Wei Huang

Person

Plainsborough, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hybridization bumps for fine pitch sensor arrays
- Patent number 12,051,665
- Issue date Jul 30, 2024
- Sensors Unlimited, Inc.
- Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin mesa diodes with over-current protection
- Patent number 11,495,631
- Issue date Nov 8, 2022
- Sensors Unlimited, Inc.
- Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin diodes with over-current protection
- Patent number 11,251,210
- Issue date Feb 15, 2022
- Sensors Unlimited, Inc.
- Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low capacitance photo detectors
- Patent number 11,251,219
- Issue date Feb 15, 2022
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect bump structures for photo detectors
- Patent number 10,957,733
- Issue date Mar 23, 2021
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures for high density flip chip interconnection
- Patent number 10,879,204
- Issue date Dec 29, 2020
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect bump structures for photo detectors
- Patent number 10,727,267
- Issue date Jul 28, 2020
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures for high density flip chip interconnection
- Patent number 10,622,324
- Issue date Apr 14, 2020
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures for interconnecting focal plane arrays
- Patent number 10,566,371
- Issue date Feb 18, 2020
- Sensors Unlimited, Inc.
- Namwoong Paik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mesas and implants in two-dimensional arrays
- Patent number 10,468,437
- Issue date Nov 5, 2019
- Sensors Unlimited, Inc.
- Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures for interconnecting focal plane arrays
- Patent number 10,096,639
- Issue date Oct 9, 2018
- Sensors Unlimited, Inc.
- Namwoong Paik
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRIDIZATION BUMPS FOR FINE PITCH SENSOR ARRAYS
- Publication number 20230307398
- Publication date Sep 28, 2023
- Sensors Unlimited, Inc.
- Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODIODE STRUCTURES
- Publication number 20230299223
- Publication date Sep 21, 2023
- Sensors Unlimited, Inc.
- John Liobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW CAPACITANCE PHOTO DETECTORS
- Publication number 20210288100
- Publication date Sep 16, 2021
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN DIODES WITH OVER-CURRENT PROTECTION
- Publication number 20210249455
- Publication date Aug 12, 2021
- Sensors Unlimited, Inc.
- Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN MESA DIODES WITH OVER-CURRENT PROTECTION
- Publication number 20210249462
- Publication date Aug 12, 2021
- Sensors Unlimited, Inc.
- Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS
- Publication number 20200312900
- Publication date Oct 1, 2020
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURES FOR HIGH DENSITY FLIP CHIP INTERCONNECTION
- Publication number 20200227370
- Publication date Jul 16, 2020
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS
- Publication number 20200083272
- Publication date Mar 12, 2020
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MESAS AND IMPLANTS IN TWO-DIMENSIONAL ARRAYS
- Publication number 20190296058
- Publication date Sep 26, 2019
- Sensors Unlimited, Inc.
- Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURES FOR HIGH DENSITY FLIP CHIP INTERCONNECTION
- Publication number 20190244924
- Publication date Aug 8, 2019
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURES FOR INTERCONNECTING FOCAL PLANE ARRAYS
- Publication number 20190006409
- Publication date Jan 3, 2019
- Sensors Unlimited, Inc.
- Namwoong Paik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURES FOR INTERCONNECTING FOCAL PLANE ARRAYS
- Publication number 20180102391
- Publication date Apr 12, 2018
- Sensors Unlimited, Inc.
- Namwoong Paik
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Hybridization bumps for fine pitch sensor arrays

Pin mesa diodes with over-current protection

Pin diodes with over-current protection

Low capacitance photo detectors

Interconnect bump structures for photo detectors

Bump structures for high density flip chip interconnection

Interconnect bump structures for photo detectors

Bump structures for high density flip chip interconnection

Bump structures for interconnecting focal plane arrays

Mesas and implants in two-dimensional arrays

Bump structures for interconnecting focal plane arrays

Patents Applicationslast 30 patents

HYBRIDIZATION BUMPS FOR FINE PITCH SENSOR ARRAYS

PHOTODIODE STRUCTURES

LOW CAPACITANCE PHOTO DETECTORS

PIN DIODES WITH OVER-CURRENT PROTECTION

PIN MESA DIODES WITH OVER-CURRENT PROTECTION

INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS

BUMP STRUCTURES FOR HIGH DENSITY FLIP CHIP INTERCONNECTION

INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS

MESAS AND IMPLANTS IN TWO-DIMENSIONAL ARRAYS

BUMP STRUCTURES FOR HIGH DENSITY FLIP CHIP INTERCONNECTION

BUMP STRUCTURES FOR INTERCONNECTING FOCAL PLANE ARRAYS

BUMP STRUCTURES FOR INTERCONNECTING FOCAL PLANE ARRAYS