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Wei-Kong SHENG
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Miaoli County, TW
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Patent Application
Package with Improved Heat Dissipation Efficiency and Method for Fo...
Publication number
20240162109
Publication date
May 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Hung-Yi Kuo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
COOLING INTERFACE REGION FOR A SEMICONDUCTOR DIE PACKAGE
Publication number
20240128149
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Chieh HSIEH
H01 - BASIC ELECTRIC ELEMENTS