Wei-Jhih Mao

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Wire-bond damper for shock absorption
- Patent number 12,358,783
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Lin Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 12,322,722
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite spring structure to reinforce mechanical robustness of a...
- Patent number 11,993,510
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wire-bond damper for shock absorption
- Patent number 11,987,494
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Lin Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 11,923,331
- Issue date Mar 5, 2024
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,661,333
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Jhih Mao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Composite spring structure to reinforce mechanical robustness of a...
- Patent number 11,420,866
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS integration with through-chip via process
- Patent number 11,235,969
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
STOPPER BUMP STRUCTURES FOR MEMS DEVICE
- Publication number 20240375939
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A...
- Publication number 20240270565
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240162183
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240021567
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE-BOND DAMPER FOR SHOCK ABSORPTION
- Publication number 20230382720
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Lin Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STOPPER BUMP STRUCTURES FOR MEMS DEVICE
- Publication number 20230257256
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A...
- Publication number 20220306454
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20220270999
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE-BOND DAMPER FOR SHOCK ABSORPTION
- Publication number 20220162058
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Lin Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220112074
- Publication date Apr 14, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-JHIH MAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A...
- Publication number 20210292157
- Publication date Sep 23, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS INTEGRATION WITH THROUGH-CHIP VIA PROCESS
- Publication number 20200131028
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Wei-Jhih Mao

Person

Patents Grantslast 30 patents

Wire-bond damper for shock absorption

Die attached leveling control by metal stopper bumps

Composite spring structure to reinforce mechanical robustness of a...

Wire-bond damper for shock absorption

Die attached leveling control by metal stopper bumps

Semiconductor structure and manufacturing method thereof

Composite spring structure to reinforce mechanical robustness of a...

CMOS-MEMS integration with through-chip via process

Patents Applicationslast 30 patents

STOPPER BUMP STRUCTURES FOR MEMS DEVICE

COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A...

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

WIRE-BOND DAMPER FOR SHOCK ABSORPTION

STOPPER BUMP STRUCTURES FOR MEMS DEVICE

COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A...

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

WIRE-BOND DAMPER FOR SHOCK ABSORPTION

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A...

CMOS-MEMS INTEGRATION WITH THROUGH-CHIP VIA PROCESS