Wang Ai-Chie

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Methods of forming and assembling pre-encapsulated assemblies and o...
- Patent number 8,399,297
- Issue date Mar 19, 2013
- Micron Technology, Inc.
- Tay Wuu Yean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-encapsulated cavity interposer
- Patent number 8,072,082
- Issue date Dec 6, 2011
- Micron Technology, Inc.
- Tay Wuu Yean
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRE-ENCAPSULATED CAVITY INTERPOSER
- Publication number 20120034740
- Publication date Feb 9, 2012
- Micron Technology, Inc.
- Tay Wuu Yean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-ENCAPSULATED CAVITY INTERPOSER
- Publication number 20090267171
- Publication date Oct 29, 2009
- Micron Technology, Inc.
- Tay Wuu Yean
- H01 - BASIC ELECTRIC ELEMENTS