Warren M. Farnworth

Person

Nampa, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and systems for imaging and cutting semiconductor wafers an...
- Patent number 11,450,577
- Issue date Sep 20, 2022
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microfeature workpieces having alloyed conductive structures, and a...
- Patent number 11,075,146
- Issue date Jul 27, 2021
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfeature workpieces having alloyed conductive structures, and a...
- Patent number 10,541,192
- Issue date Jan 21, 2020
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfeature workpieces having alloyed conductive structures, and a...
- Patent number 9,737,947
- Issue date Aug 22, 2017
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for imaging and cutting semiconductor wafers an...
- Patent number 9,579,825
- Issue date Feb 28, 2017
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-component integrated circuit contacts
- Patent number 9,337,162
- Issue date May 10, 2016
- Micron Technology, Inc.
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 9,165,888
- Issue date Oct 20, 2015
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having backside redistribution layers and meth...
- Patent number 8,963,292
- Issue date Feb 24, 2015
- Micron Technology, Inc.
- Steve Oliver
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imager device with electric connections to electrical device
- Patent number 8,951,858
- Issue date Feb 10, 2015
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of processing semiconductor substrates, electrostatic carri...
- Patent number 8,929,052
- Issue date Jan 6, 2015
- Micron Technology, Inc.
- Dewali Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and methods for manufacturing microelectron...
- Patent number 8,896,105
- Issue date Nov 25, 2014
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaged microelectronic imagers having interconnects f...
- Patent number 8,816,463
- Issue date Aug 26, 2014
- Round Rock Research, LLC
- Salman Akram
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of forming vias in semiconductor substrates and resulting st...
- Patent number 8,786,097
- Issue date Jul 22, 2014
- Micron Technology, Inc.
- Charles M. Watkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for wafer-level packaging of microfeature devices and micro...
- Patent number 8,704,380
- Issue date Apr 22, 2014
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 8,680,654
- Issue date Mar 25, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including porous insulators
- Patent number 8,680,680
- Issue date Mar 25, 2014
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-wafer interconnects for photoimager and memory wafers
- Patent number 8,669,179
- Issue date Mar 11, 2014
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfeature workpieces having alloyed conductive structures, and a...
- Patent number 8,637,994
- Issue date Jan 28, 2014
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for imaging and cutting semiconductor wafers an...
- Patent number 8,597,074
- Issue date Dec 3, 2013
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic devices with improved heat dissipation and methods...
- Patent number 8,592,254
- Issue date Nov 26, 2013
- Micron Technology, Inc.
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and methods for manufacturing microelectron...
- Patent number 8,569,093
- Issue date Oct 29, 2013
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor constructions and assemblies
- Patent number 8,513,113
- Issue date Aug 20, 2013
- Micron Technology, Inc.
- Steven Oliver
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of processing semiconductor substrates, electrostatic carri...
- Patent number 8,503,156
- Issue date Aug 6, 2013
- Micron Technology, Inc.
- Dewali Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-wafer interconnects for photoimager and memory wafers
- Patent number 8,502,353
- Issue date Aug 6, 2013
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming imager device with electric connections to elect...
- Patent number 8,440,491
- Issue date May 14, 2013
- Micron Technology, Inc.
- Warren Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 8,435,836
- Issue date May 7, 2013
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having backside redistribution layers
- Patent number 8,395,242
- Issue date Mar 12, 2013
- Micron Technology, Inc.
- Steve Oliver
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfeature workpieces having alloyed conductive structures, and a...
- Patent number 8,308,053
- Issue date Nov 13, 2012
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic devices with improved heat dissipation and methods...
- Patent number 8,291,966
- Issue date Oct 23, 2012
- Micron Technology, Inc.
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-component integrated circuit contacts
- Patent number 8,268,715
- Issue date Sep 18, 2012
- Micron Technology, Inc.
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND A...
- Publication number 20200219793
- Publication date Jul 9, 2020
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND A...
- Publication number 20170320154
- Publication date Nov 9, 2017
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS FOR IMAGING AND CUTTING SEMICONDUCTOR WAFERS AN...
- Publication number 20170148691
- Publication date May 25, 2017
- Micron Technology, Inc.
- Warren M. Farnworth
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND A...
- Publication number 20140284375
- Publication date Sep 25, 2014
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING A PORUOUS INSULATOR, AND RELATED METHODS OF FORM...
- Publication number 20140206203
- Publication date Jul 24, 2014
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20140206145
- Publication date Jul 24, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR IMAGING AND CUTTING SEMICONDUCTOR WAFERS AN...
- Publication number 20140083270
- Publication date Mar 27, 2014
- Micron Technology, Inc.
- Warren M. Farnworth
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING MICROELECTRON...
- Publication number 20140042575
- Publication date Feb 13, 2014
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Constructions and Assemblies and Electronic Systems
- Publication number 20130330922
- Publication date Dec 12, 2013
- Micron Technology, Inc.
- Steve Oliver
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS
- Publication number 20130295766
- Publication date Nov 7, 2013
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Processing Semiconductor Substrates, Electrostatic Carri...
- Publication number 20130276985
- Publication date Oct 24, 2013
- Dewali Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGER DEVICE WITH ELECTRIC CONNECTIONS TO ELECTRICAL DEVICE
- Publication number 20130249036
- Publication date Sep 26, 2013
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20130234296
- Publication date Sep 12, 2013
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING BACKSIDE REDISTRIBUTION LAYERS AND METH...
- Publication number 20130181348
- Publication date Jul 18, 2013
- Micron Technology, Inc.
- Steve Oliver
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COMPONENT INTEGRATED CIRCUIT CONTACTS
- Publication number 20130001780
- Publication date Jan 3, 2013
- Micron Technology, Inc.
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND A...
- Publication number 20130004792
- Publication date Jan 3, 2013
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC DEVICES WITH IMPROVED HEAT DISSIPATION AND METHODS...
- Publication number 20130003303
- Publication date Jan 3, 2013
- Micron Technology, Inc.
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGERS WITH BURIED METAL TRENCHES AND THOUGH-SILICON VIAS
- Publication number 20120193744
- Publication date Aug 2, 2012
- Swarnal Borthakur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGED MICROELECTRONIC IMAGERS AND PROCESSES FOR WAFE...
- Publication number 20120104528
- Publication date May 3, 2012
- ROUND ROCK RESEARCH, LLC
- Salman Akram
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHODS AND SYSTEMS FOR IMAGING AND CUTTING SEMICONDUCTOR WAFERS AN...
- Publication number 20120048085
- Publication date Mar 1, 2012
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of Processing Semiconductor Substrates, Electrostatic Carri...
- Publication number 20110253042
- Publication date Oct 20, 2011
- Micron Technology, Inc.
- Dewali Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS
- Publication number 20110233777
- Publication date Sep 29, 2011
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING BACKSIDE REDISTRIBUTION LAYERS AND METH...
- Publication number 20110169122
- Publication date Jul 14, 2011
- Micron Technology, Inc.
- Steve Oliver
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20110111561
- Publication date May 12, 2011
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SURFACE MOUNT ASSEMBLY AND METHODS
- Publication number 20110101514
- Publication date May 5, 2011
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING VIAS IN SEMICONDUCTOR SUBSTRATES AND RESULTING ST...
- Publication number 20110074043
- Publication date Mar 31, 2011
- Micron Technology, Inc.
- Charles M. Watkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING SEMICONDUCTOR COMPONENTS AND PACKAGED SEMIC...
- Publication number 20110031614
- Publication date Feb 10, 2011
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR WAFER-LEVEL PACKAGING OF MICROFEATURE DEVICES AND MICRO...
- Publication number 20100327462
- Publication date Dec 30, 2010
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGER DEVICE WITH ELECTRIC CONNECTIONS TO ELECTRICAL DEVICE
- Publication number 20100273288
- Publication date Oct 28, 2010
- Warren Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COMPONENT INTEGRATED CIRCUIT CONTACTS
- Publication number 20100203721
- Publication date Aug 12, 2010
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS

Warren M. Farnworth

Person

Patents Grantslast 30 patents

Methods and systems for imaging and cutting semiconductor wafers an...

Microfeature workpieces having alloyed conductive structures, and a...

Microfeature workpieces having alloyed conductive structures, and a...

Microfeature workpieces having alloyed conductive structures, and a...

Methods and systems for imaging and cutting semiconductor wafers an...

Multi-component integrated circuit contacts

Interconnect structures for stacked dies, including penetrating str...

Semiconductor device having backside redistribution layers and meth...

Imager device with electric connections to electrical device

Methods of processing semiconductor substrates, electrostatic carri...

Microelectronic devices and methods for manufacturing microelectron...

Wafer-level packaged microelectronic imagers having interconnects f...

Method of forming vias in semiconductor substrates and resulting st...

Methods for wafer-level packaging of microfeature devices and micro...

Interconnect structures for stacked dies, including penetrating str...

Semiconductor devices including porous insulators

Through-wafer interconnects for photoimager and memory wafers

Microfeature workpieces having alloyed conductive structures, and a...

Methods and systems for imaging and cutting semiconductor wafers an...

Microelectronic devices with improved heat dissipation and methods...

Microelectronic devices and methods for manufacturing microelectron...

Methods of forming semiconductor constructions and assemblies

Methods of processing semiconductor substrates, electrostatic carri...

Through-wafer interconnects for photoimager and memory wafers

Methods of forming imager device with electric connections to elect...

Interconnect structures for stacked dies, including penetrating str...

Semiconductor device having backside redistribution layers

Microfeature workpieces having alloyed conductive structures, and a...

Microelectronic devices with improved heat dissipation and methods...

Multi-component integrated circuit contacts

Patents Applicationslast 30 patents

MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND A...

MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND A...

METHODS AND SYSTEMS FOR IMAGING AND CUTTING SEMICONDUCTOR WAFERS AN...

MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND A...

METHODS OF FORMING A PORUOUS INSULATOR, AND RELATED METHODS OF FORM...

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

METHODS AND SYSTEMS FOR IMAGING AND CUTTING SEMICONDUCTOR WAFERS AN...

MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING MICROELECTRON...

Semiconductor Constructions and Assemblies and Electronic Systems

THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS

Methods of Processing Semiconductor Substrates, Electrostatic Carri...

IMAGER DEVICE WITH ELECTRIC CONNECTIONS TO ELECTRICAL DEVICE

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

SEMICONDUCTOR DEVICE HAVING BACKSIDE REDISTRIBUTION LAYERS AND METH...

MULTI-COMPONENT INTEGRATED CIRCUIT CONTACTS

MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND A...

MICROELECTRONIC DEVICES WITH IMPROVED HEAT DISSIPATION AND METHODS...

IMAGERS WITH BURIED METAL TRENCHES AND THOUGH-SILICON VIAS

WAFER-LEVEL PACKAGED MICROELECTRONIC IMAGERS AND PROCESSES FOR WAFE...

METHODS AND SYSTEMS FOR IMAGING AND CUTTING SEMICONDUCTOR WAFERS AN...

Methods of Processing Semiconductor Substrates, Electrostatic Carri...

THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS

SEMICONDUCTOR DEVICE HAVING BACKSIDE REDISTRIBUTION LAYERS AND METH...

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

VERTICAL SURFACE MOUNT ASSEMBLY AND METHODS

METHOD OF FORMING VIAS IN SEMICONDUCTOR SUBSTRATES AND RESULTING ST...

METHODS FOR FABRICATING SEMICONDUCTOR COMPONENTS AND PACKAGED SEMIC...

METHODS FOR WAFER-LEVEL PACKAGING OF MICROFEATURE DEVICES AND MICRO...

IMAGER DEVICE WITH ELECTRIC CONNECTIONS TO ELECTRICAL DEVICE

MULTI-COMPONENT INTEGRATED CIRCUIT CONTACTS