by layer transfer

Finishing method for a silicon on insulator substrate

Method for routing a chamfered substrate

Method of bonding two substrates

Patents Applicationslast 30 patents

STRUCTURE FOR A FRONT-FACING IMAGE SENSOR

METHOD FOR PRODUCING AN ADVANCED SUBSTRATE FOR HYBRID INTEGRATION

COMPLEMENTARY FIELD-EFFECT TRANSISTOR DEVICE INCLUDING AT LEAST ONE...

METHOD FOR FABRICATING A STRAINED SEMICONDUCTOR-ON-INSULATOR SUBSTRATE

CARRIER SUBSTRATE FOR SOI STRUCTURE AND ASSOCIATED MANUFACTURING ME...

METHOD FOR MANUFACTURING A SEMICONDUCTOR-ON-INSULATOR SUBSTRATE FOR...

METHOD FOR MANUFACTURING A SEMICONDUCTOR-ON-INSULATOR SUBSTRATE FOR...

FRONT-SIDE TYPE IMAGE SENSORS

METHOD FOR PRODUCING AN ADVANCED SUBSTRATE FOR HYBRID INTEGRATION

METHOD FOR MANUFACTURING AN IMAGE SENSOR

METHOD FOR BONDING TWO SUBSTRATES

DEVICE ARCHITECTURES WITH TENSILE AND COMPRESSIVE STRAINED SUBSTRATES

SUBSTRATE FOR A FRONT-SIDE-TYPE IMAGE SENSOR AND METHOD FOR PRODUCI...

SEMICONDUCTOR STRUCTURE FOR DIGITAL AND RADIOFREQUENCY APPLICATIONS...

SEMICONDUCTOR STRUCTURE FOR DIGITAL AND RADIOFREQUENCY APPLICATIONS

METHOD FOR MANUFACTURING A SUBSTRATE FOR A FRONT-FACING IMAGE SENSOR

METHOD FOR PRODUCING AN ADVANCED SUBSTRATE FOR HYBRID INTEGRATION

FRONT-SIDE-TYPE IMAGE SENSOR AND METHOD FR PRODUCING SUCH A SENSOR

SEMICONDUCTOR ON INSULATOR STRUCTURE FOR A FRONT SIDE TYPE IMAGER

METHOD FOR FABRICATING A STRAINED SEMICONDUCTOR-ON-INSULATOR SUBSTRATE

METHOD FOR MANUFACTURING A CFET DEVICE

FRONT-SIDE TYPE IMAGE SENSORS

METHOD FOR FABRICATING A STRAINED SEMICONDUCTOR-ON-INSULATOR SUBSTRATE

METHOD FOR MANUFACTURING A STRUCTURE FOR FORMING A TRIDIMENSIONAL M...

SEMICONDUCTOR ON INSULATOR TYPE STRUCTURE, NOTABLY FOR A FRONT SIDE...

SUBSTRATE FOR A FRONT-SIDE-TYPE IMAGE SENSOR AND METHOD FOR PRODUCI...

SUBSTRATE FOR FRONT SIDE TYPE IMAGER AND METHOD OF MANUFACTURING SU...

FRONT-SIDE TYPE IMAGE SENSOR AND METHOD FOR MANUFACTURING SUCH A SE...

METHOD FOR FABRICATING A STRAINED SEMICONDUCTOR-ON-INSULATOR SUBSTRATE

METHOD FOR FABRICATING SEMICONDUCTOR LAYERS INCLUDING TRANSISTOR CH...