Wei-Chung Hsiao

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and methods for handling die carriers
- Patent number 11,682,571
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Sheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for handling die carriers
- Patent number 11,398,396
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Sheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DCPD-derived polyether and method of producing the same
- Patent number 10,711,103
- Issue date Jul 14, 2020
- NATIONAL CHUNG SAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- Wen-Chiung Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating semiconductor package structure
- Patent number 10,141,266
- Issue date Nov 27, 2018
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating package structure
- Patent number 10,109,572
- Issue date Oct 23, 2018
- Siliconware Precision Industries Co., Ltd.
- Wei-Chung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a packaging substrate including a carrier hav...
- Patent number 10,096,491
- Issue date Oct 9, 2018
- Silicon Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-layer wiring package substrate, single-layer wiring package...
- Patent number 10,068,842
- Issue date Sep 4, 2018
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of fabricating the same
- Patent number 10,043,757
- Issue date Aug 7, 2018
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package structure with an embedded electronic...
- Patent number 10,002,825
- Issue date Jun 19, 2018
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of coreless packaging substrate
- Patent number 9,899,249
- Issue date Feb 20, 2018
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with transportable edge ring for substrate...
- Patent number 9,741,600
- Issue date Aug 22, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chang Hsieh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single-layer wiring package substrate, single-layer wiring package...
- Patent number 9,735,080
- Issue date Aug 15, 2017
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with an embedded electronic component and method...
- Patent number 9,716,060
- Issue date Jul 25, 2017
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having a laminated release layer and method for f...
- Patent number 9,673,140
- Issue date Jun 6, 2017
- Siliconware Precision Industries Co., Ltd.
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication method thereof
- Patent number 9,564,390
- Issue date Feb 7, 2017
- Siliconware Precision Industries Co., Ltd.
- Wei-Chung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless packaging substrate and fabrication method thereof
- Patent number 9,510,463
- Issue date Nov 29, 2016
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication method thereof
- Patent number 9,490,225
- Issue date Nov 8, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Chung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with transportable edge ring for substrate...
- Patent number 9,425,077
- Issue date Aug 23, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chang Hsieh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fabrication method of semiconductor package
- Patent number 9,112,063
- Issue date Aug 18, 2015
- Siliconware Precision Industries Co., Ltd.
- Wei Chung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 8,796,867
- Issue date Aug 5, 2014
- Siliconware Precision Industries Co., Ltd.
- Wei Chung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHODS FOR HANDLING DIE CARRIERS
- Publication number 20230298919
- Publication date Sep 21, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tsung-Sheng KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR HANDLING DIE CARRIERS
- Publication number 20220319890
- Publication date Oct 6, 2022
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tsung-Sheng KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR HANDLING DIE CARRIERS
- Publication number 20200058534
- Publication date Feb 20, 2020
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tsung-Sheng KUO
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
DCPD-DERIVED POLYETHER AND METHOD OF PRODUCING THE SAME
- Publication number 20190048137
- Publication date Feb 14, 2019
- NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- WEN-CHIUNG SU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE WITH AN EMBEDDED ELECTRONIC...
- Publication number 20170352615
- Publication date Dec 7, 2017
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-LAYER WIRING PACKAGE SUBSTRATE, SINGLE-LAYER WIRING PACKAGE...
- Publication number 20170309537
- Publication date Oct 26, 2017
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF PACKAGE STRUCTURE
- Publication number 20170301658
- Publication date Oct 19, 2017
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20170287840
- Publication date Oct 5, 2017
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING PACKAGE STRUCTURE
- Publication number 20170162494
- Publication date Jun 8, 2017
- Siliconware Precision Industries Co., Ltd.
- Wei-Chung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF CORELESS PACKAGING SUBSTRATE
- Publication number 20170047240
- Publication date Feb 16, 2017
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS WITH TRANSPORTABLE EDGE RING FOR SUBSTRATE...
- Publication number 20160284584
- Publication date Sep 29, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsieh Chih-Chang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SINGLE-LAYER WIRING PACKAGE SUBSTRATE, SINGLE-LAYER WIRING PACKAGE...
- Publication number 20160163621
- Publication date Jun 9, 2016
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160133551
- Publication date May 12, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Chung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH AN EMBEDDED ELECTRONIC COMPONENT AND METHOD...
- Publication number 20160079151
- Publication date Mar 17, 2016
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20160079170
- Publication date Mar 17, 2016
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF
- Publication number 20160021743
- Publication date Jan 21, 2016
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160013123
- Publication date Jan 14, 2016
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20150348929
- Publication date Dec 3, 2015
- Siliconware Precision Industries Co., Ltd.
- Wei-Chung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR FABRICATING THE SAME
- Publication number 20150333029
- Publication date Nov 19, 2015
- Siliconware Precision Industries Co., Ltd.
- Yu-cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A PACKAGING SUBSTRATE
- Publication number 20150303073
- Publication date Oct 22, 2015
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20150287671
- Publication date Oct 8, 2015
- Siliconware Precision Industries Co., Ltd.
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20150102484
- Publication date Apr 16, 2015
- Siliconware Precision Industries Co., Ltd.
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20150028485
- Publication date Jan 29, 2015
- Siliconware Precision Industries Co., Ltd.
- Liang-Yi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20140308780
- Publication date Oct 16, 2014
- Wei Chung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS WITH TRANSPORTABLE EDGE RING FOR SUBSTRATE...
- Publication number 20140273505
- Publication date Sep 18, 2014
- Chih-Chang HSIEH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FABRICATING A PACKAGING SUBSTRATE
- Publication number 20140057410
- Publication date Feb 27, 2014
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20130307152
- Publication date Nov 21, 2013
- Wei Chung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20130228921
- Publication date Sep 5, 2013
- Siliconware Precision Industries Co., Ltd.
- Liang-Yi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20130026657
- Publication date Jan 31, 2013
- Siliconware Precision Industries Co., Ltd.
- Wei-Chung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS

Wei-Chung Hsiao

Person

Patents Grantslast 30 patents

Apparatus and methods for handling die carriers

Apparatus and methods for handling die carriers

DCPD-derived polyether and method of producing the same

Method of fabricating semiconductor package structure

Method for fabricating package structure

Method of fabricating a packaging substrate including a carrier hav...

Single-layer wiring package substrate, single-layer wiring package...

Semiconductor package structure and method of fabricating the same

Method of fabricating package structure with an embedded electronic...

Fabrication method of coreless packaging substrate

Semiconductor apparatus with transportable edge ring for substrate...

Single-layer wiring package substrate, single-layer wiring package...

Package structure with an embedded electronic component and method...

Package structure having a laminated release layer and method for f...

Package structure and fabrication method thereof

Coreless packaging substrate and fabrication method thereof

Package structure and fabrication method thereof

Semiconductor apparatus with transportable edge ring for substrate...

Fabrication method of semiconductor package

Semiconductor package and fabrication method thereof

Patents Applicationslast 30 patents

APPARATUS AND METHODS FOR HANDLING DIE CARRIERS

APPARATUS AND METHODS FOR HANDLING DIE CARRIERS

APPARATUS AND METHODS FOR HANDLING DIE CARRIERS

DCPD-DERIVED POLYETHER AND METHOD OF PRODUCING THE SAME

METHOD OF FABRICATING PACKAGE STRUCTURE WITH AN EMBEDDED ELECTRONIC...

SINGLE-LAYER WIRING PACKAGE SUBSTRATE, SINGLE-LAYER WIRING PACKAGE...

FABRICATION METHOD OF PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

METHOD FOR FABRICATING PACKAGE STRUCTURE

FABRICATION METHOD OF CORELESS PACKAGING SUBSTRATE

SEMICONDUCTOR APPARATUS WITH TRANSPORTABLE EDGE RING FOR SUBSTRATE...

SINGLE-LAYER WIRING PACKAGE SUBSTRATE, SINGLE-LAYER WIRING PACKAGE...

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

PACKAGE STRUCTURE WITH AN EMBEDDED ELECTRONIC COMPONENT AND METHOD...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

CORELESS PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

PACKAGE SUBSTRATE AND METHOD FOR FABRICATING THE SAME

METHOD OF FABRICATING A PACKAGING SUBSTRATE

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE HAVING THE SAME

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR APPARATUS WITH TRANSPORTABLE EDGE RING FOR SUBSTRATE...

METHOD OF FABRICATING A PACKAGING SUBSTRATE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SUBSTRATE STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME